Design of an Efficient Interconnection Network of Temperature Sensors

Temperature has become a first class design constraint because high temperatures adversely affect circuit reliability, static power and degrade the performance. In this scenario, thermal characterization of ICs and on-chip temperature monitoring represent fundamental tasks in electronic design. In this work, we analyze the features that an interconnection network of temperature sensors must fulfill. Departing from the network topology, we continue with the proposal of a very light-weight network architecture based on digitalization resource sharing. Our proposal supposes a 16% improvement in area and power consumption compared to traditional approache

System-on-Chip monitoring networks targeting nanometer technologies

• Millions 
of
 transistors 
in
 a
 single 
die 
allow 
the
 implementation of 
very 
complex 
architectures:
 ▫ SoC,
MPSoC,
NoC,
MulH‐core 
processo

On-chip Monitoring: A Light-Weight Interconnection Network Approach

Current nanometer technologies are subjected to several adverse effects that seriously impact the yield and performance of integrated circuits. Such is the case of within-die parameters uncertainties, varying workload conditions, aging, temperature, etc. Monitoring, calibration and dynamic adaptation have appeared as promising solutions to these issues and many kinds of monitors have been presented recently. In this scenario, where systems with hundreds of monitors of different types have been proposed, the need for light-weight monitoring networks has become essential. In this work we present a light-weight network architecture based on digitization resource sharing of nodes that require a time-to-digital conversion. Our proposal employs a single wire interface, shared among all the nodes in the network, and quantizes the time domain to perform the access multiplexing and transmit the information. It supposes a 16% improvement in area and power consumption compared to traditional approaches

A Light-Weight On-Chip Monitoring Network for Dynamic Adaptation and Calibration

Current nanometer technologies suffer within-die parameter uncertainties, varying workload conditions, aging, and temperature effects that cause a serious reduction on yield and performance. In this scenario, monitoring, calibration, and dynamic adaptation become essential, demanding systems with a collection of multi purpose monitors and exposing the need for light-weight monitoring networks. This paper presents a new monitoring network paradigm able to perform an early prioritization of the information. This is achieved by the introduction of a new hierarchy level, the threshing level. Targeting it, we propose a time-domain signaling scheme over a single-wire that minimizes the network switching activity as well as the routing requirements. To validate our approach, we make a thorough analysis of the architectural trade-offs and expose two complete monitoring systems that suppose an area improvement of 40% and a power reduction of three orders of magnitude compared to previous works

Thermal profiling of homogeneous multi-core processors using sensor mini-networks

With large-scale integration and high power density in current generation microprocessors, thermal management is becoming a critical component of system design. Specifically, accurate thermal monitoring using on-die sensors is vital for system reliability and recovery. Achieving an accurate thermal profile of a system with an optimal number of sensors is integral for thermal management. This work focuses on a sensor placement mechanism and an on-chip sensor mini-network to combine temperatures from multiple sensors to determine the full thermal profile of a chip. The sensor placement mechanism proposed in this work uses non-uniform subsampling of thermal maps with k-means clustering. Using this sensing technique with cubic interpolation, an 8-core architecture thermal map was successfully recovered with an average error improvement of 90% over sensor placement via basic k-means clustering. All the simulations were run using HotSpot 5.0 modeling Alpha 21364 processor as a baseline core. The sensor mini-network using both differential encoding and distributed source coding was analyzed on a 1024-core architecture. Distributed source coding compression required fewer transmissions than differential encoding and reduced the number of transmitted bits by 36% over a sensor mini-network with no compression

Tracing the Thermal Behavior of ICs

Scaling down of ICs and the increased packaging densities resulted in increased concern about thermal issues during the design of ICs and their packages. In this paper the advances in the thermal design, measuring and testing methods of ICs are discussed. After presenting the state-of-the-art in the thermal and electro-thermal simulation and measurement methods the idea and methodological questions of the Design for Thermal Testability (DfTT) are discussed. Thermal characterization problems of IC packages are reviewed shortly