Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the printing on substrates with rather porous, fibrous and rough surfaces (e.g., uncoated paper) contains new challenges. Especially in the case of inkjet-printing and other deposition techniques that require low-viscous nanoparticle inks the solvents and deposition materials might be absorbed, inhibiting the formation of homogeneous conductive layers. As part of this work, the sheet resistance of sintered inkjet-printed conductive silver (Ag-) nanoparticle cross structures on two different, commercially available, uncoated paper substrates using Van-der-Pauw’s method is evaluated. The results are compared to the conductivity of well-studied, white heat stabilised and treated PET foil. While the sheet resistance on PET substrate is highly reproducible and the variations are solely process-dependent, the sheet resistance on uncoated paper depends more on the substrate properties themselves. The results indicate that the achievable conductivity as well as the reproducibility decrease with increasing substrate porosity and fibrousness

Automatic Anomaly Detection on In-Production Manufacturing Machines Using Statistical Learning Methods

Anomaly detection is becoming increasingly important to enhance reliability and resiliency in the Industry 4.0 framework. In this work, we investigate different methods for anomaly detection on in-production manufacturing machines taking into account their variability, both in operation and in wear conditions. We demonstrate how the nature of the available data, featuring any anomaly or not, is of importance for the algorithmic choice, discussing both statistical machine learning methods and control charts. We finally develop methods for automatic anomaly detection, which obtain a recall close to one on our data. Our developed methods are designed not to rely on a continuous recalibration and hand-tuning by the machine user, thereby allowing their deployment in an in-production environment robustly and efficiently

Characterization of a Robust 3D- and Inkjet-Printed Capacitive Position Sensor for a Spectrometer Application

An inkjet- and 3D-printed capacitive sensor system with an all-digital and flexible sensor read-out hardware is reported. It enables spectrometer devices with significantly reduced device outlines and costs. The sensor is developed as multilayer inkjet-printed electrode structure on a 3D-printed copper housing. Very high required position resolutions of r e s p o s < 50 nm and a wide measurement range of r m = 1000 μ m at an offset of d 0 = 1000 μ m in the considered spectrometers motivate this work. The read-out hardware provides high sampling rates of up to r s ≈ 10 ns and enables the generation of trigger signals, i.e., the mirror control signal, without a time lag. The read-out circuitry is designed as a carrier frequency system, which enables flexible choices of bandwidth and measurement signal frequency. It thus allows for separation in frequency from coupling parasitics, i.e., other frequencies present in the device under test, and makes the read-out quasi-noise-immune

Non-Destructive Failure Detection and Visualization of Artificially and Naturally Aged PV Modules

Several series of six-cell photovoltaic test-modules—intact and with deliberately generated failures (micro-cracks, cell cracks, glass breakage and connection defects)—were artificially and naturally aged. They were exposed to various stress conditions (temperature, humidity and irradiation) in different climate chambers in order to identify (i) the stress-induced effects; (ii) the potential propagation of the failures and (iii) their influence on the performance. For comparison, one set of test-modules was also aged in an outdoor test site. All photovoltaic (PV) modules were thoroughly electrically characterized by electroluminescence and performance measurements before and after the accelerated ageing and the outdoor test. In addition, the formation of fluorescence effects in the encapsulation of the test modules in the course of the accelerated ageing tests was followed over time using UV-fluorescence imaging measurements. It was found that the performance of PV test modules with mechanical module failures was rather unaffected upon storage under various stress conditions. However, numerous micro-cracks led to a higher rate of degradation. The polymeric encapsulate of the PV modules showed the build-up of distinctive fluorescence effects with increasing lifetime as the encapsulant material degraded under the influence of climatic stress factors (mainly irradiation by sunlight and elevated temperature) by forming fluorophores. The induction period for the fluorescence effects of the polymeric encapsulant to be detectable was ~1 year of outdoor weathering (in middle Europe) and 300 h of artificial irradiation (with 1000 W/m2 artificial sunlight 300–2500 nm). In the presence of irradiation, oxygen—which permeated into the module through the polymeric backsheet—bleached the fluorescence of the encapsulant top layer between the cells, above cell cracks and micro-cracks. Thus, UV-F imaging is a perfect tool for on-site detection of module failures connected with a mechanical rupture of solar cells

Substantial diagnostic impact of blood culture independent molecular methods in bloodstream infections : Superior performance of PCR/ESI-MS

This study analyzed the performance of different molecular technologies along with blood culture (BC) in the diagnosis of bloodstream infections (BSI) in patients from internal medicine wards - including intensive care units (ICUs) - and the emergency room. Patients with systemic inflammatory response syndrome were prospectively included. BCs and EDTA whole blood were obtained simultaneously. The latter was analyzed by PCR combined with electrospray ionization mass spectrometry (PCR/ESI-MS; IRIDICA BAC BSI assay, Abbott) and by SeptiFast (Roche). Cases were classified as BSI according to adapted European Centre for Disease Prevention and Control criteria. Out of 462 analyzed episodes, 193 with valid test results fulfilled the inclusion criteria and were further evaluated. Sixty-nine (35.8%) were classified as BSI. PCR/ESI-MS showed a significantly better overall performance than BC (p=0.004) or SeptiFast (p=0.034). Only in patients from the ICU the performance of SeptiFast was comparable to that of PCR/ESI-MS. Mainly due to the negative effect of antimicrobial pre-treatment on BC results, the cumulative performance of each of the molecular tests with BC was significantly higher than that of BC alone (p<0.001). SeptiFast and in particular the broad-range pathogen detection system PCR/ESI-MS proved to be an essential addition to BC-based diagnostics in BSI.(VLID)472612

Comparison of output power for solar cells with standard and structured ribbons

The optical loss due to the busbar grid and soldered interconnector ribbons on a three busbar standard multicrystalline silicon solar cell’s front side is at 2.3%. One way to reduce this optical loss on cell level and in a photovoltaic (PV) module is to use deep structured ribbons as cell connectors. The standard soldered, flat ribbon is replaced with a glued, multiple structured ribbon. The investigation of shiny soldered flat ribbons and multiple structured ribbons in single-cell mini modules demonstrates the light angle dependency and the benefit for the structured alternative. Additional yield measurements for conventional photovoltaic modules with soldered flat and glued multiple structured ribbons technologies were studied under laboratory conditions as well as in outdoor measurements. The simulations and the experimental findings confirmed that the new structured ribbon design increases the short circuit current and the yield by about 2%

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages