Power Processing for Electrostatic Microgenerators

Microgenerators are electro-mechanical devices which harvest energy from local environmental from such sources as light, heat and vibrations. These devices are used to extend the life-time of wireless sensor network nodes. Vibration-based microgenerators for biomedical applications are investigated in this thesis. In order to optimise the microgenerator system design, a combined electro-mechanical system simulation model of the complete system is required. In this work, a simulation toolkit (known as ICES) has been developed utilising SPICE. The objective is to accurately model end-to-end microgenerator systems. Case-study simulations of electromagnetic and electrostatic microgenerator systems are presented to verify the operation of the toolkit models. Custom semiconductor devices, previously designed for microgenerator use, have also been modelled so that system design and optimisation of complete microgenerator can be accomplished. An analytical framework has been developed to estimate the maximum system effectiveness of an electrostatic microgenerator operating in constant-charge and constant-voltage modes. The calculated system effectiveness values are plotted with respect to microgenerator sizes for different input excitations. Trends in effectiveness are identified and discussed in detail. It was found that when the electrostatic transducer is interfaced with power processing circuit, the parasitic elements of the circuit are reducing the energy generation ability of the transducer by sharing the charge during separation of the capacitor plates. Also, found that in constant-voltage mode the electrostatic microgenerator has a better effectiveness over a large operating range than constant-charge devices. The ICES toolkit was used to perform time-domain simulation of a range of operating points and the simulation results provide verification of the analytical results

The Convergence of Parametric Resonance and Vibration Energy Harvesting

Energy harvesting is an emerging technology that derives electricity from the ambient environment in a decentralised and self-contained fashion. Applications include self-powered medical implants, wearable electronics and wireless sensors for structural health monitoring. Amongst the vast options of ambient sources, vibration energy harvesting (VEH) has attracted by far the most research attention. Two of the key persisting issues of VEH are the limited power density compared to conventional power supplies and confined operational frequency bandwidth in light of the random, broadband and fast-varying nature of real vibration. The convention has relied on directly excited resonance to maximise the mechanical-to-electrical energy conversion efficiency. This thesis takes a fundamentally different approach by employing parametric resonance, which, unlike the former, its resonant amplitude growth does not saturate due to linear damping. Therefore, parametric resonance, when activated, has the potential to accumulate much more energy than direct resonance. The vibrational nonlinearities that are almost always associated with parametric resonance can offer a modest frequency widening. Despite its promising theoretical potentials, there is an intrinsic damping dependent initiation threshold amplitude, which must be attained prior to its onset. The relatively low amplitude of real vibration and the unavoidable presence of electrical damping to extract the energy render the onset of parametric resonance practically elusive. Design approaches have been devised to passively minimise this initiation threshold. Simulation and experimental results of various design iterations have demonstrated favourable results for parametric resonance as well as the various threshold-reduction mechanisms. For instance, one of the macro-scale electromagnetic prototypes (∼1800 cm3) when parametrically driven, has demonstrated around 50% increase in half power band and an order of magnitude higher peak power (171.5 mW at 0.57 ms−2) in contrast to the same prototype directly driven at fundamental resonance (27.75 mW at 0.65 ms−2). A MEMS (micro-electromechanical system) prototype with the additional threshold-reduction design needed 1 ms−2 excitation to activate parametric resonance while a comparable device without the threshold-reduction mechanism required in excess of 30 ms−2. One of the macro-scale piezoelectric prototypes operated into auto-parametric resonance has demon-strated notable further reduction to the initiation threshold. A vacuum packaged MEMS prototype demonstrated broadening of the frequency bandwidth along with higher power peak (324 nW and 160 Hz) for the parametric regime compared to when operated in room pressure (166 nW and 80 Hz), unlike the higher but narrower direct resonant peak (60.9 nW and 11 Hz in vacuum and 20.8 nW and 40 Hz in room pressure). The simultaneous incorporation of direct resonance and bi-stability have been investigated to realise multi-regime VEH. The potential to integrate parametric resonance in the electrical domains have also been numerically explored. The ultimate aim is not to replace direct resonance but rather for the various resonant phenomena to complement each other and together harness a larger region of the available power spectrum

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

DESIGN AND FABRICATION OF MEMS ELECTROSTATIC ACTUATORS

The research presented in this thesis is focused on the design and development of MEMS (Micro Electro Mechanical System) electrostatic actuators. Different kinds of electrostatic actuators are analyzed and presented . The study of torsional electrostatic actuator is carried out and the design of an micromirrors array for beam steering optical switching in a thick polysilicon technology is presented. The main advantage of these devices is that they are realized in a commercial surface micromachining technology (THELMA by STMicrolectronics) hence they are less expensive with respect to other solutions present in literature. For the torsional actuators, a novel semi-analytical model which allows prediction of the behaviour of the structures and takes into account the flexural deformation of the structure is presented. A very good agreement between the model, FEM simulation and experimental results has been obtained. The possibility of using another competitive surface micromachining technology (developed at IMEC) which uses poly silicon germanium as structural layer to realize the micromirrors is also investigated. Poly Silicon Germanium has the advantage that can be integrated on top of commercial CMOS. The development of optimized (low stressed) layers of poly silicon germanium has been addressed and some test micromirrors using this technology have been designed. Moreover an analysis of the levitation effect in electrostatic comb fingers atcuators is presented. The use of this actuation for vertical or torsional motion of micromachined structures is exploited. Two different levitational mechanical resonators have been designed and fabricated in THELMA. Because of the high thickness of the structural layer, classic springs shows several limitation, so specifically designed suspension springs (rotated serpentines), with better performance for high thickness, have been used. A full analysis of this kind of spring and a comparison with other springs are also presented. Finally a study of the dependence of the levitation force intensity on the geometric parameters of the actuators is performed using FEM simulations, and information about critical geometrical parameters in the design of operative levitational actuators is obtained. The devices are characterized and the obtained results are compared with FEM simulations

Thermomechanical noise of arrayed capacitive accelerometers with 300-NM-gap sensing electrodes

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 18-22 June 2017.Thermomechanical noise of arrayed capacitive accelerometers with sub-micrometer sensing electrodes was evaluated. The unit accelerometer of the array was 80-μm square, designed as a proportional scale-down of a conventional single-axis accelerometer. Since the size effect shows the capacitance sensitivity per unit volume increases by proportional downsizing, a 10-by-10 array of the one-tenth sized unit accelerometer would have the same sensitivity of a single accelerometer of same occupied area. However, the thermomechanical noise needs to be controlled and reduced by vacuum encapsulation because size reduction causes noise increase. By measuring the electrical impedance at the resonant frequency, the damping coefficient was estimated using electrical equivalent circuit modeling. The estimated thermomechanical noise was reduced below 3 μg√VHZ by encapsulating at 100 Pa, which is low enough for instrumentation applications

UV-LIGA micro-fabrication of inertia type electrostatic transducers and their application

This dissertation discusses the design, working principles, static & dynamic analysis and simulation, mechanics of material, applied MEMS technology, micro-fabrication, and experimental testing of two types of micro-transducers: micro-power relay and micro-accelerometer. Several possible design concepts were proposed, and the advantages and disadvantages of electrostatic working principles were also discussed. Transducers presented in this research used electrostatic force as a driving force in the micro-relay and capacitance as a sensing parameter in the micro-accelerometer. There was an analogy between the micro-relay and the micro-accelerometer in their theoretical approach and fabrication processes. The proposed micro-transducers (micro-relay and micro-accelerometer) were fabricated using UV lithograph of SU-8 & SPR and UV-LIGA process. The advantages and disadvantages of these processes were discussed. The micro-relays fabricated by UV-LIGA technology had the following advantages compared with other reported relays: fast switching speed, high power capacity, high off-resistance, lower on-resistance, low power consumption, and low heat generation. The polymer-based micro-accelerometers were designed and fabricated. Instead of applying SU-8 only as a photo resist, cured SU-8 was used as the primary structural material in fabricating the micro-accelerometers. The great flexibility in size and aspect ratio of cured SU-8 made it feasible to produce highly sensitive accelerometers. The prototype micro-relays and micro-accelerometers were tested for the dynamic characteristics and power capacity. The experimental results in micro-relays had confirmed that reasonably large current capacity and fast response speed was able to be achieved using electromagnetic actuation and the multilayer UV-LIGA fabrication process

Cantilever beam microactuators with electrothermal and electrostatic drive

Microfabrication provides a powerful tool for batch processing and miniaturization of mechanical systems into dimensional domain not accessible easily by conventional machining. CMOS IC process compatible design is definitely a big plus because of tremendous know-how in IC technologies, commercially available standard IC processes for a reasonable price, and future integration of microma-chined mechanical systems and integrated circuits. Magnetically, electrostatically and thermally driven microactuators have been reported previously. These actuators have applications in many fields from optics to robotics and biomedical engineering. At NJIT cleanroom, mono or multimorph microactuators have been fabricated using CMOS compatible process. In design and fabrication of these microactuators, internal stress due to thermal expansion coefficient mismatch and residual stress have been considered, and the microactuators are driven with electro-thermal power combined with electrostatical excitation. They can provide large force, and in- or out-of-plane actuation. In this work, an analytical model is proposed to describe the thermal actuation of in-plane (inchworm) actuators. Stress gradient throughout the thickness of monomorph layers is modeled as linearly temperature dependent Δσ. The nonlinear behaviour of out-of-plane actuators under electrothermal and electrostatic excitations is investigated. The analytical results are compared with the numerical results based on Finite Element Analysis. ANSYS, a general purpose FEM package, and IntelliCAD, a FEA CAD tool specifically designed for MEMS have been used extensively. The experimental results accompany each analytical and numerical work. Micromechanical world is three dimensional and 2D world of IC processes sets a limit to it. A new micromachining technology, reshaping, has been introduced to realize 3D structures and actuators. This new 3D fabrication technology makes use of the advantages of IC fabrication technologies and combines them with the third dimension of the mechanical world. Polycrystalline silicon microactuators have been reshaped by Joule heating. The first systematic investigation of reshaping has been presented. A micromirror utilizing two reshaped actuators have been designed, fabricated and characterized

CMOS systems and circuits for sub-degree per hour MEMS gyroscopes

The objective of our research is to develop system architectures and CMOS circuits that interface with high-Q silicon microgyroscopes to implement navigation-grade angular rate sensors. The MEMS sensor used in this work is an in-plane bulk-micromachined mode-matched tuning fork gyroscope (M² – TFG ), fabricated on silicon-on-insulator substrate. The use of CMOS transimpedance amplifiers (TIA) as front-ends in high-Q MEMS resonant sensors is explored. A T-network TIA is proposed as the front-end for resonant capacitive detection. The T-TIA provides on-chip transimpedance gains of 25MΩ, has a measured capacitive resolution of 0.02aF /√Hz at 15kHz, a dynamic range of 104dB in a bandwidth of 10Hz and consumes 400μW of power. A second contribution is the development of an automated scheme to adaptively bias the mechanical structure, such that the sensor is operated in the mode-matched condition. Mode-matching leverages the inherently high quality factors of the microgyroscope, resulting in significant improvement in the Brownian noise floor, electronic noise, sensitivity and bias drift of the microsensor. We developed a novel architecture that utilizes the often ignored residual quadrature error in a gyroscope to achieve and maintain perfect mode-matching (i.e.0Hz split between the drive and sense mode frequencies), as well as electronically control the sensor bandwidth. A CMOS implementation is developed that allows mode-matching of the drive and sense frequencies of a gyroscope at a fraction of the time taken by current state of-the-art techniques. Further, this mode-matching technique allows for maintaining a controlled separation between the drive and sense resonant frequencies, providing a means of increasing sensor bandwidth and dynamic range. The mode-matching CMOS IC, implemented in a 0.5μm 2P3M process, and control algorithm have been interfaced with a 60μm thick M2−TFG to implement an angular rate sensor with bias drift as low as 0.1°/hr ℃ the lowest recorded to date for a silicon MEMS gyro.Ph.D.Committee Chair: Farrokh Ayazi; Committee Member: Jennifer Michaels; Committee Member: Levent Degertekin; Committee Member: Paul Hasler; Committee Member: W. Marshall Leac