2 research outputs found

    Research and Design of Electric Power Integrated Network Management System Based on CORBA

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    经过多年的建设,我国电力的通信网已形成了庞大的通信网络。电力通信网上承载了许多重要的通信业务,因此电力通信网的业务质量敏感性很强,相应的网络管理系统的实时性和有效性有比较高的要求。而目前,中国电力通信网络的维护管理仍主要依靠厂商各自的网络管理系统,存在难以兼容,缺乏统一管理的缺点。因此,开发一个面向电力通信网综合业务的统一管理系统具有重要的现实意义。 本文通过对温州电力通信各个传输网管的研究,设计并开发实现了一个统一的网管平台。系统将采用多种规约互相转换的方式,以实现不同通信设备间的数据采集,提高通信网络监控系统的接入能力。论文还将分析温州电力传输网络管理系统的具体需求,完成系统需求设计。此...After lots of years of construction, electric power communication network in China has become a tremendous system. As the electric power communication network carries much important communication service, its service quality is highly sensitive. Accordingly, network management system will have relatively high requirements on the real-time and effectiveness. At present, in our country, the maintena...学位:工程硕士院系专业:软件学院_工程硕士(软件工程)学号:X201223106

    Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant

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    Correspondent, E-mail: [email protected]; Tel/Fax: +86592-2181436.[中文文摘] 通过电化学方法研究了以次磷酸钠为还原剂,柠檬酸钠为络合剂的化学镀铜体系.应用线性扫描伏安法,检测了温度、pH值、镍离子含量对次磷酸钠阳极氧化和铜离子阴极还原的影响.结果表明,升高温度能够加速阳极氧化与阴极还原过程;pH值的提高可促进次磷酸钠氧化,但抑制铜离子还原;镍离子的存在不仅对次磷酸钠的氧化有强烈的催化作用,而且与铜共沉积形成合金.该合金有催化活性,使化学镀铜反应得以持续进行.[英文文摘] The process of electroless copper plating, using sodium hypophosphite as the reductant and sodium citrate as the chelating agent, was studied using linear sweep voltametry. The effects of temperature, pH, and concentration of nickel ion on the anodic oxidation of hypophosphite and the cathodic reduction of copper ion were tested. The results indicated that the higher ultrasonic bath temperature accelerated both the anodic and the cathodic processes. The increasing pH value promoted hypophosphite oxidation, whereas it blocked the reduction of the copper ion. The nickel ion not only intensively catalyzed the hypophosphite oxidation, but also codeposited with the copper ion to form the Cu-Ni alloy. With regard to its catalytic activity, this alloy enabled the continuation of the electroless copper plating reaction.国家科技攻关计划项目(2004BA325C)资
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