Picosecond Mode-Locking And X-Band Modulation Of Semiconductor Lasers

Recent developments in two areas of high speed semiconductor lasers will be addressed: (1) passive mode-locking of a segmented-contact semiconductor laser with a reliable, controllable saturable absorber which produces stable picosecond optical pulses, and (2) realization of very high frequency (X-band) direct analog modulation of a semiconductor laser diode

The intrinsic electrical equivalent circuit of a laser diode

The basic electrical equivalent circuit of a laser diode is derived. The effects of spontaneous emission and self-pulsations are included. It is found that self-pulsations are represented by a negative resistance in the model. Application of this model suggests purely electronic methods of suppressing relaxation oscillations in laser diodes

InGaAsP/InP undercut mesa laser with planar polyimide passivation

An undercut mesa laser is fabricated on an n + -InP substrate using a single step liquid phase epitaxy growth process and a planar structure is obtained by using a polyimide filling layer. The lasers operate at fundamental transverse mode due to a scattering loss mechanism. Threshold currents of 18 mA and stable single transverse mode operating at high currents are obtained

Time-Multiplexed Measurements of Nonclassical Light at Telecom Wavelengths

We report the experimental reconstruction of the statistical properties of an ultrafast pulsed type-II parametric down conversion source in a periodically poled KTP waveguide at telecom wavelengths, with almost perfect photon-number correlations. We used a photon-number-resolving time-multiplexed detector based on a fiber-optical setup and a pair of avalanche photodiodes. By resorting to a germane data-pattern tomography, we assess the properties of the nonclassical light states states with unprecedented precision.Comment: 4.5 pages, 5 color figues. Comments welcome

Transient Heat Partition Factor for a Sliding Railcar Wheel

During a wheel slide the frictional heat generated at the contact interface causes intense heating of the adjacent wheel material. If this material exceeds the austenitising temperature and then cools quickly enough, it can transform into martensite, which may ultimately crack and cause wheel failure. A knowledge of the distribution of the heat partitioned into the wheel and the rail and the resulting temperature fields is critical to developing designs to minimize these deleterious effects. A number of theoretical solutions have appeared in the literature to model the thermal aspects of this phenomenon. The objective of this investigation was to examine the limitations of these solutions by comparing them to the results of a finite element analysis that does not incorporate many of the simplifying assumptions on which these solutions are based. It was found that these simplified solutions can produce unrealistic results under some circumstances