Optimizing power, delay and reliability for digital logic circuits with CMOS and single-electron technologies.

In this thesis, we present two low power approaches with consideration of delay and/or reliability. The first approach is based on CMOS (Complementary Metal-Oxide Semiconductor) technology. Given a gate level topology of digital circuits and a target library, we propose a greedy algorithm for delay budgeting in order to optimize power dissipation. The algorithm is implemented with JAVA SDK. The developed software tool estimates how much power dissipation (percentage) can be saved without increasing the circuit delay, and the potential of power savings by relaxing the circuit\u27s timing constraints. The second low power approach is proposed with SET (Single Electron Tunneling) technology. We focus on an elementary logic structure called threshold gate, and present a standard procedure of logic implementation, with analysis of delay, power and reliability due to background charge effect. As an application example, an FSM (Finite State Machine) for RFID (Radio Frequency Identification) system is designed and simulated successfully.Dept. of Electrical and Computer Engineering. Paper copy at Leddy Library: Theses & Major Papers - Basement, West Bldg. / Call Number: Thesis2006 .M5. Source: Masters Abstracts International, Volume: 45-01, page: 0418. Thesis (M.A.Sc.)--University of Windsor (Canada), 2006

Approximate Computing Survey, Part I: Terminology and Software & Hardware Approximation Techniques

The rapid growth of demanding applications in domains applying multimedia processing and machine learning has marked a new era for edge and cloud computing. These applications involve massive data and compute-intensive tasks, and thus, typical computing paradigms in embedded systems and data centers are stressed to meet the worldwide demand for high performance. Concurrently, the landscape of the semiconductor field in the last 15 years has constituted power as a first-class design concern. As a result, the community of computing systems is forced to find alternative design approaches to facilitate high-performance and/or power-efficient computing. Among the examined solutions, Approximate Computing has attracted an ever-increasing interest, with research works applying approximations across the entire traditional computing stack, i.e., at software, hardware, and architectural levels. Over the last decade, there is a plethora of approximation techniques in software (programs, frameworks, compilers, runtimes, languages), hardware (circuits, accelerators), and architectures (processors, memories). The current article is Part I of our comprehensive survey on Approximate Computing, and it reviews its motivation, terminology and principles, as well it classifies and presents the technical details of the state-of-the-art software and hardware approximation techniques.Comment: Under Review at ACM Computing Survey

Variability-Aware VLSI Design Automation For Nanoscale Technologies

As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging due to shrinking feature sizes and increasing design complexity. Aggressive scaling causes significant degradation in reliability, increased susceptibility to fabrication and environmental randomness and increased dynamic and leakage power dissipation. In this work, we investigate these scaling issues in large scale integrated systems. This dissertation proposes to develop variability-aware design methodologies by proposing design analysis, design-time optimization, post-silicon tunability and runtime-adaptivity based optimization techniques for handling variability. We discuss our research in the area of variability-aware analysis, specifically focusing on the problem of statistical timing analysis. The first technique presents the concept of error budgeting that achieves significant runtime speedups during statistical timing analysis. The second work presents a general framework for non-linear non-Gaussian statistical timing analysis considering correlations. Further, we present our work on design-time optimization schemes that are applicable during physical synthesis. Firstly, we present a buffer insertion technique that considers wire-length uncertainty and proposes algorithms to perform probabilistic buffer insertion. Secondly, we present a stochastic optimization framework based on Monte-Carlo technique considering fabrication variability. This optimization framework can be applied to problems that can be modeled as linear programs without without imposing any assumptions on the nature of the variability. Subsequently, we present our work on post-silicon tunability based design optimization. This work presents a design management framework that can be used to balance the effort spent on pre-silicon (through gate sizing) and post-silicon optimization (through tunable clock-tree buffers) while maximizing the yield gains. Lastly, we present our work on variability-aware runtime optimization techniques. We look at the problem of runtime supply voltage scaling for dynamic power optimization, and propose a framework to consider the impact of variability on the reliability of such designs. We propose a probabilistic design synthesis technique where reliability of the design is a primary optimization metric

Design methodology and productivity improvement in high speed VLSI circuits

2017 Spring.Includes bibliographical references.To view the abstract, please see the full text of the document

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Graduate Course Descriptions, 2005 Fall

Wright State University graduate course descriptions from Fall 2005

Graduate Course Descriptions, 2006 Winter

Wright State University graduate course descriptions from Winter 2006

Non-invasive power gating techniques for bursty computation workloads using micro-electro-mechanical relays

PhD ThesisElectrostatically-actuated Micro-Electro-Mechanical/Nano-Electro- Mechanical (MEM/NEM) relays are promising devices overcoming the energy-efficiency limitations of CMOS transistors. Many exploratory research projects are currently under way investigating the mechanical, electrical and logical characteristics of MEM/NEM relays. One particular issue that this work addresses is the need for a scalable and accurate physical model of the MEM/NEM switches that can be plugged into the standard EDA software. The existing models are accurate and detailed but they suffer from the convergence problem. This problem requires finding ad-hoc workarounds and significantly impacts the designer’s productivity. In this thesis we propose a new simplified Verilog-AMS model. To test scalability of the proposed model we cross-checked it against our analysis of a range of benchmark circuits. Results show that, compared to standard models, the proposed model is sufficiently accurate with an average of 6% error and can handle larger designs without divergence. This thesis also investigates the modelling, designing and optimization of various MEM/NEM switches using 3D Finite Element Analysis (FEA) performed by the COMSOL multiphysics simulation tool. An extensive parametric sweep simulation is performed to study the energy-latency trade-offs of MEM/NEM relays. To accurately simulate MEMS/NEMS-based digital circuits, a Verilog-AMS model is proposed based on the evaluated parameters obtained from the multiphysics simulation tool. This allows an accurate calibration of the MEM/NEM relays with a significant reduction in simulation speed compared to that of 3D FEA exercised on COMSOL tool. The effectiveness of two power gating approaches in asynchronous micropipelines is also investigated using MEM/NEM switches and sleep transistors in reducing idle power dissipation with a particular target throughput. Sleep transistors are traditionally used to power gate idle circuits, however, these transistors have fundamental limitations in their effectiveness. Alternatively, MEM/NEM relays with zero leakage current can achieve greater energy savings under a certain data rate and design architecture. An asynchronous FIR filter 4 phase bundled data handshake protocol is presented. Implementation is accomplished in 90nm technology node and simulation exercised at various data rates and design complexities. It was demonstrated that our proposed approach offers 69% energy improvements at a data rate 1KHz compared to 39% of the previous work. The current trends for greater heterogeneity in future Systems-on- Chip (SoC) do not only concern their functionality but also their timing and power aspects. The increasing diversity of timing and power supply conditions, and associated concurrently operating modes, within an SoC calls for more efficient power delivery networks (PDN) for battery operated devices. This is especially important for systems with mixed duty cycling, where some parts are required to work regularly with low-throughput while other parts are activated spontaneously, i.e. in bursts. To improve their reaction time vs energy efficiency, this work proposes to incorporate a power-switching network based on MEM relays to switch the SoC power-performance state (PPS) into an active mode while eliminating the leakage current when it is idle. Results show that even with today0s large and high pull-in voltages, a MEM-relay-based power switching network (PSN) can achieve a 1000x savings in energy compared to its CMOS counterpart for low duty cycle. A simple case of optimising an on-chip charge pump required to switch-on the relay has been investigated and its energy-latency overhead has been evaluated. Heterogeneous many-core systems are increasingly being employed in modern embedded platforms for high throughput at low energy cost considerations. These applications typically exhibit bursty workloads that provide opportunities to minimize system energy. CMOS-based power gating circuitry, typically consisting of sleep transistors, is used as an effective technique for idle energy reduction in such applications. However, these transistors contribute high leakage current when driving large capacitive loads, making effective energy minimization challenging. This thesis proposes a novel MEMS-based idle energy control approach. Core to this approach is an integrated sleep mode management based on the performance-energy states and bursty workloads indicated by the performance counters. A number of PARSEC benchmark applications are used as case studies of bursty workloads, including CPU- and memory- intensive ones. These applications are exercised on an Exynos 5422 heterogeneous many-core platform, engineered with a performance counter facilities, showing 55.5% energy savings compared with an on-demand governor. Furthermore, an extensive trade-off analysis demonstrates the comparative advantages of the MEMS-based controller, including zero-leakage current and non-invasive implementations suitable for commercial off-the-shelf systems.Higher committee of education development in Iraq (HCED

Modeling and Analysis of Large-Scale On-Chip Interconnects

As IC technologies scale to the nanometer regime, efficient and accurate modeling and analysis of VLSI systems with billions of transistors and interconnects becomes increasingly critical and difficult. VLSI systems impacted by the increasingly high dimensional process-voltage-temperature (PVT) variations demand much more modeling and analysis efforts than ever before, while the analysis of large scale on-chip interconnects that requires solving tens of millions of unknowns imposes great challenges in computer aided design areas. This dissertation presents new methodologies for addressing the above two important challenging issues for large scale on-chip interconnect modeling and analysis: In the past, the standard statistical circuit modeling techniques usually employ principal component analysis (PCA) and its variants to reduce the parameter dimensionality. Although widely adopted, these techniques can be very limited since parameter dimension reduction is achieved by merely considering the statistical distributions of the controlling parameters but neglecting the important correspondence between these parameters and the circuit performances (responses) under modeling. This dissertation presents a variety of performance-oriented parameter dimension reduction methods that can lead to more than one order of magnitude parameter reduction for a variety of VLSI circuit modeling and analysis problems. The sheer size of present day power/ground distribution networks makes their analysis and verification tasks extremely runtime and memory inefficient, and at the same time, limits the extent to which these networks can be optimized. Given today?s commodity graphics processing units (GPUs) that can deliver more than 500 GFlops (Flops: floating point operations per second). computing power and 100GB/s memory bandwidth, which are more than 10X greater than offered by modern day general-purpose quad-core microprocessors, it is very desirable to convert the impressive GPU computing power to usable design automation tools for VLSI verification. In this dissertation, for the first time, we show how to exploit recent massively parallel single-instruction multiple-thread (SIMT) based graphics processing unit (GPU) platforms to tackle power grid analysis with very promising performance. Our GPU based network analyzer is capable of solving tens of millions of power grid nodes in just a few seconds. Additionally, with the above GPU based simulation framework, more challenging three-dimensional full-chip thermal analysis can be solved in a much more efficient way than ever before