Comparison of multi-layer bus interconnection and a network on chip solution

Abstract. This thesis explains the basic subjects that are required to take in consideration when designing a network on chip solutions in the semiconductor world. For example, general topologies such as mesh, torus, octagon and fat tree are explained. In addition, discussion related to network interfaces, switches, arbitration, flow control, routing, error avoidance and error handling are provided. Furthermore, there is discussion related to design flow, a computer aided designing tools and a few comprehensive researches. However, several networks are designed for the minimum latency, although there are also versions which trade performance for decreased bus widths. These designed networks are compared with a corresponding multi-layer bus interconnection and both synthesis and register transfer level simulations are run. For example, results from throughput, latency, logic area and power consumptions are gathered and compared. It was discovered that overall throughput was well balanced with the network on chip solutions, although its maximum throughput was limited by protocol conversions. For example, the multi-layer bus interconnection was capable of providing a few times smaller latencies and higher throughputs when only a single interface was injected at the time. However, with parallel traffic and high-performance requirements a network on chip solution provided better results, even though the difference decreased when performance requirements were lower. Furthermore, it was discovered that the network on chip solutions required approximately 3–4 times higher total cell area than the multi-layer bus interconnection and that resources were mainly located at network interfaces and switches. In addition, power consumption was approximately 2–3 times higher and was mostly caused by dynamic consumption.Monitasoisen väyläarkkitehtuurin ja tietokoneverkkomaisen ratkaisun vertailua. Tiivistelmä. Tutkielmassa käsitellään tärkeimpiä aihealueita, jotka tulee huomioida suunniteltaessa tietokoneverkkomaisia väyläratkaisuja puolijohdemaailmassa. Esimerkiksi yleiset rakenteet, kuten verkko-, torus-, kahdeksankulmio- ja puutopologiat käsitellään lyhyesti. Lisäksi alustetaan verkon liitäntäkohdat, kytkimet, vuorottelu, vuon hallinta, reititys, virheiden välttely ja -käsittely. Lopuksi kerrotaan suunnitteluvuon oleellisimmat välivaiheet ja niihin soveltuvia kaupallisia työkaluja, sekä käsitellään lyhyesti muutaman aiemman julkaisun tuloksia. Tutkielmassa käytetään suunnittelutyökalua muutaman tietokoneverkkomaisen ratkaisun toteutukseen ja tavoitteena on saavuttaa pienin mahdollinen latenssi. Toisaalta myös hieman suuremman latenssin versioita suunnitellaan, mutta pienemmillä väylänleveyksillä. Lisäksi suunniteltuja tietokoneverkkomaisia ratkaisuja vertaillaan perinteisempään monitasoiseen väyläarkkitehtuuriin. Esimerkiksi synteesi- ja simulaatiotuloksia, kuten logiikan vaatimaa pinta-alaa, tehonkulutusta, latenssia ja suorituskykyä, vertaillaan keskenään. Tutkielmassa selvisi, että suunnittelutyökalulla toteutetut tietokoneverkkomaiset ratkaisut mahdollistivat tasaisemman suorituskyvyn, joskin niiden suurin saavutettu suorituskyky ja pienin latenssi määräytyivät protokollan käännöksen aiheuttamasta viiveestä. Tutkielmassa havaittiin, että perinteisemmillä menetelmillä saavutettiin noin kaksi kertaa suurempi suorituskyky ja pienempi latenssi, kun verkossa ei ollut muuta liikennettä. Rinnakkaisen liikenteen lisääntyessä tietokoneverkkomainen ratkaisu tarjosi keskimäärin paremman suorituskyvyn, kun sille asetetut tehokkuusvaateet olivat suuret, mutta suorituskykyvaatimuksien laskiessa erot kapenivat. Lisäksi huomattiin, että tietokoneverkkomaisten ratkaisujen käyttämä pinta-ala oli noin 3–4 kertaa suurempi kuin monitasoisella väyläarkkitehtuurilla ja että resurssit sijaitsivat enimmäkseen verkon liittymäkohdissa ja kytkimissä. Lisäksi tehonkulutuksen huomattiin olevan noin 2–3 kertaa suurempi, joskin sen havaittiin koostuvan pääosin dynaamisesta kulutuksesta

A study of topologies and protocols for fiber optic local area network

The emergence of new applications requiring high data traffic necessitates the development of high speed local area networks. Optical fiber is selected as the transmission medium due to its inherent advantages over other possible media and the dual optical bus architecture is shown to be the most suitable topology. Asynchronous access protocols, including token, random, hybrid random/token, and virtual token schemes, are developed and analyzed. Exact expressions for insertion delay and utilization at light and heavy load are derived, and intermediate load behavior is investigated by simulation. A new tokenless adaptive scheme whose control depends only on the detection of activity on the channel is shown to outperform round-robin schemes under uneven loads and multipacket traffic and to perform optimally at light load. An approximate solution to the queueing delay for an oscillating polling scheme under chaining is obtained and results are compared with simulation. Solutions to the problem of building systems with a large number of stations are presented, including maximization of the number of optical couplers, and the use of passive star/bus topologies, bridges and gateways

Processing experiments on non-Czochralski silicon sheet

A program is described which supports and promotes the development of processing techniques which may be successfully and cost-effectively applied to low-cost sheets for solar cell fabrication. Results are reported in the areas of process technology, cell design, cell metallization, and production cost simulation

On-chip interconnect schemes for reconfigurable system-on-chip

On-chip communication architectures can have a great influence on the speed and area of System-on-Chip designs, and this influence is expected to be even more pronounced on reconfigurable System-on-Chip (rSoC) designs. To date, little research has been conducted on the performance implications of different on-chip communication architectures for rSoC designs. This paper motivates the need for such research and analyses current and proposed interconnect technologies for rSoC design. The paper also describes work in progress on implementation of a simple serial bus and a packet-switched network, as well as a methodology for quantitatively evaluating the performance of these interconnection structures in comparison to conventional buses

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

On-board processing satellite network architecture and control study

The market for telecommunications services needs to be segmented into user classes having similar transmission requirements and hence similar network architectures. Use of the following transmission architecture was considered: satellite switched TDMA; TDMA up, TDM down; scanning (hopping) beam TDMA; FDMA up, TDM down; satellite switched MF/TDMA; and switching Hub earth stations with double hop transmission. A candidate network architecture will be selected that: comprises multiple access subnetworks optimized for each user; interconnects the subnetworks by means of a baseband processor; and optimizes the marriage of interconnection and access techniques. An overall network control architecture will be provided that will serve the needs of the baseband and satellite switched RF interconnected subnetworks. The results of the studies shall be used to identify elements of network architecture and control that require the greatest degree of technology development to realize an operational system. This will be specified in terms of: requirements of the enabling technology; difference from the current available technology; and estimate of the development requirements needed to achieve an operational system. The results obtained for each of these tasks are presented

Scaling High-Performance Interconnect Architectures to Many-Core Systems.

The ever-increasing demand for performance scaling has made multi-core (2-8 cores) chips prevalent in today’s computing systems and foreshadows the shift toward many-core (10s- 100s of cores) chips in the near future. Although the potential performance gains from many-core systems remain appealing, the widespread adoption of these systems hinges on their ability to scale performance while simultaneously satisfying Quality-of-Service (QoS) and energy-efficiency constraints. This work makes the case that the interconnect for these many-core systems has a significant impact on the aforementioned scalability issues. The impact of interconnects on many-core systems is illustrated by observing that the degree of the interconnect has a signicant effect on system scalability and demonstrating that the architecture of high-radix, many-core systems are feasible, energy-efficient, and high-performance. The feasibility of high-radix crossbars for many-core systems is first shown through a new circuit-level building block called the Swizzle-Switch which can operate at frequencies up to 1.5GHz for 128-bit, radix-64 crossbars. This work then shows how a many-core system called the Swizzle-Switch Network (SSN) can use the Swizzle-Switch as the central building block for a flat crossbar interconnect. The SSN is shown to be advantageous to traditional Network-on-Chip (NoC) for systems up to 64 cores. The SSN performance by 21% relative to a Mesh while also providing a 25% energy savings over the Mesh. The Swizzle-Switch is also leveraged as a building block for high-radix NoC topologies that can support many-core architectures. The Swizzle-Switch-based Flattened Butterfly topology is demonstrated to provide a 15% speedup and 10% energy savings over the Mesh. Finally, the impact that 3D stacking technology has on many-core scalability is evaluated for bus and crossbar interconnects. A 3D-optimized Swizzle-Switch Network is able to leverage frequency gains to achieve a 15-28% speedup over a 2D-Swizzle-Switch Network when using memory- intensive benchmarks. Additionally, a bus-based 64-core architecture is shown to provide an average speedup of 49× over a baseline uniprocessor system when using 3D technology.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/93980/1/ksewell_1.pd