New Process of Palladium Electroplating Form Potassium Citrate Bath

研究在柠檬酸钾和草酸铵镀液体系中镀钯工艺。结果表明，采用本实验室研制的添加剂XP-4和XP-7以及PPS和ff，则可在电流密度0.5~3.5A/dM2、温度40~60℃的宽范围内获得全光亮的钯电沉积层。钯沉积的电流效率和沉积速度在镀液中钯含量为10g/l、1.0A/dM2的条件下分别可达到92.0%和0.25μM/MIn，并随电流密度和镀液中钯含量的变化而改变。XP-4和XP-7均阻化钯的电沉积，提高钯电沉积的过电位。它们共存时可使把电沉积的电位负移达240MV。Process of Pd plating From system of potassium citrate and ammonium oxalate is investigated.Results show, with additives of XP-4, XP-7, PPS and FF prepared in our laboratory, Full bright Pd electrodeposit can be obtained in wide range of 0.5-3.5 A/dm2 and 4a-60℃ and at 1.0 A/dm2 and Pd 10 g/L contg in bath, current eFFiciency and deposition rate are 92.0% and 0.25μm/min respectively,which will be changed with change of c.d.and Pd content in bath.Both XP-4 and XP-7 inhibit Pd electrodeposition and cause increase of deposition overpotential.Their co existence can make Pd electrodeposition potential shiFt to negative value, up to 240mV

Gun-Colour Sn-Ni Alloy Electroplating

研究了电镀枪黑色锡镍合金XSn焦磷酸盐镀液的性能，结果表明，控制镀液中SnCl2·2H2O/nICl2·6H2O浓度比，可获得不同色调和光亮范围的镀层。在电沉积过程中，XSn-2对nI起极化作用，对Sn起去极化作用，使Sn和nI的沉积电位接近，易于沉积高Sn含量的Sn-nI合金。沉积速度主要取决于镀液中Sn和nI金属离子的总浓度，适当增加金属离子总浓度，有利于提高沉积速度。中国科学院兰州化学物理研究所固体润滑开放研究实验室基

Leveling Ability of Additives and Their Effects on Structure of Cu Electrodeposits

采用电化学、X射线衍射和扫描电镜方法研究酸性镀铜过程中添加剂的整平能力及其对Cu电沉积层结构和表面形貌的影响.结果表明,采用本文所研制的添加剂,可以获得光亮、致密且整平能力可达到100%的Cu电沉积层;所获得的Cu镀层均不存在明显的晶面择优取向现象.镀液中光亮剂单独存在及其与整平剂共存时,镀层表面分别呈现晶粒细小致密形貌和网状结构.Leveling ability of additives and their effects on the structure and surface morphology of Cu electrodeposited in acidic electrolyte solution were studied by means of electrochemistry, XRD and SEM. The results showed that bright and tidy Cu electrodeposit in 100% leveling ability could be obtained from the electrolyte solution with the developed additives. The structure of the all obtained copper deposits were shown in obvious nonpreferred orientation. The surface morphology of Cu deposits were respectively presented in fine and tidy grains and net state when the brightener in bath was existed alone and coexisted with leveling agent.国家自然科学基金(20073037);; 优秀国家重点实验室基金(20013001)资助项

XNF光亮镍铁合金电镀工艺

本文着重就光亮剂XNF—1和温度对镀液的整平能力、深镀能力、分散能力、阴极极化和镀层组成及硬度的影响进行了初步研究

A Study on the Electrodeposition of Palladium and it′s Nucleation

研究在柠檬酸钾和草酸铵镀液体系中纯钯电沉积及电结晶机理．结果表明，采用本实验室研制的添加剂②ＸＰ－４和ＸＰ－７，可在电流密度０．５～３．５Ａ／ｄｍ２，温度４０～６０℃的宽广范围内获得全光亮的钯电沉积积层．采用脉冲电源电镀可有效地改善厚沉积层质量，减少沉积层裂纹和孔洞．循环伏安实验表明，钯电极过程的阴阳极峰电位之差达１．０５Ｖ，说明其电极过程明显不可逆；伏安图上同时出现一感抗性电流环，说明钯沉积过程发生晶核形成过程；ＸＰ－４和ＸＰ－７阻化电沉积和氢的析出，提高钯电沉积的沉积电位．电位阶跃实验进一步表明，钯遵循连续成核和三－维生长的电结晶机理．The electrodeposition and nucleation of palladium are studied in the system of potassium citrate and ammonium oxalate. The results show that, with the additives of XP 4 and XP 7 prepared in our laboratory, a full bright palladium electrodeposits will be obtained in the wide ranges of the cathode current densities 0.5～3.5 A/dm 2 and temperature 40～60 ℃; the qualities of the thick deposits will be effectively improved by means of pulse current plating. Cyclic voltammograms results show that the division of peaks between anodic and cathodic on the electrode process of palladium will be up to 1.05 V, which shows the irreversible electrode process; and a inductive current cycle is appeared,which means the process of nucleation; XP 4 and XP 7 inhibit both palladium electrodeposition and hydrogen evolution, therefore cause the deposition potential of palladium to more negative; potential step experiments furtherly show that the nucleation of palladium obeyed progressive uncleation mechanism both with the studied additives or without them.作者联系地址：厦门大学化学系物理化学研究所Author's Address: Chem. Dept., Insti of Phys. Chem. Xiamen Univ., Xiamen 36100