Materials Challenge for Shingled Cells Interconnection

AbstractThis paper discusses some challenges that need to be tackled when designing a photovoltaic module using a shingled cells structure. We derive a simple analytical model to determine the conditions needed to avoid interconnection joint failure. It is found that interconnection materials with a low ratio of shear modulus G over shear strength τsh. str. is preferred for good interconnection joints reliability. As a result, solder joints appear inappropriate for the application, while electrically conductive adhesives (ECA) with low G/ τsh. str can better fulfill the requirements. An interconnection approach is also proposed which makes use of a combination of adjacent ECA and a non-conductive adhesive materials in a shingled configuration to help achieve string robustness and reliability

Summary of the 4th Workshop on Metallization for Crystalline Silicon Solar Cells

AbstractThe 4th Metallization Workshop held in May 2013 in Constance, Germany, enabled experts in metallization for crystalline silicon solar cells to obtain a clear view on the status of the technology, as well as to exchange and generate new ideas and insights. From the contributions on the workshop, it was clear that the traditional metallization technique of screenprinting Ag paste has been improved in a dramatic way over the last two years, accelerating the decrease of Ag consumption per cell while improving solar cell efficiency. This was achieved through enhanced understanding of screenprinted contacts, improving Ag pastes and evolutionary modifications to the screenprinting technique. Alternatives to screenprinting, including electroplating of Ni and Cu contacts, also continue to progress, though not quite at the same impressive rate of improvement as Ag printing

Passivation of a Metal Contact with a Tunneling Layer

AbstractThe potential of contact passivation for increasing cell performance is indicated by several results reported in the literature. However, scant characterization of the tunneling layers used for that purpose has been reported. In this paper, contact passivation is investigated by insertion of an ultra-thin AlOx layer between an n-type emitter and a Ti/Pd/Ag contact. By using a 1.5nm thick layer, an increase of the minority carrier lifetime by a factor of 2.7 is achieved. Since current-voltage measurements indicate that an ohmic behavior is conserved for AlOx layers as thick as 1.5nm, a 1.5nm AlOx layer is found to be a candidate of choice for contact passivation

Solar cell process development in the european integrated project crystalclear

CrystalClear is a large integrated project funded by the European Commission that aims to drastically reduce the cost of crystalline Si PV modules, down to 1 Euro/Wp. Among the different subprojects, the one dealing with the development of advanced solar cells is relatively large (with 11 partners out of the 15 Crystal Clear partners taking part) and has a crucial role. The goal of the subproject is to develop cell design concepts and manufacturing processes that would enable a reduction in the order of 40% of the cell processing costs per Wp. In this paper, we give an overview of all the development work that has taken place in the CrystalClear solar cells subproject so far. World class results have been achieved, particularly on high efficiency cells on Si ribbons, and on industrial-type solar cells on very thin (120 (j.m thick) substrates

Silicon Thin-Film Solar Cells

We review the field of thin-film silicon solar cells with an active layer thickness of a few micrometers. These technologies can potentially lead to low cost through lower material costs than conventional modules, but do not suffer from some critical drawbacks of other thin-film technologies, such as limited supply of basic materials or toxicity of the components. Amorphous Si technology is the oldest and best established thin-film silicon technology. Amorphous silicon is deposited at low temperature with plasma-enhanced chemical vapor deposition (PECVD). In spite of the fundamental limitation of this material due to its disorder and metastability, the technology is now gaining industrial momentum thanks to the entry of equipment manufacturers with experience with large-area PECVD. Microcrystalline Si (also called nanocrystalline Si) is a material with crystallites in the nanometer range in an amorphous matrix, and which contains less defects than amorphous silicon. Its lower bandgap makes it particularly appropriate as active material for the bottom cell in tandem and triple junction devices. The combination of an amorphous silicon top cell and a microcrystalline bottom cell has yielded promising results, but much work is needed to implement it on large-area and to limit light-induced degradation. Finally thin-film polysilicon solar cells, with grain size in the micrometer range, has recently emerged as an alternative photovoltaic technology. The layers have a grain size ranging from 1 μm to several tens of microns, and are formed at a temperature ranging from 600 to more than 1000∘C. Solid Phase Crystallization has yielded the best results so far but there has recently been fast progress with seed layer approaches, particularly those using the aluminum-induced crystallization technique