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New Process of Palladium Electroplating Form Potassium Citrate Bath

Abstract

研究在柠檬酸钾和草酸铵镀液体系中镀钯工艺。结果表明,采用本实验室研制的添加剂XP-4和XP-7以及PPS和ff,则可在电流密度0.5~3.5A/dM2、温度40~60℃的宽范围内获得全光亮的钯电沉积层。钯沉积的电流效率和沉积速度在镀液中钯含量为10g/l、1.0A/dM2的条件下分别可达到92.0%和0.25μM/MIn,并随电流密度和镀液中钯含量的变化而改变。XP-4和XP-7均阻化钯的电沉积,提高钯电沉积的过电位。它们共存时可使把电沉积的电位负移达240MV。Process of Pd plating From system of potassium citrate and ammonium oxalate is investigated.Results show, with additives of XP-4, XP-7, PPS and FF prepared in our laboratory, Full bright Pd electrodeposit can be obtained in wide range of 0.5-3.5 A/dm2 and 4a-60℃ and at 1.0 A/dm2 and Pd 10 g/L contg in bath, current eFFiciency and deposition rate are 92.0% and 0.25μm/min respectively,which will be changed with change of c.d.and Pd content in bath.Both XP-4 and XP-7 inhibit Pd electrodeposition and cause increase of deposition overpotential.Their co existence can make Pd electrodeposition potential shiFt to negative value, up to 240mV

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