81 research outputs found

    Temperature effect of MENS high temperature touch-mode capacitive pressure sensor

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    介绍了一种基于SOI/硅片键合技术制作的接触电容式高温压力传感器结构,并对传感器的测试装置、测试方法进行详细的介绍后,对传感器进行压力测试和温度特性测试。压力测试结果表明,传感器线性工作区压力为110~280 kPA,灵敏度约为0.14 Pf/kPA;温度特性测试结果表明,传感器具有正温度效应,在30~300℃,传感器输出误差约为0.5%。文中还分析了热胀冷缩及介电常数温度系数对传感器温度效应的影响,以及设计了参考电容及运算放大器式传感器测量电路来消除温度效应。This paper introduces the structure of the MEMS high temperature touch-mode capacitive pressure sensor which is bases on the SOI / Silicon fusion bonding technique.Its testing device and method are presented in detail,and the tests on the sensor's pressure and temperature are conducted in high temperature.The results of the pressure test show that the linear operating range of the sensor is about 110 ~ 280 kPa and its sensitivity is about0.14 pF / kPa.The results of the temperature test reveal that the sensor has a positive temperature effect and its output error rate is about 0.5% in a temperature range of 30 ~ 300℃.Also the paper analyzes the influence of heat expansion and cold contraction,as well as the temperature coefficient of permittivity,on the sensor's temperature effect,and designs the reference capacitance and op-amp sensor measurement circuit to eliminate the temperature effect.国家国际合作基金(对俄合作项目2011DFR11160); 福建省高校产学研合作重大基金(3502Z20103012); 莆田市自然科学基金区域重大(2010G03)资助项

    CAN Bus Communication Node of the MCU and USB Communication with PC

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    介绍了应用PIC16f877和MCP2510实现CAn总线数据通信模块,模块内部采用SPI数据传输,并且利用fT245bl实现PC机与PIC单片机的uSb接口通信,组成一个演示系统。给出了系统结构框图与软硬件设计思路,提出了一种具有高可靠性、实时性和灵活性的CAn总线通信网络的实现方法。In this study,a module of CAN data communication using the PIC16F877 and MCP2510 is introduced.The SPI communication is used among the device in the module.And realized the USB interface communication between PC and PIC by using FT245BL,making up a show system.Give the diagram of the system's structure and the design of software and hardware,and propose a realized method about CAN bus communication network with high reliability,real-time and flexibility.福建省科技重大专项专题(2008HZ0002-1);福建省高等院校新世纪人才计划资助项

    Research on Wood Surface Detection Based on Computer Vision

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    基于机器视觉技术对板材表面缺陷检测进行研究,设计了在线检测的硬件系统和软件处理流程,介绍了图像预处理、图像分割和目标提取等处理方法并对缺陷图像进行相应处理。利用C#软件对板材缺陷在线检测进行人机交互界面设计和在线调试及在线检测。实验结果表明,本检测方法可行,误检率低,可很好地应用于木材自动化生产过程的在线检测。This paper presents a study into board surface defect detection based on machine vision technology.On-line detection hardware system and software processing procedure were designed in the study. This paper also described image preprocessing, image segmentation, and object extraction techniques and covered appropriate processing of defect images. C# software was utilized to develop MMI interfaces for on-line board surface defect detection. On- line debugging and on- line detection were carried out. It has been proven by experimentation that this detection approach was feasible and registered a low error detection rate, and may be thus used with advantage in on-line detection during automatic wood production process.福建省科技厅区域重大基金项目(2015H4009);; 莆田市科技计划基金项目(2014G15

    High temperature micro pressure sensor based on model identification

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    高温压力传感器应用在很多领域,由于高温将使放大电路工作失效,因而采用将放大电路与传感器件分离的设计方案是解决高温测量的方法之一。介绍一种将放大电路与传感器件分离的基于模型识别技术的微型电容式压力传感器。传感器件由MEMS工艺来实现,信号激励与信号处理由计算机来完成。对电路的工作过程进行了计算机仿真和试验,并给出了微型高温压力传感器的MEMS工艺设计流程。High temperature pressure sensor is applied in many fields. However, the amplifying circuit may be invalidate at high temperature. One way to solve this problem is to separate the amplifying circuit and sensor. A kind of high temperature micro pressure sensor based on model identification using this method is introduced, which is realized by MEMS process. Signal stimulation and disposal are accomplished by computer. The circuit is simulated and tested. And the MEMS process of the high temperature micro pressure sensor is designed

    Hige Temperature Pressure Microsensor Based on Model Identification

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    【中文文摘】高温测量是急需解决的测量问题之一。介绍一种将放大电路与信号传感器件分离的基于模型识别技术的高温微型电容式压力传感器。电阻电容信号滤波网络和信号的模型识别组成一个微型传感系统,在对滤波网络进行激励和模型识别后就可以得到变化的电容值。这种MEMS技术制作的硅玻璃键合的电容式压力传感器,可以在小于300℃环境下工作。此高温测量系统既满足高精度测量的要求,也避免了在高温环境中进行信号放大的难题。 【英文文摘】Measuring in high temperature is a problem in dire need of sloving.A kind of high temperature capacitive pressure microsensor based on model identification is introduced.The microsensor is made of RC signal filter and signal model identification.Can get a capacitor after inspiring the filter and model identification.It can work in a condition less than 300 ℃ .The high temperature measuring system with high precision avoids the trouble of amplifying signal in high temperature

    基于卷积神经网络的单色布匹瑕疵快速检测算法

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    针对布匹生产企业存在人工检测布匹瑕疵效率低、误检率、漏检率高的问题,提出一种基于深度卷积神经网络的单色布匹瑕疵检测算法.首先由于布匹瑕疵的数据规模远小于大型深度卷积神经网络的数据规模,如果采用大型卷积神经网络,计算量大且容易导致过拟合,因此设计了浅层的卷积神经网络结构;然后提出双网络并行的模型训练方法,用一个大网络指导小网络的训练过程,提高模型的训练效果;最后为了使得深度卷积神经网络模型脱离GPU的限制,能够在普通电脑、移动设备、嵌入式设备中高速运行,且保证模型检测精度,提出结合特征图优化卷积核参数的模型压缩算法.实验结果表明该算法可实现高准确率、高检测速度,在PC机的CPU模式下,检测速度为135 m/min,准确率可达到96.99%.国家自然科学基金(51605403);;2016年工信部智能制造综合标准化与新模式应用项目(2016-213

    类泛素蛋白及其中文命名

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    泛素家族包括泛素及类泛素蛋白,约20种成员蛋白.近年来,泛素家族领域取得了迅猛发展,并已与生物学及医学研究的各个领域相互交叉.泛素家族介导的蛋白质降解和细胞自噬机制的发现分别于2004和2016年获得诺贝尔奖.但是,类泛素蛋白并没有统一规范的中文译名. 2018年4月9日在苏州召开的《泛素家族介导的蛋白质降解和细胞自噬》专著的编委会上,部分作者讨论了类泛素蛋白的中文命名问题,并在随后的\"泛素家族、自噬与疾病\"(Ubiquitinfamily,autophagy anddiseases)苏州会议上提出了类泛素蛋白中文翻译草案,此草案在参加该会议的国内学者及海外华人学者间取得了高度共识.冷泉港亚洲\"泛素家族、自噬与疾病\"苏州会议是由美国冷泉港实验室主办、两年一度、面向全球的英文会议.该会议在海内外华人学者中具有广泛影响,因此,参会华人学者的意见具有一定的代表性.本文介绍了10个类别的类泛素蛋白的中文命名,系统总结了它们的结构特点,并比较了参与各种类泛素化修饰的酶和它们的生物学功能.文章由45名从事该领域研究的专家合作撰写,其中包括中国工程院院士1名,相关学者4名,长江学者3名,国家杰出青年科学基金获得者18名和美国知名高校华人教授4名.他们绝大多数是参加编写即将由科学出版社出版的专著《泛素家族介导的蛋白质降解和细胞自噬》的专家

    Study of Intelligent Photovoltaic Micro-grid and N+1 Control Pattern

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    Aiming to improve the control ability of distributed generation including photovoltaic power system, the fundamental concepts and its relative technologies of intelligent photovoltaic micro-grid are studied. The configuration of micro-grid and the electrical characteristics of terminal equipments, such as distributed generator, power storage, power quality adjustor, are introduced and analyzed. An Intelligent micro-grid control pattern with N+1 nodes based on communication network is proposed. The information integration of energy management and the interactive control among the generation, storage and power consumer in the intelligent photovoltaic micro-grid are realized

    Research on the Preparation Method of Free-handing Conductive Membrane with High Mechanical Sensitivity

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    微机电系统中的悬空薄膜的制备技术是微结构制备的关键技术之一.研究了周边固支方形薄膜的机械灵敏度及通过浓硼扩散自停止腐蚀法制备高灵敏度悬空导电薄膜.实验结果表明,当扩散温度为1 175℃,扩散时间为3H,去除硼硅玻璃后四甲基氢氧化铵(TMAH)腐蚀液中腐蚀7.5H,可得到厚度为3μM,边长为5MM,方块电阻为1.12Ω/SQ,致密均匀的悬空导电薄膜.给出了详细的制备工艺;针对扩散过程中出现的硼硅玻璃等问题,给出了切实可行的解决办法.The preparation method of the free-handing film in MEMS is one of the key technologies of micro structure preparation.This article focuses on the mechanical sensitivity of peripheral fixed supported square film and introduces how to fabricate highly sensitive free-handing film by adopting the deep boron-diffusion self-stopped etching technique.The experiment shows that when the silicon was diffused for 3 h at a temperature of 1 175 ℃ and then,after removing the borosilicate glass covering it,was etched in TMAH for 7.5 h,an even free-handing film which is 3 μm in thickness,5 mm in length and 1.12 Ω/sq in sheet resistance was fabricated.The article provides a detailed introduction to the preparation method of the free-handing film and proposes some feasible solutions to solve the problem of borosilicate glass that appears during the process of diffusion.福建省高校产学研合作科技重大项目(3502Z20103012);福建省教育厅B类课题基金(2006Y008);莆田市自然科学基金区域重大项目(2010G03

    A Low Vacuum Bonding Equipment under Normal Temperature and the Evaluation of Bonding Quality

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    键合工艺是微机电系统的重要工艺,是制作MEMS器件成功的关键.基于硅-硅键合技术,设计了一种能在低洁净、室温、常压环境下使用的低真空键合设备.介绍了基于该键合设备的键合工艺及键合质量的评价办法及标准.使用该设备对不同材质的样品进行键合实验,结果表明,键合出来的样品结合强度高,键合面没有缺陷,表明该设备有一定的实用性.The bonding technology is important and it's the key of MEMS equipment production.Based on the wafer bonding technology,an equipment for uniform force wafer bonding is designed which can be used to room temperature and low clean environment.The paper introduces the equipment and bonding quality evaluation.Experiments of different wafer bonding are carried out with the equipments.The results of the experiments indicate that the samples have good capability of combination and have no defect.It's proved that the equipments have practical value.莆田市科技局项目(2005G21
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