9,480 research outputs found

    Supersonic aeroelastic instability results for a NASP-like wing model

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    An experimental study and an analytical study have been conducted to examine static divergence for hypersonic-vehicle wing models at supersonic conditions. A supersonic test in the Langley Unitary Plan Wind Tunnel facility was conducted for two wind-tunnel models. These models were nearly identical with the exception of airfoil shape. One model had a four-percent maximum thickness airfoil and the other model had an eight-percent maximum thickness airfoil. The wing models had low-aspect ratios and highly swept leading edges. The all-movable wing models were supported by a single-pivot mechanism along the wing root. For both of the wind-tunnel models, configuration changes could be made in the wing-pivot location along the wing root and in the wing-pivot pitch stiffness. Three divergence conditions were measured for the four-percent thick airfoil model in the Mach number range of 2.6 to 3.6 and one divergence condition was measured for the eight-percent thick airfoil model at a Mach number of 2.9. Analytical divergence calculations were made for comparison with experimental results and to evaluate the parametric effects of wing-pivot stiffness, wing-pivot location, and airfoil thickness variations. These analyses showed that decreasing airfoil thickness, moving the wing-pivot location upstream, or increasing the pitch-pivot stiffness have the beneficial effect of increasing the divergence dynamic pressures. The calculations predicted the trend of experimental divergence dynamic pressure with Mach number accurately; however, the calculations were approximately 25 percent conservative with respect to dynamic pressure

    Photonic realization of topologically protected bound states in domain-wall waveguide arrays

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    We present an analytical theory of topologically protected photonic states for the two-dimensional Maxwell equations for a class of continuous periodic dielectric structures, modulated by a domain wall. We further numerically confirm the applicability of this theory for three-dimensional structures.Comment: 6 pages, 5 figures. To appear in the Phys. Rev.

    Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver

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    This paper demonstrates a four-channel transceiver chip for medical ultrasonic imaging, interfacing to the capacitive micromachined ultrasonic transducers (CMUTs). The high-voltage transmitter (Tx) uses a three-level pulse-shaping technique with charge recycling to improve the power efficiency. The design requires minimum off-chip components and is scalable for more channels. The receiver is implemented with a transimpedance amplifier (TIA) topology and is optimized for tradeoffs between noise, bandwidth, and power dissipation. The test chip is characterized with both acoustic and electrical measurements. Comparing the three-level pulser against traditional two-level pulsers, the measured Tx efficiency shows 56%, 50%, and 43% more acoustic power delivery with the same total power dissipation at 2.5, 3.3, and 5.0 MHz, respectively. The CMUT receiver achieves the lowest noise efficiency factor compared with that of the literature (2.1 compared to a previously reported lowest of 3.6, in units of mPA ·√(mW/Hz). In addition, the transceiver chip is tested as a complete system for medical ultrasound imaging applications, in experiments including Tx beamformation, pulse-echo channel response characterization, and ultrasonic Doppler flow rate detection.Semiconductor Research Corporation. Focus Center for Circuit and System Solutions (C2S2
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