18,723 research outputs found

    Advances on CMOS image sensors

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    This paper offers an introduction to the technological advances of image sensors designed using complementary metal–oxide–semiconductor (CMOS) processes along the last decades. We review some of those technological advances and examine potential disruptive growth directions for CMOS image sensors and proposed ways to achieve them. Those advances include breakthroughs on image quality such as resolution, capture speed, light sensitivity and color detection and advances on the computational imaging. The current trend is to push the innovation efforts even further as the market requires higher resolution, higher speed, lower power consumption and, mainly, lower cost sensors. Although CMOS image sensors are currently used in several different applications from consumer to defense to medical diagnosis, product differentiation is becoming both a requirement and a difficult goal for any image sensor manufacturer. The unique properties of CMOS process allows the integration of several signal processing techniques and are driving the impressive advancement of the computational imaging. With this paper, we offer a very comprehensive review of methods, techniques, designs and fabrication of CMOS image sensors that have impacted or might will impact the images sensor applications and markets

    Small Footprint Multilayered Millimeter-Wave Antennas and Feeding Networks for Multi-Dimensional Scanning and High-Density Integrated Systems

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    This paper overviews the state-of-the-art of substrate integrated waveguide (SIW) techniques in the design and realization of innovative low-cost, low-profile and low-loss (L3) millimeter-wave antenna elements, feeding networks and arrays for various wireless applications. Novel classes of multilayered antenna structures and systems are proposed and studied to exploit the vertical dimension of planar structures to overcome certain limita-tions in standard two-dimensional (2-D) topologies. The developed structures are based on two techniques, namely multi-layer stacked structures and E-plane corners. Differ-ent E-plane structures realised with SIW waveguide are presented, thereby demonstrating the potential of the proposed techniques as in multi-polarization antenna feeding. An array of 128 elements shows low SLL and height gain with just 200g of the total weight. Two versions of 2-D scanning multi-beam are presented, which effectively combine frequency scanning with beam forming networks. Adding the benefits of wide band performance to the multilayer structure, two bi-layer structures are investigated. Different stacked antennas and arrays are demonstrated to optimise the targeted antenna performances in the smallest footprint possible. These structures meet the requirement for developing inexpensive compact millimeter-wave antennas and antenna systems. Different structures and architectures are theoretically and experimentally studied and discussed for specific space- and ground-based appli-cations. Practical issues such as high-density integration and high-volume manufacturability are also addressed

    Compact Brillouin devices through hybrid integration on Silicon

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    A range of unique capabilities in optical and microwave signal processing have been demonstrated using stimulated Brillouin scattering. The desire to harness Brillouin scattering in mass manufacturable integrated circuits has led to a focus on silicon-based material platforms. Remarkable progress in silicon-based Brillouin waveguides has been made, but results have been hindered by nonlinear losses present at telecommunications wavelengths. Here, we report a new approach to surpass this issue through the integration of a high Brillouin gain material, As2S3, onto a silicon chip. We fabricated a compact spiral device, within a silicon circuit, achieving an order of magnitude improvement in Brillouin amplification. To establish the flexibility of this approach, we fabricated a ring resonator with free spectral range precisely matched to the Brillouin shift, enabling the first demonstration of Brillouin lasing in a silicon integrated circuit. Combining active photonic components with the SBS devices shown here will enable the creation of compact, mass manufacturable optical circuits with enhanced functionality

    Co-design of the high-speed photonic and electronic integrated circuits

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    Co-design of the high-speed photonic and electronic integrated circuits

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    Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems

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    We present a method for the automatic generation of netlists describing general three-dimensional electrothermal and electromagnetic field problems. Using a pair of structured orthogonal grids as spatial discretisation, a one-to-one correspondence between grid objects and circuit elements is obtained by employing the finite integration technique. The resulting circuit can then be solved with any standard available circuit simulator, alleviating the need for the implementation of a custom time integrator. Additionally, the approach straightforwardly allows for field-circuit coupling simulations by appropriately stamping the circuit description of lumped devices. As the computational domain in wave propagation problems must be finite, stamps representing absorbing boundary conditions are developed as well. Representative numerical examples are used to validate the approach. The results obtained by circuit simulation on the generated netlists are compared with appropriate reference solutions.Comment: This is a pre-print of an article published in the Journal of Computational Electronics. The final authenticated version is available online at: https://dx.doi.org/10.1007/s10825-019-01368-6. All numerical results can be reproduced by the Matlab code openly available at https://github.com/tc88/ANTHE

    Phased Array Systems in Silicon

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    Phased array systems, a special case of MIMO systems, take advantage of spatial directivity and array gain to increase spectral efficiency. Implementing a phased array system at high frequency in a commercial silicon process technology presents several challenges. This article focuses on the architectural and circuit-level trade-offs involved in the design of the first silicon-based fully integrated phased array system operating at 24 GHz. The details of some of the important circuit building blocks are also discussed. The measured results demonstrate the feasibility of using integrated phased arrays for wireless communication and vehicular radar applications at 24 GHz
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