Comparative Study of Phenomenology and Sankhya

Phenomenology, as propounded by Edmond Husserl, is an important movements in the modern western philosophy, while sÅÙkhya and its application yoga are the ancient Indian philosophical disciplines or dar±ana. This is a comparative study of phenomenology with sÅÙkhya and yoga. As per my present understanding this project is now completed. I have organized the outcome of my study in the following four papers preceded by prolegomena: Prolegomena to the comparative study of Phenomenology and SaÙkhya 1, Consciousness in Phenomenology and SÅÙkhya 2. ‘Nature’ (ontology) in Phenomenology and SÅÙkhya 3. Structures (cosmology) in Phenomenology and SÅÙkhya 4. ‘Terminal Transcendental Teleological Cause’ in Phenomenology and SÅÙkhya The parallelism between the philosophical disciplines, so far removed historically, geographically and culturally from each other, which this study brought out, was not only fascinating but also extensive. Certain differences also have been critically brought out. Viewing phenomenology through the grid of sÅÙkhya, I found, elucidates phenomenology. In being viewed from the perspective of a philosophical school, as modern as that of phenomenology, the ancient Indian disciplines also stand to benefit. The comparative study can hope to introduce sÅÙkhya to those acquainted with phenomenology and vice versa. This presentation is an attempt to share the flavor of my findings

Investigation of oxide thin films deposited by atomic layer deposition as dopant source for ultra-shallow doping of silicon

Atomic layer deposition of solid dopant sources for silicon was carried out by using triethylantimony and ozone, and tris-(dimethylamido)borane and ozone as precursors for antimony or boron containing oxides, respectively. It was proved that homogenous antimony oxide deposition could be achieved on flat silicon wafers and in trench structures. Little growth was found below 100 °C deposition temperature and linear temperature dependence on the growth rate between 100 and 250 °C. The oxide films were not stable above 750 °C and therefore failed to act as dopant source for silicon so far. Boron containing films were only obtained at a deposition temperature of 50 °C. These films were highly instable after exposure to air but degradation could be delayed by thin films of antimony oxide or aluminium oxide that were in situ grown by ALD as well. Only little boron was found by ex-situ chemical analysis. However, rapid thermal annealing of such boron containing dopant source layers resulted in high concentrations of active boron close to the silicon surface. The dependence of the doping results on the thickness of the initial boron containing films could be shown

Application of atomic layer deposited dopant sources for ultra‐shallow doping of silicon

The advanced silicon semiconductor technology requires doping methods for production of ultra‐shallow junctions with sufficiently low sheet resistance. Furthermore, advanced 3‐dimensional topologies may require controlled local doping that cannot be achieved by ionimplantation. Here, the application of the atomic layer deposition (ALD) method for pre‐deposition of dopant sources is presented. Antimony oxide and boron oxide were investigated for such application. Ozone‐based ALD was carried out on silicon wafers by using triethylantimony or tris‐(dimethylamido)borane. Very homogeneous Sb2O5 deposition could be achieved on flat silicon wafers and in trench structures. The thermal stability of antimony oxide layers was investigated by rapid thermal annealing experiments. The layers were not stable above 750 °C. Therefore, this material failed to act as dopant source so far. In contrast, ultra‐shallow boron doping of silicon from ALD grown boron oxide films was successful. However, pure B2O3 films were highly unstable after exposure to ambient air. The boron oxide films could be protected by thin Sb2O5 or Al2O3 films that were in‐situ grown by ALD. Low temperature ALD of Al2O3 at 50 °C from trimethylaluminium (TMA) and ozone was investigated in detail with respect of its protective effect on boron oxide. Interestingly, it was observed that already one ALD cycle of TMA and O3 resulted in significant increase in stability of the boron oxide in air

High temperature reactive ion etching of iridium thin films with aluminum mask in CF4/O2/Ar plasma

Reactive ion etching (RIE) technology for iridium with CF4/O2/Ar gas mixtures and aluminum mask at high temperatures up to 350 °C was developed. The influence of various process parameters such as gas mixing ratio and substrate temperature on the etch rate was studied in order to find optimal process conditions. The surface of the samples after etching was found to be clean under SEM inspection. It was also shown that the etch rate of iridium could be enhanced at higher process temperature and, at the same time, very high etching selectivity between aluminum etching mask and iridium could be achieved

Ag films grown by remote plasma enhanced atomic layer deposition on different substrates

Plasma-assisted atomic layer deposition (PALD) was carried for growing thin boron oxide films onto silicon aiming at the formation of dopant sources for shallow boron doping of silicon by rapid thermal annealing (RTA). A remote capacitively coupled plasma source powered by GaN microwave oscillators was used for generating oxygen plasma in the PALD process with tris(dimethylamido)borane as boron containing precursor. ALD type growth was obtained; growth per cycle was highest with 0.13 nm at room temperature and decreased with higher temperature. The as-deposited films were highly unstable in ambient air and could be protected by capping with in-situ PALD grown antimony oxide films. After 16 weeks of storage in air, degradation of the film stack was observed in an electron microscope. The instability of the boron oxide, caused by moisture uptake, suggests the application of this film for testing moisture barrier properties of capping materials particularly for those grown by ALD. Boron doping of silicon was demonstrated using the uncapped PALD B2O3 films for RTA processes without exposing them to air. The boron concentration in the silicon could be varied depending on the source layer thickness for very thin films, which favors the application of ALD for semiconductor doping processesInvestment Bank Berlin and EFR

Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon

Plasma-assisted atomic layer deposition (PALD) was carried for growing thin boron oxide films onto silicon aiming at the formation of dopant sources for shallow boron doping of silicon by rapid thermal annealing (RTA). A remote capacitively coupled plasma source powered by GaN microwave oscillators was used for generating oxygen plasma in the PALD process with tris(dimethylamido)borane as boron containing precursor. ALD type growth was obtained; growth per cycle was highest with 0.13 nm at room temperature and decreased with higher temperature. The as-deposited films were highly unstable in ambient air and could be protected by capping with in-situ PALD grown antimony oxide films. After 16 weeks of storage in air, degradation of the film stack was observed in an electron microscope. The instability of the boron oxide, caused by moisture uptake, suggests the application of this film for testing moisture barrier properties of capping materials particularly for those grown by ALD. Boron doping of silicon was demonstrated using the uncapped PALD B2O3 films for RTA processes without exposing them to air. The boron concentration in the silicon could be varied depending on the source layer thickness for very thin films, which favors the application of ALD for semiconductor doping processes.Investment Bank Berlin and EFR