149 research outputs found

    Using the scanning electron microscope on the production line to assure quality semiconductors

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    The use of the scanning electron microscope to detect metallization defects introduced during batch processing of semiconductor devices is discussed. A method of determining metallization integrity was developed which culminates in a procurement specification using the scanning microscope on the production line as a quality control tool. Batch process control of the metallization operation is monitored early in the manufacturing cycle

    GSFC Preferred Parts List PPL-15

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    A listing is presented of preferred electronic parts, part upgrading procedures, part derating guidelines, and part screening procedures to be used in the selection, procurement, and application of parts for Goddard Space Flight Center space systems and ground support equipment

    A survey of particle contamination in electronic devices

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    The experiences are given of a number of National Aeronautics and Space Administration (NASA) and Space and Missile System Organization (SAMSO) contractors with particle contamination, and the methods used for its prevention and detection, evaluates the bases for the different schemes, assesses their effectiveness, and identifies the problems associated with each. It recommends specific short-range tests or approaches appropriate to individual part-type categories and recommends that specific tasks be initiated to refine techniques and to resolve technical and application facets of promising solutions

    The Next Linear Collider machine protection system

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    The Next Linear Collider (NLC) electron and positron beams are capable of damaging the linac accelerating structure and beamline vacuum chambers during an individual aberrant accelerator pulse. Machine protection system (MPS) considerations, outlined in this paper, have an impact on the engineering and design of most machine components downstream of the damping ring injector complex. The MPS consists of two functional levels. The first is a system that provides a benign, single bunch, low intensity, high emittance beam that will be used for commissioning and at any time that the integrity or the settings of the downstream component are in doubt. This level also provides for the smooth transition back and forth between high power operation and the benign diagnostic pilot bunch operation. The pilot bunch parameters in the main linac are estimated on the basis of the expected stress in the accelerator structure copper. Beam tests have been done at the SLAC linac to examine the behaviour of the copper at the damage stress threshold. Typical pilot beam parameters (compared with nominal) are: 10 times reduced intensity, 10 times increased horizontal emittance and 1000 times increased vertical emittance, resulting in a reduction in charge density of 105. The second level is the primary protection against a single aberrant pulse. It’s goal is to reduce the possibility that a substantial transverse field changes the trajectory of the high power beam from one pulse to the next. All devices that could produce such a field are 1) monitored by a fast response network and 2) have deliberately slowed response times. A ‘maximum allowable interpulse difference ’ is evaluated for each such device as well as the beam trajectory monitors in each interpulse period.

    Stability Considerations for Final Focus Systems of Future Linear Colliders

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    The final focus systems for the future linear colliders need to focus beams to nm-range spot sizes at the collision point. The design spot size varies from several nm for 500 GeV to the one nm range for 3 TeV. In order to keep the beams in collision and to maintain the luminosity stringent stability optimization must be applied. We discuss different sources of beam perturbations and estimate the expected beamline stability based on previous experimental observations. Possible measures for beam stabilization are discussed and plans of further collaborative efforts are outlined
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