Pixel detector hybridisation with Anisotropic Conductive Films

Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such interconnect technologies need to be suitable for the assembly of single-dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. This contribution presents recent results of a newly developed in-house single-die interconnection process based on Anisotropic Conductive Film (ACF). The ACF interconnect technology replaces the solder bumps with conductive particles embedded in an adhesive film. The electro-mechanical connection between the sensor and the read-out chip is achieved via thermo-compression of the ACF using a flip-chip device bonder. A specific pad topology is required to enable the connection via conductive particles and create cavities into which excess epoxy can flow. This pixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG) plating process that is also under development within the project. The ENIG and ACF processes are qualified with the Timepix3 ASIC and sensors, with 55 um pixel pitch and 14 um pad diameter. The ACF technology can also be used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bumping techniques. This contribution introduces the ENIG plating and ACF processes and presents recent results on Timepix3 hybrid assemblies

Beam test results of silicon sensor module prototypes for the Phase-2 Upgrade of the CMS Outer Tracker

The start of the High-Luminosity LHC (HL-LHC) in 2027 requires upgrades to the Compact Muon Solenoid (CMS) Experiment. In the scope of the upgrade program the complete silicon tracking detector will be replaced. The new CMS Tracker will be equipped with silicon pixel detectors in the inner layers closest to the interaction point and silicon strip detectors in the outer layers. The new CMS Outer Tracker will consist of two different kinds of detector modules called PS and 2S modules. Each module will be made of two parallel silicon sensors (a macro-pixel sensor and a strip sensor for the PS modules and two strip sensors for the 2S modules). Combining the hit information of both sensor layers it is possible to estimate the transverse momentum of particles in the magnetic field of 3.8 T at the full bunch-crossing rate of 40 MHz directly on the module. This information will be used as an input for the first trigger stage of CMS. It is necessary to validate the Outer Tracker module functionality before installing the modules in the CMS experiment. Besides laboratory-based tests several 2S module prototypes have been studied at test beam facilities at CERN, DESY and FNAL. This article concentrates on the beam tests at DESY during which the functionality of the module concept was investigated using the full final readout chain for the first time. Additionally the performance of a 2S module assembled with irradiated sensors was studied. By choosing an irradiation fluence expected for 2S modules at the end of HL-LHC operation, it was possible to investigate the particle detection efficiency and study the trigger capabilities of the module at the beginning and end of runtime of the CMS experiment.The start of the High-Luminosity LHC (HL-LHC) in 2027 requires upgrades to the Compact Muon Solenoid (CMS) experiment. In the scope of the upgrade program the complete silicon tracking detector will be replaced. The new CMS Tracker will be equipped with silicon pixel detectors in the inner layers closest to the interaction point and silicon strip detectors in the outer layers. The new CMS Outer Tracker will consist of two different kinds of detector modules called PS and 2S modules. Each module will be made of two parallel silicon sensors (a macro-pixel sensor and a strip sensor for the PS modules and two strip sensors for the 2S modules). Combining the hit information of both sensor layers, it is possible to estimate the transverse momentum of particles in the magnetic field of 3.8 T at the full bunch-crossing rate of 40 MHz directly on the module. This information will be used as an input for the first trigger stage of CMS. It is necessary to validate the Outer Tracker module functionality before installing the modules in the CMS experiment. Besides laboratory-based tests several 2S module prototypes have been studied at test beam facilities at CERN, DESY and FNAL. This article concentrates on the beam tests at DESY during which the functionality of the module concept was investigated using the full final readout chain for the first time. Additionally the performance of a 2S module assembled with irradiated sensors was studied. By choosing an irradiation fluence expected for 2S modules at the end of HL-LHC operation, it was possible to investigate the particle detection efficiency and study the trigger capabilities of the module at the beginning and end of the runtime of the CMS experiment

Interactive Urban Synthesis: Computational Methods for Fast Prototyping of Urban Design Proposals

In this paper, we present a method for generating fast conceptual urban design prototypes. We synthesise spatial configurations for street networks, parcels and building volumes. Therefore, we address the problem of implementing custom data structures for these configurations and how the generation process can be controlled and parameterized. We exemplify our method by the development of new components for Grasshopper/Rhino3D and their application in the scope of selected case studies. By means of these components, we show use case applications of the synthesis algorithms. In the conclusion, we reflect on the advantages of being able to generate fast urban design prototypes, but we also discuss the disadvantages of the concept and the usage of Grasshopper as a user interface

A Compact Front-End Circuit for a Monolithic Sensor in a 65-nm CMOS Imaging Technology

This article presents the design of a front-end circuit for monolithic active pixel sensors (MAPSs). The circuit operates with a sensor featuring a small, low-capacitance (< 2 fF) collection electrode and is integrated into the DPTS chip, a proof-of-principle prototype of 1.5×1.5 mm including a matrix of 32×32 pixels with a pitch of 15μm . The chip is implemented in the 65-nm imaging technology from the Tower Partners Semiconductor Company foundry and was developed in the framework of the EP-Research and Development Program at CERN to explore this technology for particle detection. The front-end circuit has an area of 42μm2 and can operate with power consumption as low as 12 nW. Measurements on the prototype relevant to the front end will be shown to support its design