A Fully-Integrated Quad-Band GSM/GPRS CMOS Power Amplifier

Concentric distributed active transformers (DAT) are used to implement a fully-integrated quad-band power amplifier (PA) in a standard 130 nm CMOS process. The DAT enables the power amplifier to integrate the input and output matching networks on the same silicon die. The PA integrates on-chip closed-loop power control and operates under supply voltages from 2.9 V to 5.5 V in a standard micro-lead-frame package. It shows no oscillations, degradation, or failures for over 2000 hours of operation with a supply of 6 V at 135° under a VSWR of 15:1 at all phase angles and has also been tested for more than 2 million device-hours (with ongoing reliability monitoring) without a single failure under nominal operation conditions. It produces up to +35 dBm of RF power with power-added efficiency of 51%

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

New broadband applications are causing the datacenters to proliferate, raising the bar for higher interconnection speeds. So far, optical board-to-board and rack-to-rack interconnects relied primarily on low-cost commodity optical components assembled in a single package. Although this concept proved successful in the first generations of optical-interconnect modules, scalability is a daunting issue as signaling rates extend beyond 25 Gb/s. In this paper we present our work towards the development of two technology platforms for migration beyond Infiniband enhanced data rate (EDR), introducing new concepts in board-to-board and rack-to-rack interconnects. The first platform is developed in the framework of MIRAGE European project and relies on proven VCSEL technology, exploiting the inherent cost, yield, reliability and power consumption advantages of VCSELs. Wavelength multiplexing, PAM-4 modulation and multi-core fiber (MCF) multiplexing are introduced by combining VCSELs with integrated Si and glass photonics as well as BiCMOS electronics. An in-plane MCF-to-SOI interface is demonstrated, allowing coupling from the MCF cores to 340x400 nm Si waveguides. Development of a low-power VCSEL driver with integrated feed-forward equalizer is reported, allowing PAM-4 modulation of a bandwidth-limited VCSEL beyond 25 Gbaud. The second platform, developed within the frames of the European project PHOXTROT, considers the use of modulation formats of increased complexity in the context of optical interconnects. Powered by the evolution of DSP technology and towards an integration path between inter and intra datacenter traffic, this platform investigates optical interconnection system concepts capable to support 16QAM 40GBd data traffic, exploiting the advancements of silicon and polymer technologies

Algorithmic studies on PCB routing

As IC technology advances, the package size keeps shrinking while the pin count of a package keeps increasing. A modern IC package can have a pin count of thousands. As a result, a complex printed circuit board (PCB) can host more than ten thousand signal nets. Such a huge pin count and net count make manual design of packages and PCBs an extremely time-consuming and error-prone task. On the other hand, increasing clock frequency imposes various physical constraints on PCB routing. These constraints make traditional IC and PCB routers not applicable to modern PCB routing. To the best of our knowledge, there is no mature commercial or academic automated router that handles these constraints well. Therefore, automated PCB routers that are tuned to handle such constraints become a necessity in modern design. In this dissertation, we propose novel algorithms for three major aspects of PCB routing: escape routing, area routing and layer assignment. Escape routing for packages and PCBs has been studied extensively in the past. Network flow is pervasively used to model this problem. However, previous studies are incomplete in two senses. First, none of the previous works correctly model the diagonal capacity, which is essential for 45 degree routing in most packages and PCBs. As a result, existing algorithms may either produce routing solutions that violate the diagonal capacity or fail to output a legal routing even though one exists. Second, few works discuss the escape routing problem of differential pairs. In high-performance PCBs, many critical nets use differential pairs to transmit signals. How to escape differential pairs from a pin array is an important issue that has received too little attention in the literature. In this dissertation, we propose a new network flow model that guarantees the correctness when diagonal capacity is taken into consideration. This model leads to the first optimal algorithm for escape routing. We also extend our model to handle missing pins. We then propose two algorithms for the differential pair escape routing problem. The first one computes the optimal routing for a single differential pair while the second one is able to simultaneously route multiple differential pairs considering both routability and wire length. We then propose a two-stage routing scheme based on the two algorithms. In our routing scheme, the second algorithm is used to generate initial routing and the first algorithm is used to perform rip-up and reroute. Length-constrained routing is another very important problem for PCB routing. Previous length-constrained routers all have assumptions on the routing topology. We propose a routing scheme that is free of any restriction on the routing topology. The novelty of our proposed routing scheme is that we view the length-constrained routing problem as an area assignment problem and use a placement structure to help transform the area assignment problem into a mathematical programming problem. Experimental results show that our routing scheme can handle practical designs that previous routers cannot handle. For designs that they could handle, our router runs much faster. Length-constrained routing requires the escaped nets to have matching ordering along the boundaries of the pin arrays. However, in some practical designs, the net ordering might be mismatched. To address this issue, we propose a preprocessing step to untangle such twisted nets. We also introduce a practical routing style, which we call single-detour routing, to simplify the untangling problem. We discover a necessary and sufficient condition for the existence of single-detour routing solutions and present a dynamic programming based algorithm that optimally solves the problem. By integrating our algorithm into the bus router in a length-constrained router, we show that many routing problems that cannot be solved previously can now be solved with insignificant increase in runtime. The nets on a PCB are usually grouped into buses. Because of the high pin density of the packages, the buses need to be assigned into multiple routing layers. We propose a layer assignment algorithm to assign a set of buses into multiple layers without causing any conflict. Our algorithm guarantees to produce a layer assignment with minimum number of layers. The key idea is to transform the layer assignment problem into a bipartite matching problem. This research result is an improvement over a previous work, which is optimal for only one layer

Technical Design Report for the PANDA Micro Vertex Detector

This document illustrates the technical layout and the expected performance of the Micro Vertex Detector (MVD) of the PANDA experiment. The MVD will detect charged particles as close as possible to the interaction zone. Design criteria and the optimisation process as well as the technical solutions chosen are discussed and the results of this process are subjected to extensive Monte Carlo physics studies. The route towards realisation of the detector is outlined

Silicon compilation

Silicon compilation is a term used for many different purposes. In this paper we define silicon compilation as a mapping from some higher level description into layout. We define the basic issues in structural and behavioral silicon compilation and some possible solutions to those issues. Finally, we define the concept of an intelligent silicon compiler in which the compiler evaluates the quality of the generated design and attempts to improve it if it is not satisfactory

EFFICIENT HARDWARE PRIMITIVES FOR SECURING LIGHTWEIGHT SYSTEMS

In the era of IoT and ubiquitous computing, the collection and communication of sensitive data is increasingly being handled by lightweight Integrated Circuits. Efficient hardware implementations of crytographic primitives for resource constrained applications have become critical, especially block ciphers which perform fundamental operations such as encryption, decryption, and even hashing. We study the efficiency of block ciphers under different implementation styles. For low latency applications that use unrolled block cipher implementations, we design a glitch filter to reduce energy consumption. For lightweight applications, we design a novel architecture for the widely used AES cipher. The design eliminates inefficiencies in data movement and clock activity, thereby significantly improving energy efficiency over state-of-the-art architectures. Apart from efficiency, vulnerability to implementation attacks are a concern, which we mitigate by our randomization capable lightweight AES architecture. We fabricate our designs in a commercial 16nm FinFET technology and present measured testchip data on energy consumption and side channel resistance. Finally, we address the problem of supply chain security by using image processing techniques to extract fingerprints from surface texture of plastic IC packages for IC authentication and counterfeit prevention. Collectively these works present efficient and cost effective solutions to secure lightweight systems

Methodology and Ecosystem for the Design of a Complex Network ASIC

Performance of HPC systems has risen steadily. While the 10 Petaflop/s barrier has been breached in the year 2011 the next large step into the exascale era is expected sometime between the years 2018 and 2020. The EXTOLL project will be an integral part in this venture. Originally designed as a research project on FPGA basis it will make the transition to an ASIC to improve its already excelling performance even further. This transition poses many challenges that will be presented in this thesis. Nowadays, it is not enough to look only at single components in a system. EXTOLL is part of complex ecosystem which must be optimized overall since everything is tightly interwoven and disregarding some aspects can cause the whole system either to work with limited performance or even to fail. This thesis examines four different aspects in the design hierarchy and proposes efficient solutions or improvements for each of them. At first it takes a look at the design implementation and the differences between FPGA and ASIC design. It introduces a methodology to equip all on-chip memory with ECC logic automatically without the user’s input and in a transparent way so that the underlying code that uses the memory does not have to be changed. In the next step the floorplanning process is analyzed and an iterative solution is worked out based on physical and logical constraints of the EXTOLL design. Besides, a work flow for collaborative design is presented that allows multiple users to work on the design concurrently. The third part concentrates on the high-speed signal path from the chip to the connector and how it is affected by technological limitations. All constraints are analyzed and a package layout for the EXTOLL chip is proposed that is seen as the optimal solution. The last part develops a cost model for wafer and package level test and raises technological concerns that will affect the testing methodology. In order to run testing internally it proposes the development of a stand-alone test platform that is able to test packaged EXTOLL chips in every aspect

Memory and information processing in neuromorphic systems

A striking difference between brain-inspired neuromorphic processors and current von Neumann processors architectures is the way in which memory and processing is organized. As Information and Communication Technologies continue to address the need for increased computational power through the increase of cores within a digital processor, neuromorphic engineers and scientists can complement this need by building processor architectures where memory is distributed with the processing. In this paper we present a survey of brain-inspired processor architectures that support models of cortical networks and deep neural networks. These architectures range from serial clocked implementations of multi-neuron systems to massively parallel asynchronous ones and from purely digital systems to mixed analog/digital systems which implement more biological-like models of neurons and synapses together with a suite of adaptation and learning mechanisms analogous to the ones found in biological nervous systems. We describe the advantages of the different approaches being pursued and present the challenges that need to be addressed for building artificial neural processing systems that can display the richness of behaviors seen in biological systems.Comment: Submitted to Proceedings of IEEE, review of recently proposed neuromorphic computing platforms and system

RHINO: reconfigurable hardware interface for computation and radio

Field-programmable gate arrays, or FPGAs, provide an attractive computing platform for software-defined radio applications. Their reconfigurable nature allows many digital signal processing (DSP) algorithms to be highly parallelised within the FPGA fabric, while their customisable I/O interfaces allow simple interfacing to analogue-to-digital converters (ADCs) and digital-to-analogue converters (DACs). However, FPGA boards that deliver sufficient performance to be useful in real-world applications are generally expensive. Rhino is an FPGA-based hardware processing platform that primarily supports software-defined radio applications. The final cost estimate for a complete Rhino system is under $1700, cheaper than similar FPGA boards that deliver much lower performance

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects