Architectural level delay and leakage power modelling of manufacturing process variation

PhD ThesisThe effect of manufacturing process variations has become a major issue regarding the estimation of circuit delay and power dissipation, and will gain more importance in the future as device scaling continues in order to satisfy market place demands for circuits with greater performance and functionality per unit area. Statistical modelling and analysis approaches have been widely used to reflect the effects of a variety of variational process parameters on system performance factor which will be described as probability density functions (PDFs). At present most of the investigations into statistical models has been limited to small circuits such as a logic gate. However, the massive size of present day electronic systems precludes the use of design techniques which consider a system to comprise these basic gates, as this level of design is very inefficient and error prone. This thesis proposes a methodology to bring the effects of process variation from transistor level up to architectural level in terms of circuit delay and leakage power dissipation. Using a first order canonical model and statistical analysis approach, a statistical cell library has been built which comprises not only the basic gate cell models, but also more complex functional blocks such as registers, FIFOs, counters, ALUs etc. Furthermore, other sensitive factors to the overall system performance, such as input signal slope, output load capacitance, different signal switching cases and transition types are also taken into account for each cell in the library, which makes it adaptive to an incremental circuit design. The proposed methodology enables an efficient analysis of process variation effects on system performance with significantly reduced computation time compared to the Monte Carlo simulation approach. As a demonstration vehicle for this technique, the delay and leakage power distributions of a 2-stage asynchronous micropipeline circuit has been simulated using this cell library. The experimental results show that the proposed method can predict the delay and leakage power distribution with less than 5% error and at least 50,000 times faster computation time compare to 5000-sample SPICE based Monte Carlo simulation. The methodology presented here for modelling process variability plays a significant role in Design for Manufacturability (DFM) by quantifying the direct impact of process variations on system performance. The advantages of being able to undertake this analysis at a high level of abstraction and thus early in the design cycle are two fold. First, if the predicted effects of process variation render the circuit performance to be outwith specification, design modifications can be readily incorporated to rectify the situation. Second, knowing what the acceptable limits of process variation are to maintain design performance within its specification, informed choices can be made regarding the implementation technology and manufacturer selected to fabricate the design

Fast and Robust Design of CMOS VCO for Optimal Performance

The exponentially growing design complexity with technological advancement calls for a large scope in the analog and mixed signal integrated circuit design automation. In the automation process, performance optimization under different environmental constraints is of prime importance. The analog integrated circuits design strongly requires addressing multiple competing performance objectives for optimization with ability to find global solutions in a constrained environment. The integrated circuit (IC) performances are significantly affected by the device, interconnect and package parasitics. Inclusion of circuit parasitics in the design phase along with performance optimization has become a bare necessity for faster prototyping. Besides this, the fabrication process variations have a predominant effect on the circuit performance, which is directly linked to the acceptability of manufactured integrated circuit chips. This necessitates a manufacturing process tolerant design. The development of analog IC design methods exploiting the computational intelligence of evolutionary techniques for optimization, integrating the circuit parasitic in the design optimization process in a more meaningful way and developing process fluctuation tolerant optimal design is the central theme of this thesis. Evolutionary computing multi-objective optimization techniques such as Non-dominated Sorting Genetic Algorithm-II and Infeasibility Driven Evolutionary Algorithm are used in this thesis for the development of parasitic aware design techniques for analog ICs. The realistic physical and process constraints are integrated in the proposed design technique. A fast design methodology based on one of the efficient optimization technique is developed and an extensive worst case process variation analysis is performed. This work also presents a novel process corner variation aware analog IC design methodology, which would effectively increase the yield of chips in the acceptable performance window. The performance of all the presented techniques is demonstrated through the application to CMOS ring oscillators, current starved and xi differential voltage controlled oscillators, designed in Cadence Virtuoso Analog Design Environment

Conformability analysis for the control of quality costs in electronic systems

The variations embodied in the production of electronic systems can cause that system to fail to conform to its specification with respect to Critical to Quality features. As a consequence of such failures the system manufacture may incur significant quality costs ranging from simple warranty returns up to legal liabilities. It can be difficult to determine both the probability that a system will fail to meet its specification and estimate the associated cost of failure. This thesis presents the Electronic Conformability Analysis (eCA) technique a novel methodology and supporting tool set for the assessment and control of quality costs associated with electronic systems. The technique addresses the three main elements of production affecting quality costs associated with electronic systems which are functionality, manufacturability and testability. Electronic Conformability Analysis combines statistical performance exploration with process capability indices, a modified form of Failure Modes and Effects Analysis and a cost mapping procedure. The technique allows the quality costs associated with design and manufacture induced failures to be assessed and the effectiveness of test strategies in reducing these costs to be determined. Through this analysis of costs the technique allows the potential trade-offs between these costs and those associated with design and process modifications to be explored. In support of the Electronic Conformability Analysis technique a number of new analysis tools have been developed. These tools enable the methodology to cope with the specific difficulties associated with the analysis of electronic systems. The technique has been applied to a number of analogue and mixed signal, safety critical circuits from automotive systems. These case studies have included several different levels of system complexity ranging from relatively simple transistor circuits to highly complex mechatronic systems. These case studies have shown that the technique is effective in a commercial design and manufacturing environment

Characterization of process variability and robust optimization of analog circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (p. 161-174).Continuous scaling of CMOS technology has enabled dramatic performance enhancement of CMOS devices and has provided speed, power, and density improvement in both digital and analog circuits. CMOS millimeter-wave applications operating at more than 50GHz frequencies has become viable in sub-100nm CMOS technologies, providing advantages in cost and high density integration compared to other heterogeneous technologies such as SiGe and III-V compound semiconductors. However, as the operating frequency of CMOS circuits increases, it becomes more difficult to obtain sufficiently wide operating ranges for robust operation in essential analog building blocks such as voltage-controlled oscillators (VCOs) and frequency dividers. The fluctuations of circuit parameters caused by the random and systematic variations in key manufacturing steps become more significant in nano-scale technologies. The process variation of circuit performance is quickly becoming one of the main concerns in high performance analog design. In this thesis, we show design and analysis of a VCO and frequency divider operating beyond 70GHz in a 65nm SOI CMOS technology. The VCO and frequency divider employ design techniques enlarging frequency operating ranges to improve the robustness of circuit operation. Circuit performance is measured from a number of die samples to identify the statistical properties of performance variation. A back-propagation of variation (BPV) scheme based on sensitivity analysis of circuit performance is proposed to extract critical circuit parameter variation using statistical measurement results of the frequency divider. We analyze functional failure caused by performance variability, and propose dynamic and static optimization methods to improve parametric yield. An external bias control is utilized to dynamically tune the divider operating range and to compensate for performance variation. A novel time delay model of a differential CML buffer is proposed to functionally approximate the maximum operating frequency of the frequency divider, which dramatically reduces computational cost of parametric yield estimation. The functional approximation enables the optimization of the VCO and frequency divider parametric yield with a reasonable amount of simulation time.by Daihyun Lim.Ph.D

Compact Models for Integrated Circuit Design

This modern treatise on compact models for circuit computer-aided design (CAD) presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models. Featuring exercise problems at the end of each chapter and extensive references at the end of the book, the text supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices. It ensures even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts

Worst-Case Analysis and Optimization of VLSI Circuit Performances

In this paper, we present a new approach for realistic worst-case analysis of VLSI circuit performances and a novel methodology for circuit performance optimization. Circuit performance measures are modeled as response surfaces of the designable and uncontrollable (noise) parameters. Worst-case analysis proceeds by first computing the worst-case circuit performance value and then determining the worst-case noise parameter values by solving a nonlinear programming problem. A new circuit optimization technique is developed to find an optimal design point at which all of the circuit specifications are met under worst-case conditions. This worst-case design optimization method is formulated as a constrained multi-criteria optimization. The methodologies described in this paper are applied to several VLSI circuits to demonstrate their accuracy and efficiency. Keywords Worst-case analysis, worst-case design optimization. I. Introduction I NEVITABLE fluctuations in the manufacturing proces..