Relaxation of superflow in a network: an application to the dislocation model of supersolidity of helium crystals

We have considered the dislocation network model for the supersolid state in He-4 crystals. In difference with uniform 2D and 3D systems, the temperature of superfluid transition T_c in the network is much smaller than the degeneracy temperature T_d. It is shown that a crossover into a quasi superfluid state occurs in the temperature interval between T_c and T_d. Below the crossover temperature the time of decay of the flow increases exponentially under decrease of the temperature. The crossover has a continuous character and the crossover temperature does not depend on the density of dislocations.Comment: Corrected typo

RISK FACTORS FOR OSTEOPOROSIS IN PATIENTS WITH RHEUMATOID ARTHRITIS

The present review is devoted to the risk factors of osteoporosis progression in patients with rheumatoid arthritis (RA), both relevant and irrelevant to the main disease. It is assumed that the most important predictors of the bone mineral density decrease is severe course of RA, significant functional disability (according to HAQ), glucocorticoid therapy, elderly age, low body mass index and menopause. However, despite the vast amount of studies, results on the risk factors of osteoporosis remain ambiguous and require further investigation

Моделирование процессов формирования нефтегазоносности Вычегодского прогиба

The article is devoted to reconstruction of the conditions of oil and gas potential formation in the Vychegda Trough using 2D basin modeling. Currently, the region is very poorly studied that is indicated by the low density of the entire fund of drilled wells and explored regional seismic profiles. However, the Vychegda Trough is considered as a prospective area for new oil and gas fields in the North-East of European Russia. The amount of information accumulated during the entire period of study of the Vychegda Trough makes it possible to conduct a comprehensive study of the processes of oil and gas potential formation and assess the perspectives of oil and gas bearing capacity using a modern basin modeling method.Статья посвящена реконструкции условий формирования нефтегазоносности Вычегодского прогиба с использованием 2D бассейнового моделирования. В настоящий момент регион изучен крайне слабо, на что указывают низкая плотность сетки всего фонда пробуренных скважин и отработанных региональных сейсморазведочных профилей. Тем не менее Вычегодский прогиб считается перспективной территорией на поиски новых месторождений нефти и газа на Северо-Востоке Европейской части России. Объем информации, накопленной за весь период изучения Вычегодского прогиба, дает возможность провести комплексное исследование процессов формирования нефтегазоносного потенциала и оценить перспективы нефтегазоносности с помощью современного метода – бассейнового моделирования

Analgesic treatment, by using a systemic algorithm

To control musculoskeletal pain (MSP) is an important component of combination treatment for systemic inflammatory rheumatic diseases, such as rheumatoid arthritis and spondyloarthritis, and a major area of therapy for osteoarthritis and nonspecific back pain. Pain development is associated with a number of pathogenetic mechanisms: local involvement; involvement of the elements of the ligamentous apparatus; chronic muscle tension; biomechanical disorders; dysfunction of the nociceptive system. This necessitates a comprehensive approach during analgesic therapy, with combined use of drugs having a different mechanism of analgesic action. This review considers the targets of pharmacotherapy for MSP and the main groups of medications that may affect them. The paper proposes an analgesic treatment algorithm based on the diagnosis of individual elements of the pathogenesis of chronic MSP and on the successive assessment of treatment results

PHARMACOCORRECTION PHYSICAL PERFORMANCE HERBAL REMEDIES «KARDEKAIM»

The purpose of this study was to determine the effect of herbal means «kardekaim» on indicators of physical endurance. Actoprotective activity was determined by the general models, high-speed and power of physical endurance in experiments on white mice. Overall physical endurance was determined by the duration of the swimming pool in mice with a load, speed of physical endurance was assessed by running the length of the mice in the 10-track treadmill, strength endurance were evaluated by retention time on a pole mice. Found that the introduction of rnurse «kardekaim» increases overall, speed and power physical endurance of laboratory animals against peace. On the model of single-and multiple-dose exercise kardekaim increases the potential for physical performance, prevents fatigue and speeds up recovery of physical endurance of animals undergoing high intensity exercise. The most effective kardekaim shows at course introduction. It is proved that the effect of the introduction at course «kardekaim» superior product comparison - Eleutherococcus extract

Influence of organic solvents and surfactants on photoactivation process of dielectric materials

For the photoselective activation of the surface of inorganic dielectric materials and fiberglass with an epoxy-rubber adhesive layer, compositions based on copper(II) compounds containing sodium salts of anthraquinon sulfonic acids and secondary sorbitol and ethanol as an optical sensitizer can be used. The metallization process of dielectric materials, in particular, copper plating is autocatalytic. The catalyst is the surface of an already formed copper coating. The concentration of catalytically active centers on the surface of the dielectric should be high enough to produce the high-quality solid copper coating. Organic solvents (dimethylformamide and dimethylsulfoxide) are entered a photosensitive composition for an increase in the amount of copper(II) at the surfaces of the dielectric. They are used at a stage of swelling of an epoxyrubber adhesive layer of fiber glasses by preparation of a dielectric surface. In this case, the photosensitive composition is fixed on the surface of the dielectric not only due to microroughness but also is capable to get deep into the bulked-up adhesive layer. The amount of copper(II) deposited on the surface of the dielectric in the composition of the photocomposition was determined using atomic absorption (AAMA) and X-ray diffraction fluorescence analysis methods (RSFA). It is established that the amount of copper(II) on the surface of the dielectric increases by 2a3 times at increase in time of drawing photocomposition from 0.5 to 5 of minutes. Thus, the photosensitive layer is fixed on the dielectric surface not only due to microroughness but also due to the adsorption of photocomposition by an adhesive layer. It is shown that the amount of copper(II) on a surface is more than when drawing photocomposition with dimethylformamide when drawing on the dielectric of the photocomposition containing 10% volume a dimethylsulfoxide. This suggests that the swelling of the adhesive layer in DMSO is more effective. It is established that the introduction of organic solvents into the photoactivator composition increases the concentration of copper(II) on the surface and in the adhesive layer. For the best fixing of photocomposition on the surface of the dielectric material, the photoactivator was entered into the structure of the photoactivator. Introduction to the structure of the photoactivator of surfactants increases the speed of photorestoration of copper(II) in a dry layer of the photoactivator. Surfactants increase the amount of copper(II) by the surfaces of the dielectric and promote the best distribution of the photoactivator. Nonionic surfactant of the OP-10 brand as a part of the photoactivator considerably increases adhesion of a metal coating to the dielectric. © 2019 Author(s)

Restoration of Catalytic Activity of the Drawing of the Printed Circuit Board at Photoselective Activation of Fibreglasses

In the production technology of printed circuit boards by an additive method photoselective activation of dielectric materials finds broad application. The photoadditive technology is a multistage process. Photosensitive compositions for activation of dielectrics are the difficult multicomponent systems which are turning on the photopro-motor (copper acetate), an optical sensitizer (sodium salts of anthraquinonesulfonic acids), secondary reducer (sorbite, ethyl alcohol), the component (citric acid) interfering process of hydrolysis of the photopro-motor and maintaining value pH solution at the set level. The major requirement to activation of a surface is ensuring high catalytic activity of the metallized substrate which is defined by the nature of the catalyst of sedimentation of copper in solutions of a chemical copper plating. The high catalytic activity of the metallized surface provides sedimentation of compact, strong and uniform films of metal. Catalystically active centers need to be created under the influence of ultra-violet radiation for obtaining the set drawing of the scheme on a surface and in openings of the printed circuit board at further chemical metallization. Restoration of copper(II) to copper(I) and to metal happens in the course of exhibiting of a photosensitive layer on the basis of compounds of copper(II). The formed drawing of the scheme consists generally of particles of a cuprous oxide, metal copper and oxide of copper. Loss of activity by some sites of a surface results from oxidation, pollution, dissolution or washing off particles of the catalyst. The complete recovery of copper(II) and copper(I) is received in the solutions containing except alkali and formaldehyde of copper complexing agent: trilon B, sodium-potassium tartrate, ethylenediamine. Reliable restoration of catalytic activity of the drawing of the printed circuit board happens at a temperature of 20a25 °C during processing of 3a5 minutes. At interaction of solution of this structure and a cuprous oxide metal copper and a soluble complex of copper (II) from which copper (II) is restored in water alkaline solutions by formaldehyde to metal is formed Cu2O + H2O + C4H4O6 2- = Cu0 + Cu(OH)2C4H4O6. Potassium-sodium tartrate is used as a ligand in technological process with tartratny solution of a thick-layer chemical copper plating. Then after restoration of catalytic activity of the drawing of the scheme the printed circuit board can be brought in solution of a thick-layer chemical medneniye without intermediate washing. © 2019 Author(s)