A Novel Instrument for the In-Situ Measurement of the Stress in Thin Films

No abstract availabl

A Magnetron Sputter Deposition System for the Development of Multilayer X-Ray Optics

The proposal objective is to establish the capability to deposit multilayer structures for x-ray, neutron, and EUV optic applications through the development of a magnetron sputtering deposition system. A specific goal of this endeavor is to combine multilayer deposition technology with the replication process in order to enhance the MSFC's position as a world leader in the design of innovative X-ray instrumentation through the development of full shell replicated multilayer optics. The development of multilayer structures is absolutely necessary in order to advance the field of X-ray astronomy by pushing the limit for observing the universe to ever increasing photon energies (i. e. up to 200 keV or higher); well beyond Chandra (approx. 10 keV) and NuStar's (approx. 75 keV) capability. The addition of multilayer technology would significantly enhance the X-ray optics capability at MSFC and allow NASA to maintain its world leadership position in the development, fabrication and design of innovative X-ray instrumentation which would be the first of its kind by combining multilayer technology with the mirror replication process. This marriage of these technologies would allow astronomers to see the universe in a new light by pushing to higher energies that are out of reach with today's instruments.To this aim, a magnetron vacum sputter deposition system for the deposition of novel multilayer thin film X-ray optics is proposed. A significant secondary use of the vacuum deposition system includes the capability to fabricate multilayers for applications in the field of EUV optics for solar physics, neutron optics, and X-ray optics for a broad range of applications including medical imaging

A Novel Instrument and Methodology for the In-Situ Measurement of the Stress in Thin Films

We introduce a novel methodology for the in-situ measurement of mechanical stress during thin film growth utilizing a highly sensitive non-contact variation of the classic spherometer. By exploiting the known spherical deformation of the substrate the value of the stress induced curvature is inferred by measurement of only one point on the substrate's surface-the sagittal. From the known curvature the stress can be calculated using the well-known Stoney equation. Based on this methodology, a stress sensor has been designed which is simple, highly sensitive, compact, and low cost. As a result of its compact nature, the sensor can be mounted in any orientation to accommodate a given deposition geometry without the need for extensive modification to an already existing deposition system. The technique employs the use of a double side polished substrate that offers good specular reflectivity and is isotropic in its mechanical properties, such as oriented crystalline silicon or amorphous soda lime glass, for example. The measurement of the displacement of the uncoated side during deposition is performed with a high resolution (i.e. 5nm), commercially available, inexpensive, fiber optic sensor which can be used in both high vacuum and high temperature environments (i.e. 10(exp-7) Torr and 480oC, respectively). A key attribute of this instrument lies in its potential to achieve sensitivity that rivals other measurement techniques such as the micro cantilever method but, due to the comparatively larger substrate area, offers a more robust and practical alternative for subsequent measurement of additional characteristics of the film that can might be correlated to film stress. We present measurement results of nickel films deposited by magnetron sputtering which show good qualitative agreement to the know behavior of polycrystalline films previously reported by Hoffman

Design and Implementation of an X-Ray Reflectometer System for Testing X-ray Optic Coatings

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Techniques for Achieving Zero Stress in Thin Films of Iridium, Chromium, and Nickel

We examine techniques for achieving zero intrinsic stress in thin films of iridium, chromium, and nickel deposited by magnetron sputter deposition. The intrinsic stress is further correlated to the microstructural features and physical properties such as surface roughness and optical density at a scale appropriate to soft X-ray wavelengths. The examination of the stress in these materials is motivated by efforts to advance the optical performance of light-weight X-ray space telescopes into the regime of sub-arcsecond resolution through various deposition techniques that rely on control of the film stress to values within 10-100 MPa. A characteristic feature of the intrinsic stress behavior in chromium and nickel is their sensitivity to the magnitude and sign of the intrinsic stress with argon gas pressure and deposition rate, including the existence of a critical argon process pressure that results in zero film stress which scales linearly with the atomic mass of the sputtered species. While the effect of stress reversal with argon pressure has been previously reported by Hoffman and others for nickel and chromium, we report this effect for iridium. In addition to stress reversal, we identify zero stress in the optical functioning iridium layer shortly after island coalescence for low process pressures at a film thickness of approximately 35nm. The measurement of the low values of stress during deposition was achieved with the aid of a sensitive in-situ instrument capable of a minimum detectable level of stress, assuming a 35nm thick film, in the range of 0.40-6.0 MPa for oriented crystalline silicon substrate thicknesses of 70-280 microns, respectively

Relationships between central corneal thickness and optic disc topography in eyes with glaucoma, suspicion of glaucoma, or ocular hypertension

Pinakin Gunvant1, Lucia Porsia2, Russell J Watkins3, Henrietta Bayliss-Brown2, David C Broadway21Department of Research, Southern College of Optometry, Memphis, TN, USA; 2Department of Ophthalmology, Norfolk and Norwich University Hospital NHS Trust, Norwich, UK; 3Department of Pathology, Algernon Firth Buildings, Leeds General Infirmary, Leeds, UKPurpose: To identify relationships between central corneal thickness (CCT) and optic disc topography, as determined by scanning laser ophthalmoscopy (SLO), for patients seen in a specialist glaucoma service.Methods: 272 eyes of 144 patients with primary open angle glaucoma (POAG; n = 71), normal tension glaucoma (NTG; n = 50), ocular hypertension (OH; n = 48) and those considered to be suspicious for glaucoma (GS; n = 103) underwent ultrasonic pachymetry and optic disc topography by SLO. Correlations between CCT and SLO parameter values were identified. A Bonferroni correction for multiple comparisons was performed and a p value of 0.0042 was considered significant.Results: Mean CCT values were 533 μm (POAG), 530 μm (NTG), 550 μm (GS), and 565 μm (OH). As a group the GS and OH eyes had signifi cantly thicker CCT values than eyes with POAG. In addition, the NTG eyes had signifi cantly thinner CCT values than GS and OH eyes. Overall multiple SLO parameters correlated with CCT even after accounting for co-variance with age, refraction and inclusion of both eyes. Sub-group analysis indicated that ‘optic disc rim area’ positively correlated with CCT (r = 0.378) and ‘cup to disc area ratio’ negatively correlated with CCT (r = −0.370) in the POAG group. In the GS group the parameter ‘area below reference’ (a measure of cup volume) and ‘mean cup depth’ had negative correlations with CCT (r = −0.297 and −0.323) indicating that eyes with thinner than average corneal thickness measurements had larger and deeper cups.Conclusion: Thinner corneas appear to be associated with larger and deeper optic disc cups in the eyes of patients seen in a specialist glaucoma service.Keywords: central corneal thickness, optic disc topography, optic disc compliance, glaucom

X-ray reflectivity and mechanical stress in W/Si multilayers deposited on thin substrates of glass, epoxy-replicated aluminum foil, and Si wafer

Reflectivity at λ = 0.154 nm and mechanical stress in the bulk thin films of tungsten and silicon and single d- spacing multilayers on their basis with d approximately equals 2.8 nm deposited by the magnetron sputtering technique on flat thin substrates of Si wafer (~ 0.2 mm), glass (~ 0.3 mm), and epoxy gold replicated aluminum foil (~ 0.3 mm) have been studied. The interfacial roughness of the multilayers has been calculated from the x- ray reflectivity curves as the following: on Si wafer σ ≃ 0.31 nm, on glass σ ≃ 0.32 nm, and on foil σ ≃ 0.34 nm. There was not observed a significant dependence on the stress in the Si film with change in rf power, Ar gas pressure and biasing. For the W films an increase of dc power results in an increase of stress. A similar relationship is also evident for W films deposited by rf power, but this dependence is less pronounced. The influence of low temperature (up to 200 °C) annealing on x-ray reflectivity and stress in the multilayers has been investigated. There was not found an appreciable changes in the absolute value of reflectivity or in d-spacing with annealing temperature. The stress in the coatings changes with annealing temperature from compressive to tensile. There was observed a temperature of annealing at which the stress is no longer present in the film. The absolute value of this temperature measured for W/Si multilayer is approximately 120 °C