Benchmarking for high-level synthesis

This paper discusses issues in benchmarking for synthesis, and suggests techniques for the comparison of benchmark descriptions, the synthesis tools used, as well as the synthesized designs finally generated. We propose a classification scheme for the assumptions made for the comparison of different synthesis tools, and present an Assumptions Chart that can be used to visualize different benchmarks, tools and synthesis results. We illustrate application of this Assumptions Chart using synthesis experiments that were conducted on some sample High-Level Synthesis Workshop bench-marks

Directed Placement for mVLSI Devices

Continuous-flow microfluidic devices based on integrated channel networks are becoming increasingly prevalent in research in the biological sciences. At present, these devices are physically laid out by hand by domain experts who understand both the underlying technology and the biological functions that will execute on fabricated devices. The lack of a design science that is specific to microfluidic technology creates a substantial barrier to entry. To address this concern, this article introduces Directed Placement, a physical design algorithm that leverages the natural "directedness" in most modern microfluidic designs: fluid enters at designated inputs, flows through a linear or tree-based network of channels and fluidic components, and exits the device at dedicated outputs. Directed placement creates physical layouts that share many principle similarities to those created by domain experts. Directed placement allows components to be placed closer to their neighbors compared to existing layout algorithms based on planar graph embedding or simulated annealing, leading to an average reduction in laid-out fluid channel length of 91% while improving area utilization by 8% on average. Directed placement is compatible with both passive and active microfluidic devices and is compatible with a variety of mainstream manufacturing technologies

Silicon compilation

Silicon compilation is a term used for many different purposes. In this paper we define silicon compilation as a mapping from some higher level description into layout. We define the basic issues in structural and behavioral silicon compilation and some possible solutions to those issues. Finally, we define the concept of an intelligent silicon compiler in which the compiler evaluates the quality of the generated design and attempts to improve it if it is not satisfactory

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects

Innovative teaching of IC design and manufacture using the Superchip platform

In this paper we describe how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design by designing and manufacturing their own ICs. To achieve this, an efficient chip architecture, the “Superchip”, has been developed, which allows multiple student designs to be fabricated on a single IC, and encapsulated in a standard package without excessive cost in terms of time or resources. We demonstrate how the practical process has been tightly coupled with theoretical aspects of the degree course and how transferable skills are incorporated into the design exercise. Furthermore, the students are introduced at an early stage to the key concepts of team working, exposure to real deadlines and collaborative report writing. This paper provides details of the teaching rationale, design exercise overview, design process, chip architecture and test regime

Tactical Military Communication Networks of the Future .

Military communication has the added dimension of mobility and bandwidth conservation. The paper deals with the necessity of advanced concepts of communicating images. data and fax in addition to voice as dictated by the command and control requirements. The Integrated services digital network as applied to tactical network of the future is presented. The topics of routing, encryption, mobile access, digital links are briefly covered. The importance of standards of CCITT and contemporary techniques like B-ISDN, cellular radios are discussed. The relevance of network management and its main features are brought out

OutFlank Routing: Increasing Throughput in Toroidal Interconnection Networks

We present a new, deadlock-free, routing scheme for toroidal interconnection networks, called OutFlank Routing (OFR). OFR is an adaptive strategy which exploits non-minimal links, both in the source and in the destination nodes. When minimal links are congested, OFR deroutes packets to carefully chosen intermediate destinations, in order to obtain travel paths which are only an additive constant longer than the shortest ones. Since routing performance is very sensitive to changes in the traffic model or in the router parameters, an accurate discrete-event simulator of the toroidal network has been developed to empirically validate OFR, by comparing it against other relevant routing strategies, over a range of typical real-world traffic patterns. On the 16x16x16 (4096 nodes) simulated network OFR exhibits improvements of the maximum sustained throughput between 14% and 114%, with respect to Adaptive Bubble Routing.Comment: 9 pages, 5 figures, to be presented at ICPADS 201

Channel Characterization for Chip-scale Wireless Communications within Computing Packages

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses.Comment: To be presented 12th IEEE/ACM International Symposium on Networks-on-Chip (NOCS 2018); Torino, Italy; October 201

An adaptive method to tolerate soft errors in SRAM-based FPGAs

AbstractIn this paper, we present an adaptive method that is a combination of SEU-avoidance in CAD flow and adaptive redundancy to tolerate soft error effects in SRAM-based FPGAs. This method is based on the modification of T-VPack and VPR tools. Three different steps of these tools are modified for SEU-awareness: (1) clustering, (2) placement and (3) routing. Then we use the unused resources as redundancy. We have investigated the effect of this method on several MCNC benchmarks. This investigation has been performed using three experiments: (1) SEU-awareness in clustering with redundancy, (2) SEU-awareness in clustering and placement with redundancy and (3) SEU-awareness in clustering, placement and routing with redundancy. With a confidence level of 95%, the results show that, using each of these three experiments, the system failure rate of ten MCNC circuits has been decreased between 4.52% and 10.42%, between 10.25% and 21.63%, and between 10.48% and 24.39%, respectively