Bond graph simulation of error propagation in position estimation of a hydraulic cylinder using low cost accelerometers

The indirect calculation from acceleration of transversal displacement of the piston inside the body of a double effect linear hydraulic cylinder during its operating cycle is assessed. Currently an extensive effort exists in the improvement of the mechanical and electronic design of the highly sophisticated MEMS accelerometers. Nevertheless, the predictable presence of measurement errors in the current commercial accelerometers is the main origin of velocity and displacement measurement deviations during integration of the acceleration. A bond graph numerical simulation model of the electromechanical system has been developed in order to forecast the effect of several measurement errors in the use of low cost two axes accelerometers. The level of influence is assessed using quality indicators and visual signal evaluation, for both simulations and experimental results. The obtained displacements results are highly influenced by the diverse dynamic characteristics of each measuring axis. The small measuring errors of a simulated extremely high performance sensor generate only moderate effects in longitudinal displacement but deep deviations in the reconstruction of piston transversal movements. The bias error has been identified as the source of the higher deviations of displacement results; although, its consequences can be easily corrected.Peer ReviewedPostprint (published version

Development and implementation of a deflection amplification mechanism for capacitive accelerometers

Micro-Electro-Mechanical-Systems (MEMS) and especially physical sensors are part of a flourishing market ranging from consumer electronics to space applications. They have seen a great evolution throughout the last decades, and there is still considerable research effort for further improving their performance. This is reflected by the plethora of commercial applications using them but also by the demand from industry for better specifications. This demand together with the needs of novel applications fuels the research for better physical sensors.Applications such as inertial, seismic, and precision tilt sensing demand very high sensitivity and low noise. Bulk micromachined capacitive inertial sensors seem to be the most viable solution as they offer a large inertial mass, high sensitivity, good noise performance, they are easy to interface with, and of low cost. The aim of this thesis is to improve the performance of bulk micromachined capacitive sensors by enhancing their sensitivity and noise floor.MEMS physical sensors, most commonly, rely on force coupling and a resulting deflection of a proof mass or membrane to produce an output proportional to a stimulus of the physical quantity to be measured. Therefore, the sensitivity to a physical quantity may be improved by increasing the resulting deflection of a sensor. The work presented in this thesis introduces an approach based on a mechanical motion amplifier with the potential to improve the performance of mechanical MEMS sensors that rely on deflection to produce an output signal.The mechanical amplifier is integrated with the suspension system of a sensor. It comprises a system of micromachined levers (microlevers) to enhance the deflection of a proof mass caused by an inertial force. The mechanism can be used in capacitive accelerometers and gyroscopes to improve their performance by increasing their output signal. As the noise contribution of the electronic read-out circuit of a MEMS sensor is, to first order, independent of the amplitude of its input signal, the overall signal-to-noise ratio (SNR) of the sensor is improved.There is a rather limited number of reports in the literature for mechanical amplification in MEMS devices, especially when applied to amplify the deflection of inertial sensors. In this study, after a literature review, mathematical and computational methods to analyse the behaviour of microlevers were considered. By using these methods the mechanical and geometrical characteristics of microlevers components were evaluated. In order to prove the concept, a system of microlevers was implemented as a mechanical amplifier in capacitive accelerometers.All the mechanical structures were simulated using Finite Element Analysis (FEA) and system level simulations. This led to first order optimised devices that were used to design appropriate masks for fabrication. Two main fabrication processes were used; a Silicon on Insulator (SOI) process and a Silicon on Glass (SoG) process. The SOI process carried out at the University of Southampton evolved from a one mask to a two mask dicing free process with a yield of over 95%, in its third generation. The SoG is a well-established process at the University of Peking that uses three masks.The sensors were evaluated using both optical and electrical means. The results from the first prototype sensor design (1HAN) revealed an amplification factor of 40 and a mechanically amplified sensitivity of 2.39V/g. The measured natural frequency of the first mode of the sensor was at 734Hz and the full-scale measurement range was up to 7g with a maximum nonlinearity of 2%. The measurements for all the prototype sensor designs were very close to the predicted values with the highest discrepancy being 22%. The results of this research show that mechanical amplification is a very promising concept that can offer increased sensitivity in inertial sensors without increasing the noise. Experimental results show that there is plenty of room for improvement and that viable solutions may be produced by using the presented approach. The applications of this scheme are not restricted only to inertial sensors but as the results show it can be used in a broader range of micromachined devices

Factory Oriented Technique for Thermal Drift Compensation in MEMS Capacitive Accelerometers

Capacitive MEMS accelerometers have a high thermal sensitivity that drifts the output when subjected to changes in temperature. To improve their performance in applications with thermal variations, it is necessary to compensate for these effects. These drifts can be compensated using a lightweight algorithm by knowing the characteristic thermal parameters of the accelerometer (Temperature Drift of Bias and Temperature Drift of Scale Factor). These parameters vary in each accelerometer and axis, making an individual calibration necessary. In this work, a simple and fast calibration method that allows the characteristic parameters of the three axes to be obtained simultaneously through a single test is proposed. This method is based on the study of two specific orientations, each at two temperatures. By means of the suitable selection of the orientations and the temperature points, the data obtained can be extrapolated to the entire working range of the accelerometer. Only a mechanical anchor and a heat source are required to perform the calibration. This technique can be scaled to calibrate multiple accelerometers simultaneously. A lightweight algorithm is used to analyze the test data and obtain the compensation parameters. This algorithm stores only the most relevant data, reducing memory and computing power requirements. This allows it to be run in real time on a low-cost microcontroller during testing to obtain compensation parameters immediately. This method is aimed at mass factory calibration, where individual calibration with traditional methods may not be an adequate option. The proposed method has been compared with a traditional calibration using a six-sided orthogonal die and a thermal camera. The average difference between the compensations according to both techniques is 0.32 mg/°C, calculated on an acceleration of 1 G; the maximum deviation being 0.6 mg/°C

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Self-Calibration Technique with Lightweight Algorithm for Thermal Drift Compensation in MEMS Accelerometers

Capacitive MEMS accelerometers have a high thermal sensitivity that drifts the output when subjected to changes in temperature. To improve their performance in applications with thermal variations, it is necessary to compensate for these effects. These drifts can be compensated using a lightweight algorithm by knowing the characteristic thermal parameters of the accelerometer (Temperature Drift of Bias and Temperature Drift of Scale Factor). These parameters vary in each accelerometer and axis, making an individual calibration necessary. In this work, a simple and fast calibration method that allows the characteristic parameters of the three axes to be obtained simultaneously through a single test is proposed. This method is based on the study of two specific orientations, each at two temperatures. By means of the suitable selection of the orientations and the temperature points, the data obtained can be extrapolated to the entire working range of the accelerometer. Only a mechanical anchor and a heat source are required to perform the calibration. This technique can be scaled to calibrate multiple accelerometers simultaneously. A lightweight algorithm is used to analyze the test data and obtain the compensation parameters. This algorithm stores only the most relevant data, reducing memory and computing power requirements. This allows it to be run in real time on a low-cost microcontroller during testing to obtain compensation parameters immediately. This method is aimed at mass factory calibration, where individual calibration with traditional methods may not be an adequate option. The proposed method has been compared with a traditional calibration using a six tests in orthogonal directions and a thermal chamber with a relative error difference of 0.3%

Micro-g MEMS accelerometer based on time measurement

Programa Doutoral em Engenharia Electrónica e de ComputadoresThe MEMS sensor market has experienced an amazing growth on the last decades, with accelerometers being one of the pioneers pushing the technology into widespread use with its applications on automotive industry. Since then, accelerometers have been gradually replacing conventional sensors due mainly to its lower cost. As the performance of MEMS accelerometers improves, the applications range where they replace conventional accelerometers increases. Nowadays, there is still a large range of applications for which suitable MEMS accelerometers are yet to be developed. This work focuses on the development of a high performance accelerometer taking advantage of the high sensitivity of a non-linear phenomenon that occurs in electrostatically actuated movable capacitive microdevices: electrostatic pull-in. Although the pull-in effect has been known for more than 40 years, it is usually avoided when dealing with movable microstructures as it leads to a region of instability, where the position of movable parts cannot be fully controlled. In the last decade, the pull-in displacement profile of 1-DOF parallel-plates devices has been the subject of research that revealed the presence of a so-called meta-stability. This meta-stability occurs in specific damping and voltage actuation conditions and translates as a non-linear displacement profile, rather than simple time-of-flight. This feature makes the pull-in time duration significantly longer, and it happens to be extremely sensitive to intervenient forces, such as external acceleration. Basically, measuring the pull-in time of specifically designed microstructures (while maintaining the other parameters constant) allows the measurement of the external acceleration that acts on the system. Using a pull-in time measurement rather than direct capacitance/displacement/acceleration transduction presents several advantages. The most important is the fact that time can be measured very accurately with technology readily available. For instance, if one uses a 100MHz clock on the time counting mechanism, which corresponds to a time measurement resolution of 100 ns, given the 0.26 μs/μg sensitivity of the accelerometer developed in this work, an acceleration resolution of 0.38 μg could be achieved. One of the main challenges of the time based accelerometer development is the damper design, as damping is of outmost importance in defining the accelerometer performance parameters, namely sensitivity and noise. A new squeeze-film damper geometry design has been presented and studied. It consists of flow channels implemented on the parallel-plates that relieve the squeeze-film damping pressures generated when the device is moving. This geometry has proved to be very effective in increasing the capacitance/damping ratio in parallel-plates, which was up to now a great challenge of in-plane parallel-plates design. This work reports the development of an open-loop accelerometer with 0.26 μs/μg sensitivity and 2.7 μg /√Hz noise performance. The MEMS structures used for its experimental implementation were fabricated using a commercially available SOI micromachining process. The main drawbacks of this accelerometer were the low system bandwidth and non-linearity. Closed-loop approaches using electrostatic feedback were explored in this work in order to overcome these limitations, and the dynamic range was successfully extended to 109 dB along with improvements on the linearity. From the thorough damping study performed in this work, a new application for the pullin time using the same microstructures was developed. It consists of a gas viscosity sensing application. At the low frequencies operated, damping is directly proportional to the viscosity of the gas medium. The experimental results obtained with gases with viscosities ranging from 8 μP to 18 μP have shown a sensitivity of 2 ms/μP, making the pull-in time viscosity sensor a very promising approach.Nas últimas décadas assistiu-se a um imenso crescimento no mercado de sensors MEMS, tendo os acelerómetros sido uma das maiores forças impulsionadoras desse crescimento devido às suas aplicações na indústria automóvel. Desde então, a gama de aplicações destes sensores expandiu-se multidirecionalmente, novas aplicações emergiram e acelerómetros convencionais em aplicações já existentes foram substituídos por acelerómetros MEMS. Isto deve-se essencialmente ao seu baixo custo e pequenas dimensões. Há no entanto, aplicações para as quais o desempenho dos acelerómetros MEMS ainda não é suficiente. O objectivo deste trabalho é desenvolver um acelerómetro de elevado desempenho tirando partido da elevada sensibilidade do efeito de pull-in a forças externas tais como a aceleração. O efeito de pull-in, descrito pela primeira vez há mais de 40 anos, ocorre em dispositivos capacitivos com partes móveis. Este é um efeito não-linear geralmente evitado/indesejado, uma vez que se traduz numa instabilidade que dificulta o controlo da posição das partes móveis. Na última década foi dedicada alguma investigaçao científica a este fenómeno, tendo sido descoberta a existência de um perfil de deslocamento particular, denominado meta-estabilidade, em determinadas condições de amortecimento e de actuação electrostática. Esta característica do pull-in torna a sua duração extremamente sensível a variações nas forças intervenientes, incluindo aceleração externa. Assim sendo, a medição do tempo de pull-in de micro-estruturas especificamente concebidas para o efeito pode ser utilizada para medir aceleração. Esta abordagem apresenta vantagens significativas em comparação com a transdução direta de capacidade para aceleração (caso da generalidade dos acelerómetros capacitivos). Nomeadamente, a variável tempo pode ser medida com elevada precisão com relativa facilidade e sem necessidade de desenvolvimentos tecnológicos (o que não é o caso da medição de capacidade). Por exemplo, o uso de uma frequência de relógio de 100 MHz no mecanismo de contagem de tempo permite uma resolução de 100 ns na medição de tempo, o que corresponde, considerando a sensibilidade de 0.26 μs/μg do acelerómetro desenvolvido neste trabalho, a uma resolução na medição de acceleração de 0.38μg. Um dos maiores desafios do desenvolvimento de um acelerómetro baseado no tempo de pull-in é o desenho do amortecedor, pois a sensibilidade e o ruído/resolução do sensor final dependem do nível de amortecimento. Uma nova geometria para o amortecedor (estabelecido por um mecanismo de squeeze-film) é apresentada e estudada neste trabalho. Esta consiste em abrir canais nas placas paralelas facilitando assim o fluxo de ar quando as placas se movem. Ficou provado que esta geometria é eficaz na redução da razão capacidade/amortecimento, o que constituía um problema recorrente no desenho de dispositivos de placas paralelas in-plane. Neste trabalho é descrito o desenvolvimento de um acelerómetro em malha aberta com uma sensibilidade de 0.26 μs/μg e 2.7 μg /√Hz de ruído. As estruturas MEMS utilizadas na sua implementação foram fabricadas num processo de microfabrico SOI comercial. As principais desvantagens desta abordagem são pequena gama dinâmica devido à não-linearidade da resposta. Neste trabalho foram exploradas abordagens em malha fechada, usando feedback electrostático, de modo a ultrapassar estas limitações, tendo sido alcançado um aumento da gama dinâmica para 109 dB, com grandes melhoria na linearidade. Uma nova aplicação para o tempo de pull-in foi também desenvolvida: medição de viscosidade de gases. Uma vez que as microstruturas utilizadas são operadas a baixas frequências, o amortecimento é proporcional à viscosidade. O estudo efectuado mostra que o tempo de pull-in é muito sensível ao amortecimento e portanto a variações de viscosidade. Os resultados experimentais obtidos com gases e misturas de gases com viscosidades entre 8 μP e 18 μP mostraram uma sensibilidade de 2 ms/μP, confirmando o potencial da utilização de tempo de pull-in na medição de viscosidade.The author, Rosana Maria Alves Dias, was supported by Portuguese Foundation for Science and Technology (SFRH/BD/46030/2008)

Development Of Tilt And Vibration Measurement And Detection System Using MEMS Accelerometer As A Sensor [TK7875. K45 2008 f rb].

Dalam projek ini, sistem pengukuran dan pengesan isyarat sudut miring dan isyarat getaran menggunakan meter pecutan MEMS yang mempunyai dua paksi deria X dan Y dibina dengan jayanya. In this project, a measurement and detection system to detect tilt angle signal and vibration signal using MEMS accelerometer which has two sensed axes X and Y was successfully developed

Lightweight thermal compensation technique for MEMS capacitive accelerometer oriented to quasi-static measurements

The application of MEMS capacitive accelerometers is limited by its thermal dependence, and each accelerometer must be individually calibrated to improve its performance. In this work, a light calibration method based on theoretical studies is proposed to obtain two characteristic parameters of the sensor’s operation: the temperature drift of bias and the temperature drift of scale factor. This method requires less data to obtain the characteristic parameters, allowing a faster calibration. Furthermore, using an equation with fewer parameters reduces the computational cost of compensation. After studying six accelerometers, model LIS3DSH, their characteristic parameters are obtained in a temperature range between 15 °C and 55 °C. It is observed that the Temperature Drift of Bias (TDB) is the parameter with the greatest influence on thermal drift, reaching 1.3 mg/°C. The Temperature Drift of Scale Factor (TDSF) is always negative and ranges between 0 and −400 ppm/°C. With these parameters, the thermal drifts are compensated in tests with 20 °C of thermal variation. An average improvement of 47% was observed. In the axes where the thermal drift was greater than 1 mg/°C, the improvement was greater than 80%. Other sensor behaviors have also been analyzed, such as temporal drift (up to 1 mg/h for three hours) and self-heating (2–3 °C in the first hours with the corresponding drift). Thermal compensation has been found to reduce the effect of the latter in the first hours after power-up of the sensor by 43%

Impact of Thermal Variations and Soldering Process on Performance and Behavior of MEMS Capacitive Accelerometers

This work presents an analysis of performance and multiple parameters of microelectromechanical system (MEMS) capacitive accelerometers in applications with large thermal variations and the effects of the soldering process on them. The proposed test consists of a thermal characterization phase performed between two mechanical calibrations. The test is performed on multiple units before and after the soldering process. Mechanical, thermal, and performance parameters are analyzed and compared among all tests. The ranges and relative variations of these characteristics, both during the soldering process and the tests, have been identified and characterized individually. Mechanical bias shows greater variability than other parameters in both the soldering process and thermal tests. On the contrary, the thermal characteristic parameters show great stability in all cases. The thermal drifts, which are the main source of error in environments with large thermal variations, are successfully compensated for using a model with only two characteristic parameters. According to the observed behaviors, negative thermal variations (toward cooler temperatures) might be more suitable for thermal calibration due to other effects, such as creep, taking place primarily at hotter temperatures. The creep effect at constant temperature is analyzed according to the Kelvin–Voigt model with promising results, and a possible link between thermal drift and creep effects is presented. Performance results are calculated in multiple compensation scenarios. Using the proposed compensation techniques, the average maximum error is reduced from over 70 to 7 mg and the uncertainty is also reduced to a third of the initial value

Reliability of Microelectromechanical Systems Devices

Microelectromechanical systems (MEMS) reliability issues, apart from traditional failure mechanisms like fatigue, wear, creep, and contamination, often involve many other specific mechanisms which do not damage the system’s function but may degrade the performance of MEMS devices. This chapter focuses on the underlying mechanisms of specific reliability issues, storage long-term drift and thermal drift. The comb finger capacitive micro-accelerometers are selected as the case for this study. The material viscoelasticity of packaging adhesive and thermal effects induced by structure layout are considered so as to explain the physical phenomenon of output change over time and temperature. Each section showcases the corresponding experiments and analysis of reliability