4 research outputs found
Interface-Engineered Resistive Switching: CeO<sub>2</sub> Nanocubes as High-Performance Memory Cells
We reported a novel and facile approach
to fabricate self-assembled
CeO<sub>2</sub> nanocube-based resistive-switching memory device.
The device was found to exhibit excellent bipolar resistive-switching
characteristics with a high resistance state (HRS/OFF) to low resistance
state (LRS/ON) ratio of 10<sup>4</sup>, better uniformity, and stability
up to 480 K. The presence of oxygen vacancies and their role was discussed
to explain the resistive-switching phenomenon in the fabricated devices.
Further, the effect of the film thickness on carrier concentrations
and estimated electric field strength with the switching (OFF/ON)
ratio were also discussed
Interfacial Redox Reactions Associated Ionic Transport in Oxide-Based Memories
As
an alternative to transistor-based flash memories, redox reactions
mediated resistive switches are considered as the most promising next-generation
nonvolatile memories that combine the advantages of a simple metal/​solid
electrolyte (insulator)/​metal structure, high scalability,
low power consumption, and fast processing. For cation-based memories,
the unavailability of in-built mobile cations in many solid electrolytes/​insulators
(e.g., Ta<sub>2</sub>O<sub>5</sub>, SiO<sub>2</sub>, etc.) instigates
the essential role of absorbed water in films to keep electroneutrality
for redox reactions at counter electrodes. Herein, we demonstrate
electrochemical characteristics (oxidation/​reduction reactions)
of active electrodes (Ag and Cu) at the electrode/​electrolyte
interface and their subsequent ions transportation in Fe<sub>3</sub>O<sub>4</sub> film by means of cyclic voltammetry measurements. By
posing positive potentials on Ag/Cu active electrodes, Ag preferentially
oxidized to Ag<sup>+</sup>, while Cu prefers to oxidize into Cu<sup>2+</sup> first, followed by Cu/Cu<sup>+</sup> oxidation. By sweeping
the reverse potential, the oxidized ions can be subsequently reduced
at the counter electrode. The results presented here provide a detailed
understanding of the resistive switching phenomenon in Fe<sub>3</sub>O<sub>4</sub>-based memory cells. The results were further discussed
on the basis of electrochemically assisted cations diffusions in the
presence of absorbed surface water molecules in the film
High-Performance Nanocomposite Based Memristor with Controlled Quantum Dots as Charge Traps
We report a novel approach to improve
the resistive switching performance
of semiconductor nanorod (NR) arrays, by introducing ceria (CeO<sub>2</sub>) quantum dots (QDs) as surface charge trappers. The vertically
aligned zinc oxide (ZnO) (NR) arrays were grown on transparent conductive
glass by electrochemical deposition while CeO<sub>2</sub> QDs were
prepared by a solvothermal method. Subsequently, the as-prepared CeO<sub>2</sub> QDs were embedded into a ZnO NR array by dip coating to obtain
a CeO<sub>2</sub>–ZnO nanocomposite. Interestingly, such a
device exhibits excellent resistive switching properties with much
higher ON/OFF ratios, better uniformity, and stability over the pure
ZnO and CeO<sub>2</sub> nanostructures. The origin of resistive switching
was studied and the role of heterointerface was discussed
Interface Thermodynamic State-Induced High-Performance Memristors
A new
class of memristors based on long-range-ordered CeO<sub>2</sub> nanocubes
with a controlled degree of self-assembly is presented,
in which the regularity and range of the nanocubes can be greatly
improved with a highly concentrated dispersed surfactant. The magnitudes
of the hydrophobicity and surface energy components as functions of
surfactant concentration were also investigated. The self-assembled
nanostructure was found to demonstrate excellent degradation in device
threshold voltage with excellent uniformity in resistive switching
parameters, particularly a set voltage distribution of ∼0.2
V over 30 successive cycles and a fast response time for writing (0.2
μs) and erasing (1 μs) operations, thus offering great
potential for nonvolatile memory applications with high performance
at low cost