Compact thermally tunable silicon racetrack modulators based on an asymmetric waveguide

A compact wavelength-tunable 10-Gb/s silicon racetrack modulator with integrated thermo-optic heater is demonstrated by using a waveguide with an asymmetric cross section, combining the compact footprint of microdisk modulators with the design simplicity of regular racetrack or ring modulators. The outer perimeter of the asymmetric racetrack modulator is fully etched to maximize optical confinement, and the inner waveguide edge is shallowly etched to maintain an electrically conductive path to the embedded p-n diode and to control the propagation of the asymmetric optical mode and its coupling to the bus waveguide. The resistive heating elements based on highly doped Si strips are implemented at the outer edge of the modulator for thermo-optic control. The asymmetric modulators can be fabricated along with Si wire waveguides and shallowly etched fiber-grating couplers using a simple process flow involving just two Si-patterning steps. Devices with a bending radius of 10 mu m and a novel "T"-shaped p-n diode layout have been fabricated, and exhibit electro-optic modulation and heater efficiencies of 28 pm/V and 42 pm/mW, respectively. At 10 Gb/s, a stable extinction ratio of 10 dB is demonstrated from a 2V(pp) drive swing, which can be maintained over a wavelength range of 4.6 nm by thermally tuning the modulator. This is equivalent with a temperature variation of about 62 degrees C

Integrated nanomechanical motion detection by means of optical evanescent wave coupling - art. no. 64640E

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III-V-on-silicon 2-mu m-wavelength-range wavelength demultiplexers with heterogeneously integrated InP-based type-II photodetectors

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Silicon-Integrated Hybrid-Cavity 850-nm VCSELs by Adhesive Bonding: Impact of Bonding Interface Thickness on Laser Performance

The impact of bonding interface thickness on the performance of 850-nm silicon-integrated hybrid-cavity vertical-cavity surface-emitting lasers (HC-VCSELs) is investigated. The HC-VCSEL is constructed by attaching a III–V “half-VCSEL” to a dielectric distributed Bragg reflector on a Si substrate using ultrathin divinylsiloxane-bis-benzocyclobutene (DVS-BCB) adhesive bonding. The thickness of the bonding interface, defined by the DVS-BCB layer together with a thin SiO2 layer on the “half-VCSEL,” can be used to tailor the performance, for e.g., maximum output power or modulation speed at a certain temperature, or temperature-stable performance. Here, we demonstrate an optical output power of 2.3 and 0.9 mW, a modulation bandwidth of 10.0 and 6.4 GHz, and error-free data transmission up to 25 and 10 Gb/s at an ambient temperature of 25 and 85 °C, respectively. The thermal impedance is found to be unaffected by the bonding interface thickness

20-Gb/s Modulation of Silicon-Integrated Short-Wavelength Hybrid-Cavity VCSELs

We investigate the dynamics of silicon-integrated 850-nm-wavelength hybrid-cavity vertical-cavity surface-emitting lasers (VCSELs). The VCSELs consist of a GaAs-based half-VCSEL attached to a dielectric distributed Bragg reflector on a silicon substrate using ultra-thin divinylsiloxane-bis-benzocyclobutene adhesive bonding. A 5-µm oxide aperture diameter VCSEL, with a small signal modulation bandwidth of 11 GHz, supports data transmission at bit rates up to 20 Gb/s. The modulation bandwidth and the large signal modulation characteristics are found to be impaired by the high thermal impedance