26 research outputs found
XPS studies of the ALD-growth of TaN diffusion barriers : Impact of the dielectric surface chemistry on the growth mechanism
International audienc
High Frequency Characterization and Modeling of High Density TSV in 3D Integrated Circuits
International audienc
"HF Performance Characterization and Prediction of 2D Redistribution Layer Interconnects in a 3D-Integrated Circuit Stack"
International audienc
Influence of 3D Integration on 2D Interconnections and 2D Self Inductors HF Properties
International audienc
" Influence des substrats de silicium sur les performances des inductances planaires 2D lors d'une intégration 3D ",
National audienc
Quality Factor and Frequency Bandwidth of 2D Self Inductors in 3D Integration Stack"
International audienc
“Quality Factor and Frequency Bandwidth of 2D Self Inductors in 3D Integration Stack”
International audienc
Integration and RF characterization of high density Through Silicon Vias for 3D chip stacking
International audienc
Caractérisation en hyperfréquences et modélisation de Vias Traversant le Silicium pour l'intégration de puces tridimensionnelles
National audienc
Frequency and Time Domain Characterization of Substrate Coupling Effects in 3D Integration Stack
International audienc