Development of a viable concrete printing process

A novel Concrete Printing process has been developed, inspired and informed by advances in 3D printing, which has the potential to produce highly customised building components. Whilst still in their infancy, these technologies could create a new era of architecture that is better adapted to the environment and integrated with engineering function. This paper describes the development of a viable concrete printing process with a practical example in designing and manufacturing a concrete component (called Wonder Bench) that includes service voids and reinforcement. The challenges met and those still to be overcome particularly in the evaluation of the manufacturing tolerances of prints are also discussed

Material Issues of the Metal Printing Process, MPP

The metal printing process, MPP; is a novel Rapid Manufacturing process under development at SINTEF and NTNU in Trondheim, Norway. The process, which aims at the manufacturing of end-use products for demanding applications in metallic and CerMet materials, consists of two separate parts; The layer fabrication, based on electrostatic attraction of powder materials, and the consolidation, consisting of the compression and sintering of each layer in a heated die. This approach leads to a number of issues regarding the interaction between the process solutions and the materials. This paper addresses some of the most critical material issues at the current development stage of MPP, and the present solutions to these.Mechanical Engineerin

Characterization of lithographically printed resistive strain gauges

This paper reports progress in sensor fabrication by the conductive lithographic film (CLF) printing process. Work describing strain-sensitive structures manufactured using a modified printing process and conductive inks is addressed. The performance of a "single-ink" strain-sensitive structure when printed on six alternative substrates (GlossArt, PolyArt, Teslin, Mylar C, Melinex, and Kapton) is analyzed. Though not intending to compete with conventional gauges in high-tolerance measurement, the structures exhibit properties that indicate suitability for novel applications

A review of stencil printing for microelectronic packaging

PurposeThe purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.Design/methodology/approachThis paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.FindingsThis article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.Originality/valueStencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.</jats:sec

A time-strain monitoring system fabricated via offset lithographic printing

This paper reports progress in the development of strain sensors fabricated using the Conductive Lithographic Film (CLF) printing process. Strain sensitive structures printed via an unmodified offset lithographic printing press using a silver loaded conductive ink have been deposited concurrently with circuit interconnect, to form an electronic smart packaging system. A system populated with SMT components has proven successful in interpreting and logging deformation incidences subjected to a package during testing. It is proposed that with further development such a system could be printed in sync with packaging graphics using a single printing process to form an integrated time – strain monitoring system

Comparative study of selected indoor concentration from selective laser sintering process using virgin and recycled polyamide nylon (pa12)

Additive manufacturing (AM) stands out as one of the promising technologies that have huge potential towards manufacturing industry. The study on additive manufacturing impact on the environment and occupational exposure are attracting growing attention recently. However, most of the researcher focus on desktop and fused deposition modelling type and less attention given to the industrial type of AM. Usually, during the selective laser sintering process, recycle powder will be used again to reduce cost and waste. This article compares the PM 2.5, carbon dioxide (CO2) and total volatile organic compound (TVOC) concentration between virgin and recycles powder using polyamide-nylon (PA12) towards indoor concentration. Four phases of sampling involve during air sampling accordingly to the Industry Code of Practice on Indoor Air Quality 2010 by DOSH Malaysia. It was found that PM 2.5 and CO2 concentration are mainly generated during the pre-printing process. The recycle powder tended to appear higher compared to virgin powder in terms of PM 2.5, and CO2. The peak value of PM 2.5 is 1452 μg/m3 and CO2 is 1218 ppm are obtained during the pre-printing process during 8 hours of sampling. TVOC concentration from recycling powder is slightly higher during the post- printing phase where confirm the influence of the powder cake and PA12 temperature from the printing process. In summary, this work proves that elective laser sintering (SLS) machine operators are exposed to a significant amount of exposure during the SLS printing process. Mitigation strategies and personal protective equipment are suggested to reduce occupational exposure

Void elimination in screen printed thick film dielectric pastes

The problem is to understand the mechanisms for the formation and evolution of defects in wet screen printed layers. The primary objective is to know how best to alter the properties of the paste (rather than the geometry of the screen printing process itself) in order to eliminate the defects. With these goals in mind the work done during the Study Group reported here was as follows; to describe a simple model for the closure of craters, a model for the partial closure of vias, a possible mechanism for the formation of pinholes and finally a more detailed consideration of the screen printing process

Nanotransfer Printing of Organic and Carbon Nanotube Thin-Film Transistors on Plastic Substrates

A printing process for high-resolution transfer of all components for organic electronic devices on plastic substrates has been developed and demonstrated for pentacene (Pn), poly (3-hexylthiophene) and carbon nanotube (CNT) thin-film transistors (TFTs). The nanotransfer printing process allows fabrication of an entire device without exposing any component to incompatible processes and with reduced need for special chemical preparation of transfer or device substrates. Devices on plastic substrates include a Pn TFT with a saturation, field-effect mobility of 0.09 cm^2 (Vs)^-1 and on/off ratio approximately 10^4 and a CNT TFT which exhibits ambipolar behavior and no hysteresis.Comment: to appear in Applied Physics Letter