The presence of the analyst in Lacanian treatment

Transference implies the actualization of the analyst in the analytic encounter. Lacan developed this idea through the syntagm presence of the analyst. In the course of his seminars, however, two completely different presences emerge, with major implications for how the treatment is directed. In the light of Lacan's idea that the transference is constituted in Real, Symbolic, and Imaginary dimensions, it can be seen how in his early work the analyst's presence is a phenomenon at the crossroads between signifiers and images. From the 1960s onward, however, the analyst's presence comes to necessarily involve the Real. This means it points to the moment at which symbolization reaches its limits. The clinical implications of this later interpretation of the presence of the analyst as incorporating the Real are manifold and affect psychoanalytic practice with regard to the position and the interventions of the analyst. Specifically, interventions targeted at provoking changes in defenses against experiences of excess or senselessness are discussed and illustrated with case vignettes and a published case. With transference considered the navel of the treatment, the necessity that traumatic material will emerge in relation to the analyst becomes clear

Theoretical pluralism in psychoanalytic case studies

The aim of this study is to provide an overview of the scientific activity of different psychoanalytic schools of thought in terms of the content and production of case studies published on ISI Web of Knowledge. Between March 2013 and November 2013, we contacted all case study authors included in the online archive of psychoanalytic and psychodynamic case studies (www.singlecasearchive.com) to inquire about their psychoanalytic orientation during their work with the patient. The response rate for this study was 45%. It appears that the two oldest psychoanalytic schools, Object-relations psychoanalysis and Ego psychology or “Classical psychoanalysis” dominate the literature of published case studies. However, most authors stated that they feel attached to two or more psychoanalytic schools of thought. This confirms that the theoretical pluralism in psychoanalysis stretches to the field of single case studies. The single case studies of each psychoanalytic school are described separately in terms of methodology, patient, therapist, or treatment features. We conclude that published case studies features are fairly similar across different psychoanalytic schools. The results of this study are not representative of all psychoanalytic schools, as some do not publish their work in ISI ranked journals

High-density interconnect technology assessment of printed circuit boards for space applications

High-density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality of modern integrated circuits such as field-programmable gate arrays, digital signal processors and application processors. Increasing demands for functionality translate into higher signal speeds combined with an increasing number of input/outputs (I/Os). To limit the overall package size, the contact pad pitch of the components is reduced. The combination of a high number of I/Os with a reduced pitch places additional demands onto the PCB, requiring the use of laser-drilled microvias, high-aspect ratio core vias, and small track width and spacing. Although the associated advanced manufacturing processes have been widely used in commercial, automotive, medical, and military applications, reconciling these advancements in capability with the reliability requirements for space remains a challenge. Two categories of the HDI technology are considered: two levels of staggered microvias (basic HDI) and (up to) three levels of stacked microvias (complex HDI). In this article, the qualification of the basic HDI technology in accordance with ECSS-Q-ST-70-60C is described. At 1.0-mm pitch, the technology passes all testing successfully. At .8-mm pitch, failures are encountered during interconnection stress testing and conductive anodic filament testing. These failures provide the basis for updating the design rules for HDI PCBs