4,401 research outputs found
Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.
Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them
Data Engineering for the Analysis of Semiconductor Manufacturing Data
We have analyzed manufacturing data from several different semiconductor
manufacturing plants, using decision tree induction software called
Q-YIELD. The software generates rules for predicting when a given product
should be rejected. The rules are intended to help the process engineers
improve the yield of the product, by helping them to discover the causes
of rejection. Experience with Q-YIELD has taught us the importance of
data engineering -- preprocessing the data to enable or facilitate
decision tree induction. This paper discusses some of the data engineering
problems we have encountered with semiconductor manufacturing data.
The paper deals with two broad classes of problems: engineering the features
in a feature vector representation and engineering the definition of the
target concept (the classes). Manufacturing process data present special
problems for feature engineering, since the data have multiple levels of
granularity (detail, resolution). Engineering the target concept is important,
due to our focus on understanding the past, as opposed to the more common
focus in machine learning on predicting the future
VLSI Revisited - Revival in Japan
This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government - through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors, Hitachi, Sony, Toshiba, Elpida, Renesas, Sematech, VLSI, JESSI, MEDEA, ASPLA, MIRAI, innovation system
VLSI REVISITED – REVIVAL IN JAPAN
This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government – through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors; Hitachi; Sony; Toshiba; Elpida; Renesas; Sematech; VLSI; JESSI; MEDEA; ASPLA; MIRAI; innovation system
A comparative analysis of the location behaviour of the US and European semiconductor manufacturers
Our paper analyses micro-level data from the US and European semiconductor manufacturers. In particular, we will focus on the plants undertaking the wafer manufacturing processes. We integrate a range of production technological indices with spatial data and regional economic variables in order to understand the issues determining the location behavior of the industry. Our results indicate that the locational behaviors of the US and European wafer plants do not correspond to an orthodox product-life-cycle model.
A comparison of industrial location behaviour within the US and European Semicondictor Industries
Our paper analyses micro-level data from the US and European semiconductor manufacturers. In particular, we will focus on the plants undertaking the wafer manufacturing processes. We integrate a range of production technological indices with spatial data and regional economic variables in order to understand the issues determining the location behavior of the industry. Our results indicate that the locational behaviors of the US and European wafer plants do not correspond to an orthodox product-life-cycle model.
Study and Implementation of an Optimized Modular Architecture for an ATE Test Environment
Implementation of a testbench module which is capable of integrating different Synopsys products. This implementation will optimize test speed in an ATE test environment
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