AlGaN/GaN high electron mobility transistor heterostructures grown by ammonia and combined plasma-assisted ammonia molecular beam epitaxy

The structural properties and surface morphology of AlN epitaxial layers grown by ammonia (NH3) and plasma-assisted (PA) molecular beam epitaxy (MBE) at different growth conditions on (0001) sapphire were investigated. The lowest RMS roughness of ~0.7 nm was achieved for the sample grown by NH3 MBE at a substrate temperature of 1085 °C and NH3 flow of 100 standard cm3 min−1. Atomic force microscopy measurements demonstrated a terrace-monolayer step-like surface morphology. Furthermore, the optimal substrate temperature for growth of GaN and AlGaN layers was determined from analysis of the GaN thermal decomposition rate. Using the optimized growth conditions, high electron mobility transistor heterostructures were grown by NH3 MBE on different types of AlN nucleation layer deposited by NH3 MBE or PA MBE. The grown heterostructures demonstrated comparable two-dimensional electron gas (2DEG) properties. The maximum 2DEG mobility of ~2000 cm2 V–1 s–1) at a 2DEG density of ~1.17 × 1013 cm−2 was achieved for the heterostructure with a PA MBE-grown AlN nucleation layer. The obtained results demonstrate the possibility of successful combination of different epitaxial approaches within a single growth process, which will contribute to the development of a new type of hybrid epitaxy that exploits the advantages of several technologies

АММИАЧНАЯ МОЛЕКУЛЯРНО-ПУЧКОВАЯ ЭПИТАКСИЯ ГЕТЕРОСТРУКТУР AlGaN НА ПОДЛОЖКАХ САПФИРА

In order to develop a technology for the growth of Al(Ga)N-based heterostructures, the effect of different molecular beam epitaxy growth conditions on the properties of AlN and AlGaN layers was studied. The optimal conditions for the growth of AlN buffer layers were established, which made it possible to achieve a root mean square roughness as small as 0.7 nm. It was shown that an increase of AlN layer thickness leads to a decrease of density of edge dislocations, while no explicit dependence of the screw dislocation densityon the layer thickness was observed. The minimal obtained dislocations density values for 1.25μm-thick AlN layer were nedges = 5.9×109 cm-2 and nscrew = 2.2×107 cm-2 for edge and screw dislocations respectively. As a result of optimization of the AlGaN growth temperature, a series of 0.15μm-thick layers was grown, which showed stimulated emission at wavelengths λ = 330 nm, 323 nm, 303 nm, and 297 nm with threshold powerdensities of 0.7 MW/cm2, 1.1 MW/cm2, 1.4 MW/cm2 and 1.4 MW/cm2, respectively. The determined optimal epitaxy conditions for AlN and AlGaN layers were used to grow the AlGaN/GaN high electron mobility transistor structure on a sapphire substrate with two-dimensional electron gas, which had a mobility of 1950 cm2/(Vs) at a concentration of 1.15×1013 cm-2. The obtained results are important for creating of nitride-basedUV-emitting optoelectronic semiconductor devices, as well as high-power and high-frequency electronic devices.В работе с целью разработки технологии роста гетероструктур на основе Al(Ga)Nисследовалось влияние различных условий роста гетероструктур молекулярно-пучковой эпитаксией на свойства слоев AlN и AlGaN. Были установлены условия для роста буферных слоев AlN, которые позволили достигнуть среднеквадратичного значения величины шероховатостей 0,7 нм. Показано, что увеличение толщины слоя AlN приводит к уменьшению плотности краевых дислокаций, в то время как явной зависимости плотности винтовых дислокаций от толщины слоя не наблюдалось. Минимальные полученные значения плотности проникающих дислокаций для слоя AlN толщиной 1,25 мкм составили nкраев. = 5,9×109 см-2 и nвинт. = 2,2×107 см-2. В результате оптимизации температуры роста AlGaN была выращена серия слоев толщиной 0,15 мкм, показавших стимулированное излучение на длинах волн λ = 330 нм, 323 нм, 303 нм и 297 нм с пороговыми плотностями мощности 0,7 МВт/см2, 1,1 МВт/см2, 1,4 МВт/см2 и 1,4 МВт/см2 соответственно. Установленные условия эпитаксии слоев AlN и AlGaN на подложках сапфира были использованы для роста транзисторной структуры AlGaN/GaN на подложке сапфира с двумерным электронным газом, который имел подвижность 1950 см2/(Вс) при концентрации 1,15×1013 см-2. Полученные результаты важны для создания излучающих оптоэлектронных полупроводниковых приборов, работающих в УФ области спектра, а также приборов силовой и высокочастотной электроники на основе нитридов

МОДЕЛИРОВАНИЕ РАСПРЕДЕЛЕНИЯ ТЕМПЕРАТУРЫ В МАТРИЦЕ InGaN СВЕТОДИОДОВ С ВЫСОКОЙ ПЛОТНОСТЬЮ МОЩНОСТИ ИЗЛУЧЕНИЯ

The matrix consisting of 33 miniature LEDs of Rebel Z-series emitting in the blue-green region of the spectrum was created. The maximum emission power density of the matrix was ~ 18 W/cm2 at continuous injection current. A computer model describing the temperature distribution in the matrix of LEDs depending on the supplied electrical power was developed. The simulation results are consistent with the results of measurement of the matrix LEDs temperature by a thermal imager, as well as with the results of determination of the LED active region temperature by the optical method.Создана матрица, состоящая из 33 миниатюрных светодиодов Rebel Z-серии, излучающих в сине-зеленой области спектра. Максимальная плотность мощности излучения матрицы составила ~18 Вт/см2 при непрерывном токе инжекции. Выполнена компьютерная модель, описывающая распределение температуры в матрице светодиодов в зависимости от потребляемой электрической мощности. Результаты моделирования согласуются с результатами измерений температуры светодиодов матрицы при помощи тепловизора, а также определения температуры активной области светодиодов оптическим методом.

AMMONIA MOLECULAR BEAM EPITAXY OF AlGaN HETEROSTRUCTURES ON SAPPHIRE SUBSTRATES

In order to develop a technology for the growth of Al(Ga)N-based heterostructures, the effect of different molecular beam epitaxy growth conditions on the properties of AlN and AlGaN layers was studied. The optimal conditions for the growth of AlN buffer layers were established, which made it possible to achieve a root mean square roughness as small as 0.7 nm. It was shown that an increase of AlN layer thickness leads to a decrease of density of edge dislocations, while no explicit dependence of the screw dislocation densityon the layer thickness was observed. The minimal obtained dislocations density values for 1.25μm-thick AlN layer were nedges = 5.9×109 cm-2 and nscrew = 2.2×107 cm-2 for edge and screw dislocations respectively. As a result of optimization of the AlGaN growth temperature, a series of 0.15μm-thick layers was grown, which showed stimulated emission at wavelengths λ = 330 nm, 323 nm, 303 nm, and 297 nm with threshold powerdensities of 0.7 MW/cm2, 1.1 MW/cm2, 1.4 MW/cm2 and 1.4 MW/cm2, respectively. The determined optimal epitaxy conditions for AlN and AlGaN layers were used to grow the AlGaN/GaN high electron mobility transistor structure on a sapphire substrate with two-dimensional electron gas, which had a mobility of 1950 cm2/(Vs) at a concentration of 1.15×1013 cm-2. The obtained results are important for creating of nitride-basedUV-emitting optoelectronic semiconductor devices, as well as high-power and high-frequency electronic devices