Detection of transient disturbing signals on PC boards

This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed

Design of a 20 GHz DPI method for SOIC8

International audienceThe direct power injection (DPI) test defined in IEC 62132-4 measures the conducted immunity of integrated circuits (ICs) up to 1GHz. As the frequency of functional and interference signals is increasing, we would like to characterise immunity for higher frequencies as well. In this paper, we show why typical IEC 62132-4 compliant DPI set-ups become inaccurate when going up to 20GHz. We propose to determine the power Ptrans actually transmitted to the device under test (DUT) by using offline short-open-load-thru (SOLT) or thru-reflect-line (TRL) calibration. Furthermore, we design a low-cost FR4 printed circuit board (PCB) that allows for testing of SOIC8-packaged ICs. We verify that this board has acceptable and reproducible losses up to 20 GHz, as well as acceptable crosstalk

Noise Mitigation Analysis of a Pi-Filter for an Automotive Control Module

This paper has been reproduced on " InCompliance" magazine, May issue http://www.incompliancemag.com/ then "Issue Archive

Hydrothermally extracted nanohydroxyapatite from bovine bone as bioceramic and biofiller in bionanocomposite

Bones have an extraordinary capacity to restore and regenerate in case of minor injury. However, major injuries need orthopedic surgeries that required bone implant biomaterials. In this study, n-HAP powder was extracted from bovine bone by hydrothermal and calcined at different calcination temperatures (600-1100°C) without the use of solvents. The n-HAP powders produced were used to fabricate two types of biomaterials (HAP bioceramics and PLA/n-HAP bionanocomposite). The raw-HAP and calcined n-HAP powder samples were compacted into green bodies and were sintered at various temperatures (1000-1400°C) to produce HAP bioceramics. The best calcined n-HAP was mixed with PLA by melt mixing and injection moulding to fabricate PLA/n-HAP bionanocomposite. Characterizations of the n-HAP powder, n-HAP bioceramics and PLA/n-HAP bionanocomposite samples were done by Thermogravimetric analysis (TGA), X-ray diffraction (XRD), Fourier transforms infrared (FTIR), Field emission scanning electron microscopy (FESEM), Energy-dispersive x-ray spectroscopy (EDX), X-ray fluorescence (XRF) spectroscopy, universal testing machine (UTM) and melt flow index (MFI) analyses. TGA data revealed that n-HAP was thermally stable at 1300ºC. The extracted n-HAP powder was highly crystalline and crystallite size was in the range of 10-83 nm as confirmed by XRD. Density and hardness of the n-HAP bioceramics increased as sintering temperature increased and showing maximum values at a temperature of 1400°C. The results of PLA/n-HAP bionanocomposite revealed that the higher n-HAP loaded (at 5wt%), the lower the tensile strength of bionanocomposite due to poor interfacial adhesion. The interfacial adhesion was improved by loading of 1.0 wt% maleic anhydride (MAH) as a compatibilizer. The biocompatibility of bionanocomposite was evaluated in simulated body fluids (SBF). The results showed that apatite layers were grown on the surfaces of both biomaterials. Therefore, both biomaterials formulated shall be promising medical biomaterials for orthopedic applications

FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems. The resulting performance bottleneck can be substantially reduced by conveying high-speed data optically instead of electronically. A novel active pluggable 82.5 Gb/s aggregate bit rate optical connector technology, the design and fabrication of a compact electro-optical printed circuit board to meet exacting specifications, and a method for low cost, high precision, passive optical assembly are presented. A demonstration platform was constructed to assess the viability of embedded electro-optical midplane technology in such systems including the first ever demonstration of a pluggable active optical waveguide printed circuit board connector. High-speed optical data transfer at 10.3125 Gb/s was demonstrated through a complex polymer waveguide interconnect layer embedded into a 262 mm × 240 mm × 4.3 mm electro-optical midplane. Bit error rates of less than 10-12 and optical losses as low as 6 dB were demonstrated through nine multimode polymer wave guides with an aggregate data bandwidth of 92.8125 Gb/s

Vibration Alert Bracelet for Notification of the Visually and Hearing Impaired

This paper presents the prototype of an electronic vibration bracelet designed to help the visually and hearing impaired to receive and send emergency alerts. The bracelet has two basic functions. The first function is to receive a wireless signal and respond with a vibration to alert the user. The second function is implemented by pushing one button of the bracelet to send an emergency signal. We report testing on a prototype system formed by a mobile application and two bracelets. The bracelets and the application form a complete system intended to be used in retirement apartment communities. However, the system is flexible and could be expanded to add new features or to serve as a research platform for gait analysis and location services. The medical and professional potential of the proposed system is that it offers a simple, modular, and cost-effective alternative to all the existing medical devices with similar functionality currently on the market. The proposed system has an educational potential as well: it can be used as a starting point for capstone projects and demonstration purposes in schools to attract students to STEM disciplines

Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

Nowadays, micro- and nanochips are usually\ud fabricated with Silicon and/or glass. A simple, low-cost and\ud reliable integration packaging method that provides flexibility\ud to the incorporation of electronic and fluidic devices into a\ud system has not been fully developed yet. The use of Printed\ud Circuit Board material as substrate to create dry film resist\ud microfluidic channels is the core technology to provide such an\ud integration method. The feasibility and potential of the\ud proposed packaging method is demonstrated in this wor