13 research outputs found
Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction
Thin (<150 µm) silicon solar cell technology is attractive due to the significant cost reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. In this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. The complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells
Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment
Pengelolaan Tingkah Laku Pasien Pada Praktik Dokter Gigi (The Psychology of Dental Care)
IX+192hlm.;24c
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Contamination-resistant, rapid emulsion-based isothermal nucleic acid amplification with Mie-scatter inspired light scatter analysis for bacterial identification
An emulsion loop-mediated isothermal amplification (eLAMP) platform was developed to reduce the impact that contamination has on assay performance. Ongoing LAMP reactions within the emulsion droplets cause a decrease in interfacial tension, causing a decrease in droplet size, which results in decreased light scatter intensity due to Mie theory. Light scatter intensity was monitored via spectrophotometers and fiber optic cables placed at 30° and 60°. Light scatter intensities collected at 3 min, 30° were able to statistically differentiate 103 and 106 CFU/µL initial Escherichia coli O157:H7 concentrations compared to NTC (0 CFU/µL), while the intensity at 60° were able to statistically differentiate 106 CFU/µL initial concentrations and NTC. Control experiments were conducted to validate nucleic acid detection versus bacterial adsorption, finding that the light scatter intensities change is due specifically to ongoing LAMP amplification. After inducing contamination of bulk LAMP reagents, specificity lowered to 0% with conventional LAMP, while the eLAMP platform showed 87.5% specificity. We have demonstrated the use of angle-dependent light scatter intensity as a means of real-time monitoring of an emulsion LAMP platform and fabricated a smartphone-based monitoring system that showed similar trends as spectrophotometer light scatter data, validating the technology for a field deployable platform. © 2021, The Author(s).Open access journalThis item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at [email protected]
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Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment
Plastic behavior has previously been observed in metallic interconnects undergoing high current density electromigration (EM) loading. In this study of Cu interconnects, using the synchrotron technique of white beam X-ray microdiffraction, we have further found preliminary evidence of a texture correlation. In lines with strong (111) textures, the extent of plastic deformation is found to be relatively large compared to that of weaker textures. We suggest that this strong (111) texture may lead to an extra path of mass transport in addition to the dominant interface diffusion in Cu EM. When this extra mass transport begins to affect the overall transport process, then the effective diffusivity, D{sub eff}, of the EM process is expected to deviate from that of interface diffusion only. This would have fundamental implications. We have some preliminary observations that this might be the case, and we report its implications for EM lifetime assessment in this manuscript
Plasticity-amplified diffusivity: dislocation cores as fast diffusion paths in Cu interconnects
The mass transport of Cu during electromigration (EM) testing is typically dominated by interface diffusion. If a mechanism other than interface diffusion begins to affect the overall transport process, then the effective diffusivity, D, of the EM process would deviate from that of interface diffusion only. This would have fundamental implications. We have preliminary evidence that this might be the case, and we report its implications for EM lifetime assessment in this manuscript. (11 References)