PtSe2 grown directly on polymer foil for use as a robust piezoresistive sensor

Robust strain gauges are fabricated by growing PtSe2 layers directly on top of flexible polyimide foils. These PtSe2 layers are grown by low-temperature, thermally-assisted conversion of predeposited Pt layers. Under applied flexure the PtSe2 layers show a decrease in electrical resistance signifying a negative gauge factor. The influence of the growth temperature and film thickness on the electromechanical properties of the PtSe2 layers is investigated. The best-performing strain gauges fabricated have a superior gauge factor to that of commercial metal-based strain gauges. Notably, the strain gauges offer good cyclability and are very robust, surviving repeated peel tests and immersion in water. Furthermore, preliminary results indicate that the stain gauges also show potential for high-frequency operation. This host of advantageous properties, combined with the possibility of further optimization and channel patterning, indicate that PtSe2 grown directly on polyimide holds great promise for future applications

Spin-dependent transport properties of Fe3O4/MoS2/Fe3O4 junctions

Magnetite is a half-metal with a high Curie temperature of 858 K, making it a promising candidate for magnetic tunnel junctions (MTJs). Yet, initial efforts to exploit its half metallic nature in Fe3O4/ MgO/Fe3O4 MTJ structures have been far from promising. Finding suitable barrier layer materials, which keep the half metallic nature of Fe3O4 at the interface between Fe3O4 layers and barrier layer, is one of main challenges in this field. Two-dimensional (2D) materials may be good candidates for this purpose. Molybdenum disulfide (MoS2) is a transition metal dichalcogenide (TMD) semiconductor with distinctive electronic, optical, and catalytic properties. Here, we show based on the first principle calculations that Fe3O4 keeps a nearly fully spin polarized electron band at the interface between MoS2 and Fe3O4. We also present the first attempt to fabricate the Fe3O4/MoS2/Fe3O4 MTJs. A clear tunneling magnetoresistance (TMR) signal was observed below 200 K. Thus, our experimental and theoretical studies indicate that MoS2 can be a good barrier material for Fe3O4 based MTJs.Our calculations also indicate that junctions incorporating monolayer or bilayer MoS2 are metallic

Step bunching with both directions of the current: Vicinal W(110) surfaces versus atomistic scale model

We report for the first time the observation of bunching of monoatomic steps on vicinal W(110) surfaces induced by step up or step down currents across the steps. Measurements reveal that the size scaling exponent {\gamma}, connecting the maximal slope of a bunch with its height, differs depending on the current direction. We provide a numerical perspective by using an atomistic scale model with a conserved surface flux to mimic experimental conditions, and also for the first time show that there is an interval of parameters in which the vicinal surface is unstable against step bunching for both directions of the adatom drift.Comment: 17 pages, 10 figure

Quantum confinement-induced semimetal-to-semiconductor evolution in large-area ultra-thin PtSe2 films grown at 400 °C

In this work, we present a comprehensive theoretical and experimental study of quantum confinement in layered platinum diselenide (PtSe2) films as a function of film thickness. Our electrical measurements, in combination with density functional theory calculations, show distinct layer-dependent semimetal-to-semiconductor evolution in PtSe2 films, and highlight the importance of including van der Waals interactions, Green’s function calibration, and screened Coulomb interactions in the determination of the thickness-dependent PtSe2 energy gap. Large-area PtSe2 films of varying thickness (2.5–6.5 nm) were formed at 400 °C by thermally assisted conversion of ultra-thin platinum films on Si/SiO2 substrates. The PtSe2 films exhibit p-type semiconducting behavior with hole mobility values up to 13 cm2/V·s. Metal-oxide-semiconductor field-effect transistors have been fabricated using the grown PtSe2 films and a gate field-controlled switching performance with an ION/IOFF ratio of >230 has been measured at room temperature for a 2.5–3 nm PtSe2 film, while the ratio drops to <2 for 5–6.5 nm-thick PtSe2 films, consistent with a semiconducting-to-semimetallic transition with increasing PtSe2 film thickness. These experimental observations indicate that the low-temperature growth of semimetallic or semiconducting PtSe2 could be integrated into the back-end-of-line of a silicon complementary metal-oxide-semiconductor process

REVEALING ELECTROMIGRATION ON DIELECTRICS AND METALS THROUGH THE STEP-BUNCHING INSTABILITY

Electromigration, due to its technological and scientific significance, has been a subject of extensive studies for many years. We present evidence of electromigration in dielectric materials, namely C -plane sapphire, obtained from direct experimental observation of an atomic step-bunching instability driven by electromigration. We further expand upon our previously reported findings of electromigration induced step-bunching transformation of a metal surface. The only system where electromigration driven step bunching has been observed and comprehensively investigated is the low index surfaces of silicon. In this study we show that electromigration driven SB can be induced on a variety of crystallographic surfaces, including metals and insulating oxides, and may be more prevalent than previously thought. Electric fields were applied at high temperature to W(110) and A l 2 O 3 ( 0001 ) crystals whereupon their surface reordered to a morphology closely resembling that of Si(111) with atomic steps bunched by electromigration. This suggests that the mechanism of step bunching on the W(110), A l 2 O 3 ( 0001 ) , and Si(111) can be fundamentally the same. Annealing W(110) offcut in the [001] direction with an up-step current produced a morphology with the bunch edges composed of zigzag segments meeting at a right angle

Miniaturized spectrometer with intrinsic long-term image memory

Abstract Miniaturized spectrometers have great potential for use in portable optoelectronics and wearable sensors. However, current strategies for miniaturization rely on von Neumann architectures, which separate the spectral sensing, storage, and processing modules spatially, resulting in high energy consumption and limited processing speeds due to the storage-wall problem. Here, we present a miniaturized spectrometer that utilizes a single SnS2/ReSe2 van der Waals heterostructure, providing photodetection, spectrum reconstruction, spectral imaging, long-term image memory, and signal processing capabilities. Interface trap states are found to induce a gate-tunable and wavelength-dependent photogating effect and a non-volatile optoelectronic memory effect. Our approach achieves a footprint of 19 μm, a bandwidth from 400 to 800 nm, a spectral resolution of 5 nm, and a > 104 s long-term image memory. Our single-detector computational spectrometer represents a path beyond von Neumann architectures

Effects of annealing temperature and ambient on Metal/PtSe2 contact alloy formation

Forming gas annealing is a common process step used to improve the performance of devices based on transition-metal dichalcogenides (TMDs). Here, the impact of forming gas anneal is investigated for PtSe2-based devices. A range of annealing temperatures (150, 250, and 350 °C) were used both in inert (0/100% H2/N2) and forming gas (5/95% H2/N2) environments to separate the contribution of temperature and ambient. The samples are electrically characterized by circular transfer length method structures, from which contact resistance and sheet resistance are analyzed. Ti and Ni are used as metal contacts. Ti does not react with PtSe2 at any given annealing step. In contrast to this, Ni reacts with PtSe2, resulting in a contact alloy formation. The results are supported by a combination of X-ray photoelectron spectroscopy, Raman spectroscopy, energy-dispersive X-ray spectroscopy, and cross-sectional transmission electron microscopy. The work sheds light on the impact of forming gas annealing on TMD–metal interfaces, and on the TMD film itself, which could be of great interest to improve the contact resistance of TMD-based devices