The Highly Miniaturised Radiation Monitor

We present the design and preliminary calibration results of a novel highly miniaturised particle radiation monitor (HMRM) for spacecraft use. The HMRM device comprises a telescopic configuration of active pixel sensors enclosed in a titanium shield, with an estimated total mass of 52 g and volume of 15 cm$^3$. The monitor is intended to provide real-time dosimetry and identification of energetic charged particles in fluxes of up to 10$^8$ cm$^{-2}$ s$^{-1}$ (omnidirectional). Achieving this capability with such a small instrument could open new prospects for radiation detection in space.Comment: 17 pages, 15 figure

On evolution of CMOS image sensors

CMOS Image Sensors have become the principal technology in majority of digital cameras. They started replacing the film and Charge Coupled Devices in the last decade with the promise of lower cost, lower power requirement, higher integration and the potential of focal plane processing. However, the principal factor behind their success has been the ability to utilise the shrinkage in CMOS technology to make smaller pixels, and thereby have more resolution without increasing the cost. With the market of image sensors exploding courtesy their inte- gration with communication and computation devices, technology developers improved the CMOS processes to have better optical performance. Nevertheless, the promises of focal plane processing as well as on-chip integration have not been fulfilled. The market is still being pushed by the desire of having higher number of pixels and better image quality, however, differentiation is being difficult for any image sensor manufacturer. In the paper, we will explore potential disruptive growth directions for CMOS Image sensors and ways to achieve the same

Advances on CMOS image sensors

This paper offers an introduction to the technological advances of image sensors designed using complementary metal–oxide–semiconductor (CMOS) processes along the last decades. We review some of those technological advances and examine potential disruptive growth directions for CMOS image sensors and proposed ways to achieve them. Those advances include breakthroughs on image quality such as resolution, capture speed, light sensitivity and color detection and advances on the computational imaging. The current trend is to push the innovation efforts even further as the market requires higher resolution, higher speed, lower power consumption and, mainly, lower cost sensors. Although CMOS image sensors are currently used in several different applications from consumer to defense to medical diagnosis, product differentiation is becoming both a requirement and a difficult goal for any image sensor manufacturer. The unique properties of CMOS process allows the integration of several signal processing techniques and are driving the impressive advancement of the computational imaging. With this paper, we offer a very comprehensive review of methods, techniques, designs and fabrication of CMOS image sensors that have impacted or might will impact the images sensor applications and markets

High Speed CMOS Image Sensor

abstract: High speed image sensors are used as a diagnostic tool to analyze high speed processes for industrial, automotive, defense and biomedical application. The high fame rate of these sensors, capture a series of images that enables the viewer to understand and analyze the high speed phenomena. However, the pixel readout circuits designed for these sensors with a high frame rate (100fps to 1 Mfps) have a very low fill factor which are less than 58%. For high speed operation, the exposure time is less and (or) the light intensity incident on the image sensor is less. This makes it difficult for the sensor to detect faint light signals and gives a lower limit on the signal levels being detected by the sensor. Moreover, the leakage paths in the pixel readout circuit also sets a limit on the signal level being detected. Therefore, the fill factor of the pixel should be maximized and the leakage currents in the readout circuits should be minimized. This thesis work presents the design of the pixel readout circuit suitable for high speed and low light imaging application. The circuit is an improvement to the 6T pixel readout architecture. The designed readout circuit minimizes the leakage currents in the circuit and detects light producing a signal level of 350µV at the cathode of the photodiode. A novel layout technique is used for the pixel, which improves the fill factor of the pixel to 64.625%. The read out circuit designed is an integral part of high speed image sensor, which is fabricated using a 0.18 µm CMOS technology with the die size of 3.1mm x 3.4 mm, the pixel size of 20µm x 20 µm, number of pixel of 96 x 96 and four 10-bit pipelined ADC’s. The image sensor achieves a high frame rate of 10508 fps and readout speed of 96 M pixels / sec.Dissertation/ThesisMasters Thesis Electrical Engineering 201

Pixellated radiation detectors for scientific applications

The work in this thesis is focused on characterisation and evaluation of two classes of science grade imaging radiation detectors. The first class is Monolithic Active Pixel Sensors (MAPS). The advances in CMOS fabrication technologies over the last four decades allowed MAPS to compete with Charge-Coupled Devices (CCD) in many applications. The technology also provides relatively inexpensive ways to tailor design to suit specific application needs. It is important to understand performance capabilities of new sensor designs through characterisation and optimisation of readout parameters. In this work three MAPSs were characterised. The first one - HEPAPS4 - designed for charged particle detection, with the potential technology application in the vertex detector for the International Linear Collider. The noise of the sensor was measured to be 35±5 e, which agrees well with simulated data. The dark current was found to be 175 pA/cm2. The SNR performance for minimum ionising particles detection was demonstrated to be 40. The sensor was also evaluated for indirect detection of thermal and fast neutrons using lithium and polyethylene converters. The technology performed well in such an application with an estimated fast neutron detection efficiency of ~0.01%. The second sensor characterised – Vanilla MAPS – was designed to evaluate new techniques for fast readout, small noise and reduced image lag. The system was capable to readout 150 full frames (520x520 pixels) per second; the sensor showed 14±4 e noise and decreased image lag. The dark current was found to be ~50 pA/cm2. The back-thinned version of the sensor demonstrated dramatic improvement in quantum efficiency from 0% to 20% at 220 nm. The third device is parametric sensor eLeNA. It features 14 test structure designed to evaluated noise reduction architectures. The most promising structures showed temporal noise values as low as 6 e and 20 e fixed pattern noise. Medipix as an example of the second class of imaging detectors - hybrid pixel detectors - was evaluated in two applications. It was used as the core element of the ATLAS radiation background monitoring system. The sensors were covered with neutron converters, which extended the number of radiation types that can be detected. X-ray calibration was performed, showing excellent tolerance of all 18 devices characterised. Detection efficiencies were estimated to be ~1% for thermal and ~0.1% for fast neutrons. The second application of Medipix was mass spectrometry. The detector was place in the focal plane of a prototype mass spectrometer. 2D representation of data allowed focusing correction of the ion beam. The system was capable to detect ions in the range of 5-25 keV. The detector characterisation with broad range of ions (from Cu to Pb) showed very good abundance agreement with table data

A Review on Digital Pixel Sensors

Digital pixel sensor (DPS) has evolved as a pivotal component in modern imaging systems and has the potential to revolutionize various fields such as medical imaging, astronomy, surveillance, IoT devices, etc. Compared to analog pixel sensors, the DPS offers high speed and good image quality. However, the introduced intrinsic complexity within each pixel, primarily attributed to the accommodation of the ADC circuit, engenders a substantial increase in the pixel pitch. Unfortunately, such a pronounced escalation in pixel pitch drastically undermines the feasibility of achieving high-density integration, which is an obstacle that significantly narrows down the field of potential applications. Nonetheless, designing compact conversion circuits along with strategic integration of 3D architectural paradigms can be a potential remedy to the prevailing situation. This review article presents a comprehensive overview of the vast area of DPS technology. The operating principles, advantages, and challenges of different types of DPS circuits have been analyzed. We categorize the schemes into several categories based on ADC operation. A comparative study based on different performance metrics has also been showcased for a well-rounded understanding

Ultra-low noise, high-frame rate readout design for a 3D-stacked CMOS image sensor

Due to the switch from CCD to CMOS technology, CMOS based image sensors have become smaller, cheaper, faster, and have recently outclassed CCDs in terms of image quality. Apart from the extensive set of applications requiring image sensors, the next technological breakthrough in imaging would be to consolidate and completely shift the conventional CMOS image sensor technology to the 3D-stacked technology. Stacking is recent and an innovative technology in the imaging field, allowing multiple silicon tiers with different functions to be stacked on top of each other. The technology allows for an extreme parallelism of the pixel readout circuitry. Furthermore, the readout is placed underneath the pixel array on a 3D-stacked image sensor, and the parallelism of the readout can remain constant at any spatial resolution of the sensors, allowing extreme low noise and a high-frame rate (design) at virtually any sensor array resolution. The objective of this work is the design of ultra-low noise readout circuits meant for 3D-stacked image sensors, structured with parallel readout circuitries. The readout circuit’s key requirements are low noise, speed, low-area (for higher parallelism), and low power. A CMOS imaging review is presented through a short historical background, followed by the description of the motivation, the research goals, and the work contributions. The fundamentals of CMOS image sensors are addressed, as a part of highlighting the typical image sensor features, the essential building blocks, types of operation, as well as their physical characteristics and their evaluation metrics. Following up on this, the document pays attention to the readout circuit’s noise theory and the column converters theory, to identify possible pitfalls to obtain sub-electron noise imagers. Lastly, the fabricated test CIS device performances are reported along with conjectures and conclusions, ending this thesis with the 3D-stacked subject issues and the future work. A part of the developed research work is located in the Appendices.Devido à mudança da tecnologia CCD para CMOS, os sensores de imagem em CMOS tornam se mais pequenos, mais baratos, mais rápidos, e mais recentemente, ultrapassaram os sensores CCD no que respeita à qualidade de imagem. Para além do vasto conjunto de aplicações que requerem sensores de imagem, o próximo salto tecnológico no ramo dos sensores de imagem é o de mudar completamente da tecnologia de sensores de imagem CMOS convencional para a tecnologia “3D-stacked”. O empilhamento de chips é relativamente recente e é uma tecnologia inovadora no campo dos sensores de imagem, permitindo vários planos de silício com diferentes funções poderem ser empilhados uns sobre os outros. Esta tecnologia permite portanto, um paralelismo extremo na leitura dos sinais vindos da matriz de píxeis. Além disso, num sensor de imagem de planos de silício empilhados, os circuitos de leitura estão posicionados debaixo da matriz de píxeis, sendo que dessa forma, o paralelismo pode manter-se constante para qualquer resolução espacial, permitindo assim atingir um extremo baixo ruído e um alto debito de imagens, virtualmente para qualquer resolução desejada. O objetivo deste trabalho é o de desenhar circuitos de leitura de coluna de muito baixo ruído, planeados para serem empregues em sensores de imagem “3D-stacked” com estruturas altamente paralelizadas. Os requisitos chave para os circuitos de leitura são de baixo ruído, rapidez e pouca área utilizada, de forma a obter-se o melhor rácio. Uma breve revisão histórica dos sensores de imagem CMOS é apresentada, seguida da motivação, dos objetivos e das contribuições feitas. Os fundamentos dos sensores de imagem CMOS são também abordados para expor as suas características, os blocos essenciais, os tipos de operação, assim como as suas características físicas e suas métricas de avaliação. No seguimento disto, especial atenção é dada à teoria subjacente ao ruído inerente dos circuitos de leitura e dos conversores de coluna, servindo para identificar os possíveis aspetos que dificultem atingir a tão desejada performance de muito baixo ruído. Por fim, os resultados experimentais do sensor desenvolvido são apresentados junto com possíveis conjeturas e respetivas conclusões, terminando o documento com o assunto de empilhamento vertical de camadas de silício, junto com o possível trabalho futuro