A Holistic Investigation on Terahertz Propagation and Channel Modeling Toward Vertical Heterogeneous Networks

User-centric and low latency communications can be enabled not only by small cells but also through ubiquitous connectivity. Recently, the vertical heterogeneous network (V-HetNet) architecture is proposed to backhaul/fronthaul a large number of small cells. Like an orchestra, the V-HetNet is a polyphony of different communication ensembles, including geostationary orbit (GEO), and low-earth orbit (LEO) satellites (e.g., CubeSats), and networked flying platforms (NFPs) along with terrestrial communication links. In this study, we propose the Terahertz (THz) communications to enable the elements of V-HetNets to function in harmony. As THz links offer a large bandwidth, leading to ultra-high data rates, it is suitable for backhauling and fronthauling small cells. Furthermore, THz communications can support numerous applications from inter-satellite links to in-vivo nanonetworks. However, to savor this harmony, we need accurate channel models. In this paper, the insights obtained through our measurement campaigns are highlighted, to reveal the true potential of THz communications in V-HetNets.Comment: It has been accepted for the publication in IEEE Communications Magazin

Terahertz Communications and Sensing for 6G and Beyond: A Comprehensive View

The next-generation wireless technologies, commonly referred to as the sixth generation (6G), are envisioned to support extreme communications capacity and in particular disruption in the network sensing capabilities. The terahertz (THz) band is one potential enabler for those due to the enormous unused frequency bands and the high spatial resolution enabled by both short wavelengths and bandwidths. Different from earlier surveys, this paper presents a comprehensive treatment and technology survey on THz communications and sensing in terms of the advantages, applications, propagation characterization, channel modeling, measurement campaigns, antennas, transceiver devices, beamforming, networking, the integration of communications and sensing, and experimental testbeds. Starting from the motivation and use cases, we survey the development and historical perspective of THz communications and sensing with the anticipated 6G requirements. We explore the radio propagation, channel modeling, and measurements for THz band. The transceiver requirements, architectures, technological challenges, and approaches together with means to compensate for the high propagation losses by appropriate antenna and beamforming solutions. We survey also several system technologies required by or beneficial for THz systems. The synergistic design of sensing and communications is explored with depth. Practical trials, demonstrations, and experiments are also summarized. The paper gives a holistic view of the current state of the art and highlights the issues and challenges that are open for further research towards 6G.Comment: 55 pages, 10 figures, 8 tables, submitted to IEEE Communications Surveys & Tutorial

Packages for Terahertz Electronics

In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.119Ysciescopu

Quadrature LC VCO with passive coupling and phase combining network

A circuit and method for generating a signal is disclosed. The circuit includes a set of wide tuning LC tanks, a set of core transistors cross coupled to the set of wide tuning LC tanks, and a combining network coupled to the set of wide tuning LC tanks and the set of core transistors. The combining network further includes a set of inputs connected to the set of wide tuning LC tanks and the set of core transistors, a set of coupling transistors connected to the set of inputs, a set of source inductors connected to the set of coupling transistors, a coupling capacitor connected to the set of source inductors, a load resistor connected to the coupling capacitor. The combining network combines the set of inputs and the signal is delivered to the load resistor as a fourth order harmonic.Board of Regents, University of Texas Syste

A 185-215-GHz Subharmonic Resistive Graphene FET Integrated Mixer on Silicon

A 200-GHz integrated resistive subharmonic mixer based on a single chemical vapor deposition graphene field-effect transistor (G-FET) is demonstrated experimentally. This device has a gate length of 0.5 μm and a gate width of 2x40 μm. The G-FET channel is patterned into an array of bow-tie-shaped nanoconstrictions, resulting in the device impedance levels of ~50 Ω and the ON-OFF ratios of ≥4. The integrated mixer circuit is implemented in coplanar waveguide technology and realized on a 100-μm-thick highly resistive silicon substrate. The mixer conversion loss is measured to be 29 ± 2 dB across the 185-210-GHz band with 12.5-11.5 dBm of local oscillator (LO) pump power and >15-dB LO-RF isolation. The estimated 3-dB IF bandwidth is 15 GHz

Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies

This invited paper reviews the progress of silicon–germanium (SiGe) bipolar-complementary metal–oxide–semiconductor (BiCMOS) technology-based integrated circuits (ICs) during the last two decades. Focus is set on various transceiver (TRX) realizations in the millimeter-wave range from 60 GHz and at terahertz (THz) frequencies above 300 GHz. This article discusses the development of SiGe technologies and ICs with the latter focusing on the commercially most important applications of radar and beyond 5G wireless communications. A variety of examples ranging from 77-GHz automotive radar to THz sensing as well as the beginnings of 60-GHz wireless communication up to THz chipsets for 100-Gb/s data transmission are recapitulated. This article closes with an outlook on emerging fields of research for future advancement of SiGe TRX performance

Terahertz Technology and Its Applications

The Terahertz frequency range (0.1 – 10)THz has demonstrated to provide many opportunities in prominent research fields such as high-speed communications, biomedicine, sensing, and imaging. This spectral range, lying between electronics and photonics, has been historically known as “terahertz gap” because of the lack of experimental as well as fabrication technologies. However, many efforts are now being carried out worldwide in order improve technology working at this frequency range. This book represents a mechanism to highlight some of the work being done within this range of the electromagnetic spectrum. The topics covered include non-destructive testing, teraherz imaging and sensing, among others