40 research outputs found

    The CMS Silicon Strip Tracker: System Tests and Test Beam Results

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    With a total area of 210 squaremeters and about 15000 single silicon modules the silicon strip tracker of the CMS experiment at the LHC will be the largest silicon strip detector ever built. While the performance of the individual mechanical and electronic components has already been tested extensively, their interplay in larger integrated substructures also has to be studied before mass production can be launched, in order to ensure the envisaged performance of the overall system. This is the main purpose of the system tests, during which hardware components as final as possible are being integrated into substructures of the tracker subsystems. System tests are currently being carried out for all subsystems of the tracker. In addition, silicon modules and electronic components have been operated and studied in a particle beam environment. In this report results from the CMS silicon tracker system tests and a test beam experiment at CERN are presented.Comment: 5 pages; presented at the 8th ICATPP Conference, Como, Italy, October 6-10, 2003; to be published by World Scientifi

    Evaluation of Planar Silicon Pixel Sensors with the RD53A Readout Chip for the Phase-2 Upgrade of the CMS Inner Tracker

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    The Large Hadron Collider (LHC) at CERN will undergo an upgrade in order to increase its luminosity to 7.5×10347.5 \times 10^{34} cm2^{-2}s1^{-1}. The increased luminosity during this High-Luminosity running phase (HL-LHC), starting around 2029, means a higher rate of proton-proton interactions, hence a larger ionizing dose and particle fluence for the detectors. The current tracking system of the CMS experiment will be fully replaced in order to cope with the new operating conditions. Prototype planar pixel sensors for the CMS Inner Tracker with square 50μ50 \mu m ×  50μ \times \; 50 \mum and rectangular 100μ100 \mu m ×  25μ \times \; 25 \mum pixels read out by the RD53A chip were characterized in the lab and at the DESY-II testbeam facility in order to identify designs that meet the requirements of CMS at the HL-LHC. A spatial resolution of approximately 3.4μ\mum (2μ\mum) is obtained using the modules with 50μ50 \mu m ×  50μ \times \; 50 \mum (100μ100 \mu m ×  25μ \times \; 25 \mum) pixels at the optimal angle of incidence before irradiation. After irradiation to a 1 MeV neutron equivalent fluence of Φeq=5.3×1015\Phi_{\rm eq} = 5.3 \times 10^{15} cm2^{-2}, a resolution of 9.4μ\mum is achieved at a bias voltage of 800 V using a module with 50μ50 \mu m ×  50μ \times \; 50 \mum pixel size. All modules retain a hit efficiency in excess of 99\% after irradiation to fluences up to 2.1×10162.1 \times 10^{16} cm2^{-2}. Further studies of the electrical properties of the modules, especially crosstalk, are also presented in this paper

    Evaluation of HPK n+n^+-pp planar pixel sensors for the CMS Phase-2 upgrade

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    To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5×10347.5\times 10^{34} cm2^{-2}s1^{-1} in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionizing energy loss of up to Φeq=3.5×1016\Phi_{\text{eq}} = 3.5\times 10^{16} cm2^{-2} . This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq=1.4×1016\Phi_{\text{eq}} = 1.4\times 10^{16} cm2^{-2}. For the development of appropriate planar pixel sensors an R\&D program was initiated, which includes n+n^+-pp sensors on 150 mm (6'') wafers with an active thickness of 150 μm\mu m with pixel sizes of 100×25100\times 25 μm2\mu m^2 and 50×5050\times 50 μm2\mu m^2 manufactured by Hamamatsu. Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×5050\times 50 μm2\mu m^2 pixels is measured as 4.0 μm\mu m for non-irradiated samples, and 6.3 μm\mu m after irradiation to Φeq=7.2×1015\Phi_{\text{eq}} = 7.2\times 10^{15} cm2^{-2}

    The CMS Phase-1 Pixel Detector Upgrade

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    The CMS detector at the CERN LHC features a silicon pixel detector as its innermost subdetector. The original CMS pixel detector has been replaced with an upgraded pixel system (CMS Phase-1 pixel detector) in the extended year-end technical stop of the LHC in 2016/2017. The upgraded CMS pixel detector is designed to cope with the higher instantaneous luminosities that have been achieved by the LHC after the upgrades to the accelerator during the first long shutdown in 2013-2014. Compared to the original pixel detector, the upgraded detector has a better tracking performance and lower mass with four barrel layers and three endcap disks on each side to provide hit coverage up to an absolute value of pseudorapidity of 2.5. This paper describes the design and construction of the CMS Phase-1 pixel detector as well as its performance from commissioning to early operation in collision data-taking

    Comparative evaluation of analogue front-end designs for the CMS Inner Tracker at the High Luminosity LHC

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    Publisher Copyright: © 2021 CERN for the benefit of the CMS collaboration..The CMS Inner Tracker, made of silicon pixel modules, will be entirely replaced prior to the start of the High Luminosity LHC period. One of the crucial components of the new Inner Tracker system is the readout chip, being developed by the RD53 Collaboration, and in particular its analogue front-end, which receives the signal from the sensor and digitizes it. Three different analogue front-ends (Synchronous, Linear, and Differential) were designed and implemented in the RD53A demonstrator chip. A dedicated evaluation program was carried out to select the most suitable design to build a radiation tolerant pixel detector able to sustain high particle rates with high efficiency and a small fraction of spurious pixel hits. The test results showed that all three analogue front-ends presented strong points, but also limitations. The Differential front-end demonstrated very low noise, but the threshold tuning became problematic after irradiation. Moreover, a saturation in the preamplifier feedback loop affected the return of the signal to baseline and thus increased the dead time. The Synchronous front-end showed very good timing performance, but also higher noise. For the Linear front-end all of the parameters were within specification, although this design had the largest time walk. This limitation was addressed and mitigated in an improved design. The analysis of the advantages and disadvantages of the three front-ends in the context of the CMS Inner Tracker operation requirements led to the selection of the improved design Linear front-end for integration in the final CMS readout chip.Peer reviewe

    Selection of the silicon sensor thickness for the Phase-2 upgrade of the CMS Outer Tracker

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    Publisher Copyright: © 2021 CERN.During the operation of the CMS experiment at the High-Luminosity LHC the silicon sensors of the Phase-2 Outer Tracker will be exposed to radiation levels that could potentially deteriorate their performance. Previous studies had determined that planar float zone silicon with n-doped strips on a p-doped substrate was preferred over p-doped strips on an n-doped substrate. The last step in evaluating the optimal design for the mass production of about 200 m2 of silicon sensors was to compare sensors of baseline thickness (about 300 μm) to thinned sensors (about 240 μm), which promised several benefits at high radiation levels because of the higher electric fields at the same bias voltage. This study provides a direct comparison of these two thicknesses in terms of sensor characteristics as well as charge collection and hit efficiency for fluences up to 1.5 × 1015 neq/cm2. The measurement results demonstrate that sensors with about 300 μm thickness will ensure excellent tracking performance even at the highest considered fluence levels expected for the Phase-2 Outer Tracker.Peer reviewe

    ATLAS silicon module assembly and qualification tests at IFIC Valencia

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    ATLAS experiment, designed to probe the interactions of particles emerging out of proton proton collisions at energies of up to 14 TeV, will assume operation at the Large Hadron Collider (LHC) at CERN in 2007. This paper discusses the assembly and the quality control tests of forward detector modules for the ATLAS silicon microstrip detector assembled at the Instituto de Fisica Corpuscular (IFIC) in Valencia. The construction and testing procedures are outlined and the laboratory equipment is briefly described. Emphasis is given on the module quality achieved in terms of mechanical and electrical stability.Comment: 23 pages, 38 EPS figures, uses JINST LaTeX clas

    Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade

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    The Short Strip ASIC (SSA) is one of the four front-end chips designed for the upgrade of the CMS Outer Tracker for the High Luminosity LHC. Together with the Macro-Pixel ASIC (MPA) it will instrument modules containing a strip and a macro-pixel sensor stacked on top of each other. The SSA provides both full readout of the strip hit information when triggered, and, together with the MPA, correlated clusters called stubs from the two sensors for use by the CMS Level-1 (L1) trigger system. Results from the first prototype module consisting of a sensor and two SSA chips are presented. The prototype module has been characterized at the Fermilab Test Beam Facility using a 120 GeV proton beam.Peer reviewe

    Test beam performance of a CBC3-based mini-module for the Phase-2 CMS Outer Tracker before and after neutron irradiation

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    CMS Tracker collaboration: et al.The Large Hadron Collider (LHC) at CERN will undergo major upgrades to increase the instantaneous luminosity up to 5–7.5×1034 cm-2s-1. This High Luminosity upgrade of the LHC (HL-LHC) will deliver a total of 3000–4000 fb-1 of proton-proton collisions at a center-of-mass energy of 13–14 TeV. To cope with these challenging environmental conditions, the strip tracker of the CMS experiment will be upgraded using modules with two closely-spaced silicon sensors to provide information to include tracking in the Level-1 trigger selection. This paper describes the performance, in a test beam experiment, of the first prototype module based on the final version of the CMS Binary Chip front-end ASIC before and after the module was irradiated with neutrons. Results demonstrate that the prototype module satisfies the requirements, providing efficient tracking information, after being irradiated with a total fluence comparable to the one expected through the lifetime of the experiment.The tracker groups gratefully acknowledge financial support from the following funding agencies: BMWFW and FWF (Austria); FNRS and FWO (Belgium); CERN; MSE and CSF (Croatia); Academy of Finland, MEC, and HIP (Finland); CEA and CNRS/IN2P3 (France); BMBF, DFG, and HGF (Germany); GSRT (Greece); NKFIA K124850, and Bolyai Fellowship of the Hungarian Academy of Sciences (Hungary); DAE and DST (India); INFN (Italy); PAEC (Pakistan); SEIDI, CPAN, PCTI and FEDER (Spain); Swiss Funding Agencies (Switzerland); MST (Taipei); STFC (United Kingdom); DOE and NSF (U.S.A.). This project has received funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement No 884104 (PSI-FELLOW-III-3i). Individuals have received support from HFRI (Greece). This document was prepared using the resources of the Fermi National Accelerator Laboratory (Fermilab), a U.S. Department of Energy, Office of Science, HEP User Facility. Fermilab is managed by Fermi Research Alliance, LLC (FRA), acting under Contract No. DE-AC02-07CH11359.Peer reviewe
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