A Review of Bayesian Methods in Electronic Design Automation

The utilization of Bayesian methods has been widely acknowledged as a viable solution for tackling various challenges in electronic integrated circuit (IC) design under stochastic process variation, including circuit performance modeling, yield/failure rate estimation, and circuit optimization. As the post-Moore era brings about new technologies (such as silicon photonics and quantum circuits), many of the associated issues there are similar to those encountered in electronic IC design and can be addressed using Bayesian methods. Motivated by this observation, we present a comprehensive review of Bayesian methods in electronic design automation (EDA). By doing so, we hope to equip researchers and designers with the ability to apply Bayesian methods in solving stochastic problems in electronic circuits and beyond.Comment: 24 pages, a draft version. We welcome comments and feedback, which can be sent to [email protected]

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Advanced Image Acquisition, Processing Techniques and Applications

"Advanced Image Acquisition, Processing Techniques and Applications" is the first book of a series that provides image processing principles and practical software implementation on a broad range of applications. The book integrates material from leading researchers on Applied Digital Image Acquisition and Processing. An important feature of the book is its emphasis on software tools and scientific computing in order to enhance results and arrive at problem solution

Yield and Reliability Analysis for Nanoelectronics

As technology has continued to advance and more break-through emerge, semiconductor devices with dimensions in nanometers have entered into all spheres of our lives. Accordingly, high reliability and high yield are very much a central concern to guarantee the advancement and utilization of nanoelectronic products. However, there appear to be some major challenges related to nanoelectronics in regard to the field of reliability: identification of the failure mechanisms, enhancement of the low yields of nano products, and management of the scarcity and secrecy of available data [34]. Therefore, this dissertation investigates four issues related to the yield and reliability of nanoelectronics. Yield and reliability of nanoelectronics are affected by defects generated in the manufacturing processes. An automatic method using model-based clustering has been developed to detect the defect clusters and identify their patterns where the distribution of the clustered defects is modeled by a new mixture distribution of multivariate normal distributions and principal curves. The new mixture model is capable of modeling defect clusters with amorphous, curvilinear, and linear patterns. We evaluate the proposed method using both simulated and experimental data and promising results have been obtained. Yield is one of the most important performance indexes for measuring the success of nano fabrication and manufacturing. Accurate yield estimation and prediction is essential for evaluating productivity and estimating production cost. This research studies advanced yield modeling approaches which consider the spatial variations of defects or defect counts. Results from real wafer map data show that the new yield models provide significant improvement in yield estimation compared to the traditional Poisson model and negative binomial model. The ultra-thin SiO2 is a major factor limiting the scaling of semiconductor devices. High-k gate dielectric materials such as HfO2 will replace SiO2 in future generations of MOS devices. This study investigates the two-step breakdown mechanisms and breakdown sequences of double-layered high-k gate stacks by monitoring the relaxation of the dielectric films. The hazard rate is a widely used metric for measuring the reliability of electronic products. This dissertation studies the hazard rate function of gate dielectrics breakdown. A physically feasible failure time distribution is used to model the time-to-breakdown data and a Bayesian approach is adopted in the statistical analysis

Process Variation-Aware Compact Model of Strip Waveguides for Photonic Circuit Simulation

We report a novel process variation-aware compact model of strip waveguides that is suitable for circuit-level simulation of waveguide-based process design kit (PDK) elements. The model is shown to describe both loss and -- using a novel expression for the thermo-optic effect in high index contrast materials -- the thermo-optic behavior of strip waveguides. A novel group extraction method enables modeling the effective index's ($n_{\mathrm{eff}}$) sensitivity to local process variations without the presumption of variation source. Use of Euler-bend Mach-Zehnder interferometers (MZIs) fabricated in a 300~mm wafer run allow model parameter extraction at widths up to 2.5~$\mu$m (highly multi-mode) with strong suppression of higher-order mode excitation. Experimental results prove the reported model can self-consistently describe waveguide phase, loss, and thermo-optic behavior across all measured devices over an unprecedented range of optical bandwidth, waveguide widths, and temperatures

IN-SITU CHARACTERIZATION OF SURFACE QUALITY IN γ-TiAl AEROSPACE ALLOY MACHINING

The functional performance of critical aerospace components such as low-pressure turbine blades is highly dependent on both the material property and machining induced surface integrity. Many resources have been invested in developing novel metallic, ceramic, and composite materials, such as gamma-titanium aluminide (γ-TiAl), capable of improved product and process performance. However, while γ-TiAl is known for its excellent performance in high-temperature operating environments, it lacks the manufacturing science necessary to process them efficiently under manufacturing-specific thermomechanical regimes. Current finish machining efforts have resulted in poor surface integrity of the machined component with defects such as surface cracks, deformed lamellae, and strain hardening. This study adopted a novel in-situ high-speed characterization testbed to investigate the finish machining of titanium aluminide alloys under a dry cutting condition to address these challenges. The research findings provided insight into material response, good cutting parameter boundaries, process physics, crack initiation, and crack propagation mechanism. The workpiece sub-surface deformations were observed using a high-speed camera and optical microscope setup, providing insights into chip formation and surface morphology. Post-mortem analysis of the surface cracking modes and fracture depths estimation were recorded with the use of an upright microscope and scanning white light interferometry, In addition, a non-destructive evaluation (NDE) quality monitoring technique based on acoustic emission (AE) signals, wavelet transform, and deep neural networks (DNN) was developed to achieve a real-time total volume crack monitoring capability. This approach showed good classification accuracy of 80.83% using scalogram images, in-situ experimental data, and a VGG-19 pre-trained neural network, thereby establishing the significant potential for real-time quality monitoring in manufacturing processes. The findings from this present study set the tone for creating a digital process twin (DPT) framework capable of obtaining more aggressive yet reliable manufacturing parameters and monitoring techniques for processing turbine alloys and improving industry manufacturing performance and energy efficiency

Remote Sensing

This dual conception of remote sensing brought us to the idea of preparing two different books; in addition to the first book which displays recent advances in remote sensing applications, this book is devoted to new techniques for data processing, sensors and platforms. We do not intend this book to cover all aspects of remote sensing techniques and platforms, since it would be an impossible task for a single volume. Instead, we have collected a number of high-quality, original and representative contributions in those areas