Probes for measuring noise current in an electronic cable

Electromagnetic interference in deep-space network receiver is often caused by stray coupling from power lines. These stray signals create potential differences between ground terminals, which leads to excessive noise in receiver circuits. Pair of probes detect and measure noise currents in conductors

Maximum crosstalk estimation and modeling of electromagnetic radiation from PCB/high-density connector interfaces

This dissertation explores two topics pertinent to electromagnetic compatibility research: maximum crosstalk estimation in weakly coupled transmission lines and modeling of electromagnetic radiation resulting from printed circuit board/high-density connector interfaces. Despite an ample supply of literature devoted to the study of crosstalk, little research has been performed to formulate maximum crosstalk estimates when signal lines are electrically long. Paper one illustrates a new maximum crosstalk estimate that is based on a mathematically rigorous, integral formulation, where the transmission lines can be lossy and in an inhomogeneous media. Paper two provides a thorough comparison and analysis of the newly derived maximum crosstalk estimates with an estimate derived by another author. In paper two the newly derived estimates in paper one are shown to be more robust because they can estimate the maximum crosstalk with fewer and less restrictive assumptions. One current industry challenge is the lack of robust printed circuit board connector models and methods to quantify radiation from these connectors. To address this challenge, a method is presented in paper three to quantify electromagnetic radiation using network parameters and power conservation, assuming the only losses at a printed circuit board/connector interface are due to radiation. Some of the radiating structures are identified and the radiation physics explored for the studied connector in paper three. Paper four expands upon the radiation modeling concepts in paper three by extending radiation characterization when material losses and multiple signals may be present at the printed circuit board/connector interface. The resulting radiated power characterization method enables robust deterministic and statistical analyses of the radiated power from printed circuit board connectors. Paper five shows the development of a statistical radiated power estimate based on the radiation characterization method presented in paper four. Maximum radiated power estimates are shown using the Markov and Chebyshev inequalities to predict a radiated power limit. A few maximum radiated power limits are proposed that depend on the amount of known information about the radiation characteristics of a printed circuit board connector --Abstract, page iv

CompactPCI(Registered TradeMark) Connectors in Space Flight Applications

This report documents the current status of CompactPCI(Registered TradeMark) connectors in GSFC spaceflight applications. To the extent the information is known, this report summarizes to what component quality level each NASA contractor (referred to as OEM in this report) procured the parts, and what board level and system level testing was performed. The report also provides the current status of the reliability assessment for each GSFC project based on the results of testing and FMEA (Failure Mode Effects Analysis). This report addresses how the CompactPCI(Registered TradeMark) connectors came into existence, and how these became the connector style chosen by many designers of space flight hardware. It identifies the design philosophy and the lack of robustness which has led to several known failure modes. These failure modes include fretting of connector pins during vibration, shock and thermal cycling, exposure of underplating, and increased resistance, including brief excursions to very high resistance. Each of these are signs of aging, which becomes an increasing concern for long duration orbiting space flight applications. This report addresses the mitigation strategy to replace CompactPCI(Registered TradeMark) connectors with space qualified Hypertronics 2mm cPCI connectors. The Hypertronics 2mm cPCI connectors are pin-to-pin compatible with the CompactPCI(Registered TradeMark) connectors and meet all of the same technical requirements, except the ability to hot mate, and to mate directly with a CompactPCI of the opposite gender. A detailed comparison of the CompactPCI(Registered TradeMark) connector and the Hypertronics 2mm cPCI connector is provided to describe the ruggedness of Hypertronics connector for space flight applications. Finally, this report makes recommendations for flight hardware for the future missions where the hardware is yet to be built, as well as for the hardware which has already been built with CompactPCI(Registered TradeMark) connectors

Double-Framed Thin Elastomer Devices

Elastomers and, in particular, polydimethylsiloxane (PDMS) are widely adopted as biocompatible mechanically compliant substrates for soft and flexible micro-nanosystems in medicine, biology, and engineering. However, several applications require such low thicknesses (e.g., <100 μm) that make peeling-off critical because very thin elastomers become delicate and tend to exhibit strong adhesion with carriers. Moreover, microfabrication techniques such as photolithography use solvents which swell PDMS, introducing complexity and possible contamination, thus limiting industrial scalability and preventing many biomedical applications. Here, we combine low-adhesion and rectangular carrier substrates, adhesive Kapton frames, micromilling-defined shadow masks, and adhesive-neutralizing paper frames for enabling fast, easy, green, contaminant-free, and scalable manufacturing of thin elastomer devices, with both simplified peeling and handling. The accurate alignment between the frame and shadow masks can be further facilitated by micromilled marking lines on the back side of the low-adhesion carrier. As a proof of concept, we show epidermal sensors on a 50 μm-thick PDMS substrate for measuring strain, the skin bioimpedance and the heart rate. The proposed approach paves the way to a straightforward, green, and scalable fabrication of contaminant-free thin devices on elastomers for a wide variety of applications.Elastomers and, in particular, polydimethylsiloxane (PDMS) are widely adopted as biocompatible mechanically compliant substrates for soft and flexible micro-nanosystems in medicine, biology, and engineering. However, several applications require such low thicknesses (e.g., <100 μm) that make peeling-off critical because very thin elastomers become delicate and tend to exhibit strong adhesion with carriers. Moreover, microfabrication techniques such as photolithography use solvents which swell PDMS, introducing complexity and possible contamination, thus limiting industrial scalability and preventing many biomedical applications. Here, we combine low-adhesion and rectangular carrier substrates, adhesive Kapton frames, micromilling-defined shadow masks, and adhesive-neutralizing paper frames for enabling fast, easy, green, contaminant-free, and scalable manufacturing of thin elastomer devices, with both simplified peeling and handling. The accurate alignment between the frame and shadow masks can be further facilitated by micromilled marking lines on the back side of the low-adhesion carrier. As a proof of concept, we show epidermal sensors on a 50 μm-thick PDMS substrate for measuring strain, the skin bioimpedance and the heart rate. The proposed approach paves the way to a straightforward, green, and scalable fabrication of contaminant-free thin devices on elastomers for a wide variety of applications

Search and dissemination in data processing

Manual retrieval methods were used to complete 54 searches of interest for the General Aviation Newsletter. Subjects of search ranged from television transmission to machine tooling, Apollo moon landings, electronic equipment, and aerodynamics studies

Technology utilization in a non-urban region: Further impact and technique of the Technology Use Studies Center

Updated information pertaining to clients who receive and use information disseminated by the Technology Use Studies Center (TUSC) is reported. Charts are provided which indicate TUSC's performance in information dissemination and technical assistance in terms of quantities of searches accomplished during several contract years. The faculty information service is described, along with details of cooperation with other agencies. Specific searches are listed according to subject, client, and client location, and a measure of client response to services provided is indicated by the included selection of transfer and impact reports. The impetus behind the formation of the general aviation news letter is also described

Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders

Lead-based solders have been used extensively for chip-attach and surface-mount processes in the electronic industry, and in marine applications. However, because of toxicity issues related to lead, efforts to develop a cost-effective lead-free replacement have been ongoing. This work investigates the corrosion behavior and resistance of two lead-free solders, namely Sn-8Zn-3Bi and Sn-3Ag-0.5Cu, and compares their performances with a common lead-based solder of Sn-37Pb at ambient temperature. Spreading, wetting angle, shear, and hardness were measured experimentally using standard methods and instrumentations. Experimental results showed that Sn-8Zn-3Bi has the highest wetting angle, while Sn-37Pb demonstrated the highest spreading. Intermetallic compounds Cu6Sn5 were found to be common in Sn-37Pb and Sn-3Ag- 0.5Cu, on the other hand, Cu6Sn8 was detected for Sn-8Zn-3Bi. The highest joint strength was given by Sn-37Pb represented by 0.09 MPa, which is higher by 66% and 33% than those of Sn-8Zn-3Bi and Sn-3Ag-0.5Cu, respectively. However, corrosion after 240 hr in seawater did not affect the magnitudes of shear strength substantially. This outcome was attributed mainly to the short time duration of exposure. Sn-8Zn-3Bi has the highest hardness among all solders. Corrosion caused an increase in hardness of all solders by 3.1, 6.74 and 2.49% for Sn-37Pb, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu respectively

Spacelab system analysis: A study of the Marshall Avionics System Testbed (MAST)

An analysis of the Marshall Avionics Systems Testbed (MAST) communications requirements is presented. The average offered load for typical nodes is estimated. Suitable local area networks are determined

Spacelab system analysis: A study of communications systems for advanced launch systems

An analysis of the required performance of internal avionics data bases for future launch vehicles is presented. Suitable local area networks that can service these requirements are determined