Principles of Neuromorphic Photonics

In an age overrun with information, the ability to process reams of data has become crucial. The demand for data will continue to grow as smart gadgets multiply and become increasingly integrated into our daily lives. Next-generation industries in artificial intelligence services and high-performance computing are so far supported by microelectronic platforms. These data-intensive enterprises rely on continual improvements in hardware. Their prospects are running up against a stark reality: conventional one-size-fits-all solutions offered by digital electronics can no longer satisfy this need, as Moore's law (exponential hardware scaling), interconnection density, and the von Neumann architecture reach their limits. With its superior speed and reconfigurability, analog photonics can provide some relief to these problems; however, complex applications of analog photonics have remained largely unexplored due to the absence of a robust photonic integration industry. Recently, the landscape for commercially-manufacturable photonic chips has been changing rapidly and now promises to achieve economies of scale previously enjoyed solely by microelectronics. The scientific community has set out to build bridges between the domains of photonic device physics and neural networks, giving rise to the field of \emph{neuromorphic photonics}. This article reviews the recent progress in integrated neuromorphic photonics. We provide an overview of neuromorphic computing, discuss the associated technology (microelectronic and photonic) platforms and compare their metric performance. We discuss photonic neural network approaches and challenges for integrated neuromorphic photonic processors while providing an in-depth description of photonic neurons and a candidate interconnection architecture. We conclude with a future outlook of neuro-inspired photonic processing.Comment: 28 pages, 19 figure

Programmable photonics : an opportunity for an accessible large-volume PIC ecosystem

We look at the opportunities presented by the new concepts of generic programmable photonic integrated circuits (PIC) to deploy photonics on a larger scale. Programmable PICs consist of waveguide meshes of tunable couplers and phase shifters that can be reconfigured in software to define diverse functions and arbitrary connectivity between the input and output ports. Off-the-shelf programmable PICs can dramatically shorten the development time and deployment costs of new photonic products, as they bypass the design-fabrication cycle of a custom PIC. These chips, which actually consist of an entire technology stack of photonics, electronics packaging and software, can potentially be manufactured cheaper and in larger volumes than application-specific PICs. We look into the technology requirements of these generic programmable PICs and discuss the economy of scale. Finally, we make a qualitative analysis of the possible application spaces where generic programmable PICs can play an enabling role, especially to companies who do not have an in-depth background in PIC technology

A Scalable & Energy Efficient Graphene-Based Interconnection Framework for Intra and Inter-Chip Wireless Communication in Terahertz Band

Network-on-Chips (NoCs) have emerged as a communication infrastructure for the multi-core System-on-Chips (SoCs). Despite its advantages, due to the multi-hop communication over the metal interconnects, traditional Mesh based NoC architectures are not scalable in terms of performance and energy consumption. Folded architectures such as Torus and Folded Torus were proposed to improve the performance of NoCs while retaining the regular tile-based structure for ease of manufacturing. Ultra-low-latency and low-power express channels between communicating cores have also been proposed to improve the performance of conventional NoCs. However, the performance gain of these approaches is limited due to metal/dielectric based interconnection. Many emerging interconnect technologies such as 3D integration, photonic, Radio Frequency (RF), and wireless interconnects have been envisioned to alleviate the issues of a metal/dielectric interconnect system. However, photonic and RF interconnects need the additional physically overlaid optical waveguides or micro-strip transmission lines to enable data transmission across the NoC. Several on-chip antennas have shown to improve energy efficiency and bandwidth of on-chip data communications. However, the date rates of the mm-wave wireless channels are limited by the state-of-the-art power-efficient transceiver design. Recent research has brought to light novel graphene based antennas operating at THz frequencies. Due to the higher operating frequencies compared to mm-wave transceivers, the data rate that can be supported by these antennas are significantly higher. Higher operating frequencies imply that graphene based antennas are just hundred micrometers in size compared to dimensions in the range of a millimeter of mm-wave antennas. Such reduced dimensions are suitable for integration of several such transceivers in a single NoC for relatively low overheads. In this work, to exploit the benefits of a regular NoC structure in conjunction with emerging Graphene-based wireless interconnect. We propose a toroidal folding based NoC architecture. The novelty of this folding based approach is that we are using low power, high bandwidth, single hop direct point to point wireless links instead of multihop communication that happens through metallic wires. We also propose a novel phased based communication protocol through which multiple wireless links can be made active at a time without having any interference among the transceiver. This offers huge gain in terms of performance as compared to token based mechanism where only a single wireless link can be made active at a time. We also propose to extend Graphene-based wireless links to enable energy-efficient, phase-based chip-to-chip communication to create a seamless, wireless interconnection fabric for multichip systems as well. Through cycle-accurate system-level simulations, we demonstrate that such designs with torus like folding based on THz links instead of global wires along with the proposed phase based multichip systems. We provide estimates that they are able to provide significant gains (about 3 to 4 times better in terms of achievable bandwidth, packet latency and average packet energy when compared to wired system) in performance and energy efficiency in data transfer in a NoC as well as multichip system. Thus, realization of these kind of interconnection framework that could support high data rate links in Tera-bits-per-second that will alleviate the capacity limitations of current interconnection framework