Finite Size Effects in Highly Scaled Ruthenium Interconnects

Ru has been considered a candidate to replace Cu-based interconnects in VLSI circuits. Here, a methodology is proposed to predict the resistivity of (Ru) interconnects. First, the dependence of the Ru thin film resistivity on the film thickness is modeled by the semiclassical Mayadas-Shatzkes (MS) approach. The fitting parameters thus obtained are then used as input in a modified MS model for nanowires to calculate wire resistivities. Predicted experimental resistivities agreed within about 10%. The results further indicate that grain boundary scattering was the dominant scattering mechanism in scaled Ru interconnects.Comment: 4 pages. 2 figure

Thickness dependence of the resistivity of Platinum group metal thin films

We report on the thin film resistivity of several platinum-group metals (Ru, Pd, Ir, Pt). Platinum-group thin films show comparable or lower resistivities than Cu for film thicknesses below about 5\,nm due to a weaker thickness dependence of the resistivity. Based on experimentally determined mean linear distances between grain boundaries as well as ab initio calculations of the electron mean free path, the data for Ru, Ir, and Cu were modeled within the semiclassical Mayadas--Shatzkes model [Phys. Rev. B 1, 1382 (1970)] to assess the combined contributions of surface and grain boundary scattering to the resistivity. For Ru, the modeling results indicated that surface scattering was strongly dependent on the surrounding material with nearly specular scattering at interfaces with SiO2 or air but with diffuse scattering at interfaces with TaN. The dependence of the thin film resistivity on the mean free path is also discussed within the Mayadas--Shatzkes model in consideration of the experimental findings.Comment: 28 pages, 9 figure

Polycrystalline silicon nanowires synthesis compatible with CMOS technology for integrated gas sensing applications

International audiencePolysilicon nanowires are synthesized following a classical top-down approach using conventional UV lithography technique fully compatible with the existing silicon CMOS technology. N- and P-type in-situ doping of these nanowires is controlled over a large range of doping levels and electrical properties of these nanowires are analyzed. Results show that resistivity dependence with the doping level is both related to the nanowires size dependent structural quality and doping specie. Charged gas species (ammonia) sensitivity of these nanowires has also been studied. In addition, feasibility of N- and P-channel polysilicon nanowires transistors is demonstrated