Plasmon-enhanced heat dissipation in GaN-based two-dimensional channels

Decay of nonequilibrium longitudinal optical (LO) phonons is investigated at room temperature in two-dimensional electron gas channels confined in nearly lattice-matched InAlN/AlN/GaN structures. A nonmonotonous dependence of the LO-phonon lifetime on the supplied electric power is reported for the first time and explained in terms of plasmon–LO-phonon resonance tuned by applied bias at a fixed sheet density (8×1012 cm−2). The shortest lifetime of 30±15 fs is found at the power of 20±10 nW/electron

DC, MICROWAVE, AND NOISE PROPERTIES OF GAN BASED HETEROJUNCTION FIELD EFFECT TRANSISTORS AND THEIR RELIABILITY ISSUES

AlGaN/GaN and InAlN/GaN-based heterojunction field effect transistors (HFETs) have demonstrated great high power and high frequency performance. Although AlGaN/GaN HFETs are commercially available, there still remain issues regarding long-term reliability, particularly degradation and ultimately device failure due to the gate-drain region where the electric field peaks. One of the proposed degradation mechanisms is the inverse-piezoelectric effect that results from the vertical electric field and increases the tensile strain. Other proposed mechanisms include hot-electron-induced trap generation, impurity diffusion, surface oxidation, and hot-electron/phonon effects. To investigate the degradation mechanism and its impact on DC, microwave, and noise performance, comprehensive stress experiments were conducted in both un-passivated and passivated AlGaN/GaN HFETs. It was found that degradation of AlGaN/GaN HFETs under reverse-gate-bias stress is dominated by inverse-piezoelectric effect and/or hot-electron injection due to gate leakage. Degradation under on-state-high-field stress is dominated by hot-electron/phonon effects, especially at high drain bias. Both effects are induced by the high electric field present during stress, where the inverse-piezoelectric effect only relates to the vertical electric field and the hot-electron effect relates to the total electric field. InAlN/GaN-based HFETs are expected to have even better performance as power amplifiers due to the large 2DEG density at the InAlN/GaN interface and better lattice-matching. Electrical stress experiments were therefore conducted on InAlN/GaN HFETs with indium compositions ranging from 15.7% to 20.0%. Devices with indium composition of 18.5% were found to give the best compromise between reliability and device performance. For indium compositions of 15.7% and 17.5%, the HFET devices degraded very fast (25 h) under on-state-high-field stress, while the HFET devices with 20.0% indium composition showed very small drain. It was also demonstrated that hot-electron/phonon effects are the major degradation mechanism for InAlN/GaN HFETs due to a large 2DEG density under on-state operations, whereas the inverse-piezoelectric effect is very small due to the small strain for the near lattice-matched InAlN barrier. Compared to lattice-matched InAlN/GaN HFETs, AlGaN/GaN HFETs have much larger strain in the barrier and about half of the drain current level; however, the hot electron/hot phonon effects are still important, especially at high drain bias

Tuning of electrical properties in InAlN/GaN HFETs and Ba0.5Sr0.5TiO3/YIG Phase Shifters

Engineers know well from an early point in their training the trials and tribulations of having to make design tradeoffs in order to optimize one performance parameter for another. Discovering tradeoff conditions that result in the elimination of a loss associated with the enhancement of some other parameter (an improvement over a typical tradeoff), therefore, ushers in a new paradigm of design in which the constraints which are typical of the task at hand are alleviated. We call such a design paradigm “tuning” as opposed to “trading off”, and this is the central theme of this work. We investigate two types of microwave electronic devices, namely GaN-based heterostructure field effect transistors (HFETs) and tunable ferroelectric-ferrite-based microwave phase shifters. The “tuning” associated with these types of devices arises from the notion of an optimal 2DEG density, capable of achieving higher performance in terms of electron velocity and enhanced reliability in the case of the HFET, and the coupling of ferroelectric and ferrite materials in tunable microwave phase shifters, capable of achieving high differential phase shifts while at the same time mitigating the losses associated with impedance mismatching which typically arise when the phase is tuned. Promises and problems associated with HFET devices based on the intriguing InAlN/GaN material system will be described. We focus on the fundamental problem associated with the induction of the large density of carriers at the interface, namely the disintegration of an excess of longitudinal optical phonons (hot phonons) in the channel. We use microwave measurements in conjunction with stress tests to evidence the existence of an optimal 2DEG density wherein the hot phonon effect can be “tuned,” which allows for enhanced high frequency performance as well as device reliability. Next, we focus on the design, fabrication, and measurement of tunable phase shifters consisting of thin films of BaxSr1-xTiO3 (BST), which has the advantage of having high dielectric tunability as well as relatively low microwave loss. We discuss the design, fabrication, and measurement of a simple coplanar waveguide (CPW) type of phase shifter as well as a more complicated “hybrid” phase shifter consisting of a ferrite (YIG) in addition to BST. The use of such a bilayer allows one to “tune” the impedance of the phase shifters independently of the phase velocity through careful selection of the DC biasing magnetic fields, or alternatively through the use of an additional piezoelectric layer, bonded to YIG whose permeability can then be tuned through magnetostriction