Diamond Detectors for the TOTEM Timing Upgrade

This paper describes the design and the performance of the timing detector developed by the TOTEM Collaboration for the Roman Pots (RPs) to measure the Time-Of-Flight (TOF) of the protons produced in central diffractive interactions at the LHC. The measurement of the TOF of the protons allows the determination of the longitudinal position of the proton interaction vertex and its association with one of the vertices reconstructed by the CMS detectors. The TOF detector is based on single crystal Chemical Vapor Deposition (scCVD) diamond plates and is designed to measure the protons TOF with about 50 ps time precision. This upgrade to the TOTEM apparatus will be used in the LHC run 2 and will tag the central diffractive events up to an interaction pileup of about 1. A dedicated fast and low noise electronics for the signal amplification has been developed. The digitization of the diamond signal is performed by sampling the waveform. After introducing the physics studies that will most profit from the addition of these new detectors, we discuss in detail the optimization and the performance of the first TOF detector installed in the LHC in November 2015.Comment: 26 pages, 18 figures, 2 tables, submitted for publication to JINS

Optimal use of Charge Information for the HL-LHC Pixel Detector Readout

The pixel detectors for the High Luminosity upgrades of the ATLAS and CMS detectors will preserve digitized charge information in spite of extremely high hit rates. Both circuit physical size and output bandwidth will limit the number of bits to which charge can be digitized and stored. We therefore study the effect of the number of bits used for digitization and storage on single and multi-particle cluster resolution, efficiency, classification, and particle identification. We show how performance degrades as fewer bits are used to digitize and to store charge. We find that with limited charge information (4 bits), one can achieve near optimal performance on a variety of tasks.Comment: 27 pages, 20 figure

Digital maturity variables and their impact on the enterprise architecture layers

This study examines the variables of digital maturity of companies. The framework for enterprise architectures Archimate 3.0 is used to compare the variables. The variables are assigned to the six layers of architecture: Strategy, Business Environment, Applications, Technology, Physical and Implementation and Migration. On the basis of a literature overview, 15 “digital maturity models” with a total of 147 variables are analyzed. The databases Scopus, EBSCO – Business Source Premier and ProQuest are used for this purpose

Irradiation study of a fully monolithic HV-CMOS pixel sensor design in AMS 180 nm

High-Voltage Monolithic Active Pixel Sensors (HV-MAPS) based on the 180 nm HV-CMOS process have been proposed to realize thin, fast and highly integrated pixel sensors. The MuPix7 prototype, fabricated in the commercial AMS H18 process, features a fully integrated on-chip readout, i.e. hit-digitization, zero suppression and data serialization. It is the first fully monolithic HV-CMOS pixel sensor that has been tested for the use in high irradiation environments like HL-LHC. We present results from laboratory and test beam measurements of MuPix7 prototypes irradiated with neutrons (up to $5.0\cdot10^{15}{\,\rm{n}_{\rm{eq}}/cm^2}$) and protons (up to $7.8\cdot 10^{15} \,\rm{protons}/cm^2$) and compare the performance with non-irradiated sensors. Efficiencies well above 90 % at noise rates below 200 Hz per pixel are measured. A time resolution better than 22 ns is measured for all tested settings and sensors, even at the highest irradiation fluences. The data transmission at 1.25 Gbit/s and the on-chip PLL remain fully functional

Pixel detector R&D for the Compact Linear Collider

The physics aims at the proposed future CLIC high-energy linear $e^+ e^-$ collider pose challenging demands on the performance of the detector system. In particular the vertex and tracking detectors have to combine precision measurements with robustness against the expected high rates of beam-induced backgrounds. A spatial resolution of a few microns and a material budget down to 0.2\% of a radiation length per vertex-detector layer have to be achieved together with a few nanoseconds time stamping accuracy. These requirements are addressed with innovative technologies in an ambitious detector R\&D programme, comprising hardware developments as well as detailed device and Monte Carlo simulations based on TCAD, Geant4 and Allpix-Squared. Various fine pitch hybrid silicon pixel detector technologies are under investigation for the CLIC vertex detector. The CLICpix and CLICpix2 readout ASICs with \SI{25}{\micro\meter} pixel pitch have been produced in a \SI{65}{\nano\meter} commercial CMOS process and bump-bonded to planar active edge sensors as well as capacitively coupled to High-Voltage (HV) CMOS sensors. Monolithic silicon tracking detectors are foreseen for the large surface ($\approx$ \SI{140}{\meter\squared}) CLIC tracker. Fully monolithic prototypes are currently under development in High-Resistivity (HR) CMOS, HV-CMOS and Silicon on Insulator (SOI) technologies. The laboratory and beam tests of all recent prototypes profit from the development of the CaRIBou universal readout system. This talk presents an overview of the CLIC pixel-detector R\&D programme, focusing on recent test-beam and simulation results.Comment: On behalf of CLICdp collaboration, Conference proceedings for PIXEL201