Exploration of Ring Oscillator Based Temperature Sensors Network Accuracy on FPGA

During the last decades, technology scaling in reconfigurable logic devices enabled implementing complicated designs which results in higher power density and on-chip temperature. Since higher operating temperature of chips is a critical problem in electronics devices, thermal management techniques are highly required. To provide a thermal map of reconfigurable logic devices, a network of sensors is needed. In this work, a ring-oscillator-based temperature sensor is used to create a sensor network. Then, a design space exploration is done among several sensor networks with the various sensor configurations including different ring oscillator length, the number of sensors in the examined network and various sampling time. We propose three criteria for exploring and comparing the efficiency of sensors network based on the thermal overhead and also measurement accuracy and precision among plenty of configurations on the Virtex-6 FPGA

Characterization of Interconnection Delays in FPGAS Due to Single Event Upsets and Mitigation

RÉSUMÉ L’utilisation incessante de composants électroniques à géométrie toujours plus faible a engendré de nouveaux défis au fil des ans. Par exemple, des semi-conducteurs à mémoire et à microprocesseur plus avancés sont utilisés dans les systèmes avioniques qui présentent une susceptibilité importante aux phénomènes de rayonnement cosmique. L'une des principales implications des rayons cosmiques, observée principalement dans les satellites en orbite, est l'effet d'événements singuliers (SEE). Le rayonnement atmosphérique suscite plusieurs préoccupations concernant la sécurité et la fiabilité de l'équipement avionique, en particulier pour les systèmes qui impliquent des réseaux de portes programmables (FPGA). Les FPGA à base de cellules de mémoire statique (SRAM) présentent une solution attrayante pour mettre en oeuvre des systèmes complexes dans le domaine de l’avionique. Les expériences de rayonnement réalisées sur les FPGA ont dévoilé la vulnérabilité de ces dispositifs contre un type particulier de SEE, à savoir, les événements singuliers de changement d’état (SEU). Un SEU est considérée comme le changement de l'état d'un élément bistable (c'est-à-dire, un bit-flip) dû à l'effet d'un ion, d'un proton ou d’un neutron énergétique. Cet effet est non destructif et peut être corrigé en réécrivant la partie de la SRAM affectée. Les changements de délai (DC) potentiels dus aux SEU affectant la mémoire de configuration de routage ont été récemment confirmés. Un des objectifs de cette thèse consiste à caractériser plus précisément les DC dans les FPGA causés par les SEU. Les DC observés expérimentalement sont présentés et la modélisation au niveau circuit de ces DC est proposée. Les circuits impliqués dans la propagation du délai sont validés en effectuant une modélisation précise des blocs internes à l'intérieur du FPGA et en exécutant des simulations. Les résultats montrent l’origine des DC qui sont en accord avec les mesures expérimentales de délais. Les modèles proposés au niveau circuit sont, aux meilleures de notre connaissance, le premier travail qui confirme et explique les délais combinatoires dans les FPGA. La conception d'un circuit moniteur de délai pour la détection des DC a été faite dans la deuxième partie de cette thèse. Ce moniteur permet de détecter un changement de délai sur les sections critiques du circuit et de prévenir les pannes de synchronisation engendrées par les SEU sans utiliser la redondance modulaire triple (TMR).----------ABSTRACT The unrelenting demand for electronic components with ever diminishing feature size have emerged new challenges over the years. Among them, more advanced memory and microprocessor semiconductors are being used in avionic systems that exhibit a substantial susceptibility to cosmic radiation phenomena. One of the main implications of cosmic rays, which was primarily observed in orbiting satellites, is single-event effect (SEE). Atmospheric radiation causes several concerns regarding the safety and reliability of avionics equipment, particularly for systems that involve field programmable gate arrays (FPGA). SRAM-based FPGAs, as an attractive solution to implement systems in aeronautic sector, are very susceptible to SEEs in particular Single Event Upset (SEU). An SEU is considered as the change of the state of a bistable element (i.e., bit-flip) due to the effect of an energetic ion or proton. This effect is non-destructive and may be fixed by rewriting the affected part. Sensitivity evaluation of SRAM-based FPGAs to a physical impact such as potential delay changes (DC) has not been addressed thus far in the literature. DCs induced by SEU can affect the functionality of the logic circuits by disturbing the race condition on critical paths. The objective of this thesis is toward the characterization of DCs in SRAM-based FPGAs due to transient ionizing radiation. The DCs observed experimentally are presented and the circuit-level modeling of those DCs is proposed. Circuits involved in delay propagation are reverse-engineered by performing precise modeling of internal blocks inside the FPGA and executing simulations. The results show the root cause of DCs that are in good agreement with experimental delay measurements. The proposed circuit level models are, to the best of our knowledge, the first work on modeling of combinational delays in FPGAs.In addition, the design of a delay monitor circuit for DC detection is investigated in the second part of this thesis. This monitor allowed to show experimentally cumulative DCs on interconnects in FPGA. To this end, by avoiding the use of triple modular redundancy (TMR), a mitigation technique for DCs is proposed and the system downtime is minimized. A method is also proposed to decrease the clock frequency after DC detection without interrupting the process

Modular embedded lightfield system for road condition assessment

To satisfy the requirements of road condition assessment an embedded lightfield system, combining 2D texture and 3D geometry, is required. An experimental prototype is proposed. Various approaches for lightfield acquisition were considered. In the end multi-view stereo was identified as the most suitable. Four camera pairs provide the raw data which is preprocessed and transmitted to the main processing unit, where the data is fused into one coherent dataset, via HDMI/DVI. Hybrid Zynq SoC technology was chosen to be able to support sequential and parallel computation paradigms. The system is adaptable to different fields of application due to its modular setup

Implementation of a fast relative digital temperature sensor to achieve thermal protection in Zynq SoC technology

<p>More and more industrial embedded systems are developed to undergo hard environmental conditions, especially high temperatures. To prevent this impact, environmental conditions (e.g. the temperature) could be monitored. Plenty of new industrial designs are built around SoCs, and more especially around the Zynq-7000 introduced by Xilinx in 2011. In fact, monitoring the temperature inside the Zynq has become a challenge. While many applications focused on precision, the application proposed here instead is in an industrial context and aims at detecting a temperature excess as fast as possible to achieve the thermal protection of a logic area of the chip. Most of the digital sensors designed require a calibration to be operational. Such a process is not viable for time to market, and a solution must be found to either lighten it (e.g. by doing a simple 3-points calibration) or simply avoiding it. Instead of measuring the temperature in an absolute way, this paper focuses on detecting if the temperature is above or below a threshold. This work exhibits the implementation of three temperature digital sensors with promising results on Zynq technology. Two of the presented sensors are based on a ring-oscillator and another uses a flip-flop as a sensing element. Results show that a temperature increase can be detected in less than 1ms without any calibration protocol and this sensor was found to perfectly fit the targeted application.</p