High-Performance Placement and Routing for the Nanometer Scale.

Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years ago required ten to twenty chips. Naturally, design complexity has grown within this period. In contrast to this growth, it is becoming common in the industry to limit design team size which places a heavier burden on design automation tools. Our work identifies new objectives, constraints and concerns in the physical design of systems-on-chip, and develops new computational techniques to address them. In addition to faster and more relevant design optimizations, we demonstrate that traditional design flows based on ``separation of concerns'' produce unnecessarily suboptimal layouts. We develop new integrated optimizations that streamline traditional chains of loosely-linked design tools. In particular, we bridge the gap between mixed-size placement and routing by updating the objective of global and detail placement to a more accurate estimate of routed wirelength. To this we add sophisticated whitespace allocation, and the combination provides increased routability, faster routing, shorter routed wirelength, and the best via counts of published techniques. To further improve post-routing design metrics, we present new global routing techniques based on Discrete Lagrange Multipliers (DLM) which produce the best routed wirelength results on recent benchmarks. Our work culminates in the integration of our routing techniques within an incremental placement flow to improve detailed routing solutions, shrink die sizes and reduce total chip cost. Not only do our techniques improve the quality and cost of designs, but also simplify design automation software implementation in many cases. Ultimately, we reduce the time needed for design closure through improved tool fidelity and the use of our incremental techniques for placement and routing.Ph.D.Computer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/64639/1/royj_1.pd

An integrated placement and routing approach

As the feature size continues scaling down, interconnects become the major contributor of signal delay. Since interconnects are mainly determined by placement and routing, these two stages play key roles to achieve high performance. Historically, they are divided into two separate stages to make the problem tractable. Therefore, the routing information is not available during the placement process. Net models such as HPWL, are employed to approximate the routing to simplify the placement problem. However, the good placement in terms of these objectives may not be routable at all in the routing stage because different objectives are optimized in placement and routing stages. This inconsistancy makes the results obtained by the two-step optimization method far from optimal;In order to achieve high-quality placement solution and ensure the following routing, we propose an integrated placement and routing approach. In this approach, we integrate placement and routing into the same framework so that the objective optimized in placement is the same as that in routing. Since both placement and routing are very hard problems (NP-hard), we need to have very efficient algorithms so that integrating them together will not lead to intractable complexity;In this dissertation, we first develop a highly efficient placer - FastPlace 3.0 for large-scale mixed-size placement problem. Then, an efficient and effective detailed placer - FastDP is proposed to improve global placement by moving standard cells in designs. For high-degree nets in designs, we propose a novel performance-driven topology design algorithm to generate good topologies to achieve very strict timing requirement. In the routing phase, we develop two global routers, FastRoute and FastRoute 2.0. Compared to traditional global routers, they can generate better solutions and are two orders of magnitude faster. Finally, based on these efficient and high-quality placement and routing algorithms, we propose a new flow which integrates placement and routing together closely. In this flow, global routing is extensively applied to obtain the interconnect information and direct the placement process. In this way, we can get very good placement solutions with guaranteed routability

Broadening the Scope of Multi-Objective Optimizations in Physical Synthesis of Integrated Circuits.

In modern VLSI design, physical synthesis tools are primarily responsible for satisfying chip-performance constraints by invoking a broad range of circuit optimizations, such as buffer insertion, logic restructuring, gate sizing and relocation. This process is known as timing closure. Our research seeks more powerful and efficient optimizations to improve the state of the art in modern chip design. In particular, we integrate timing-driven relocation, retiming, logic cloning, buffer insertion and gate sizing in novel ways to create powerful circuit transformations that help satisfy setup-time constraints. State-of-the-art physical synthesis optimizations are typically applied at two scales: i) global algorithms that affect the entire netlist and ii) local transformations that focus on a handful of gates or interconnections. The scale of modern chip designs dictates that only near-linear-time optimization algorithms can be applied at the global scope — typically limited to wirelength-driven placement and legalization. Localized transformations can rely on more time-consuming optimizations with accurate delay models. Few techniques bridge the gap between fully-global and localized optimizations. This dissertation broadens the scope of physical synthesis optimization to include accurate transformations operating between the global and local scales. In particular, we integrate groups of related transformations to break circular dependencies and increase the number of circuit elements that can be jointly optimized to escape local minima. Integrated transformations in this dissertation are developed by identifying and removing obstacles to successful optimizations. Integration is achieved through mapping multiple operations to rigorous mathematical optimization problems that can be solved simultaneously. We achieve computational scalability in our techniques by leveraging analytical delay models and focusing optimization efforts on carefully selected regions of the chip. In this regard, we make extensive use of a linear interconnect-delay model that accounts for the impact of subsequent repeated insertion. Our integrated transformations are evaluated on high-performance circuits with over 100,000 gates. Integrated optimization techniques described in this dissertation ensure graceful timing-closure process and impact nearly every aspect of a typical physical synthesis flow. They have been validated in EDA tools used at IBM for physical synthesis of high-performance CPU and ASIC designs, where they significantly improved chip performance.Ph.D.Computer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/78744/1/iamyou_1.pd

High-performance Global Routing for Trillion-gate Systems-on-Chips.

Due to aggressive transistor scaling, modern-day CMOS circuits have continually increased in both complexity and productivity. Modern semiconductor designs have narrower and more resistive wires, thereby shifting the performance bottleneck to interconnect delay. These trends considerably impact timing closure and call for improvements in high-performance physical design tools to keep pace with the current state of IC innovation. As leading-edge designs may incorporate tens of millions of gates, algorithm and software scalability are crucial to achieving reasonable turnaround time. Moreover, with decreasing device sizes, optimizing traditional objectives is no longer sufficient. Our research focuses on (i) expanding the capabilities of standalone global routing, (ii) extending global routing for use in different design applications, and (iii) integrating routing within broader physical design optimizations and flows, e.g., congestion-driven placement. Our first global router relies on integer-linear programming (ILP), and can solve fairly large problem instances to optimality. Our second iterative global router relies on Lagrangian relaxation, where we relax the routing violation constraints to allowing routing overflow at a penalty. In both approaches, our desire is to give the router the maximum degree of freedom within a specified context. Empirically, both routers produce competitive results within a reasonable amount of runtime. To improve routability, we explore the incorporation of routing with placement, where the router estimates congestion and feeds this information to the placer. In turn, the emphasis on runtime is heightened, as the router will be invoked multiple times. Empirically, our placement-and-route framework significantly improves the final solution’s routability than performing the steps sequentially. To further enhance routability-driven placement, we (i) leverage incrementality to generate fast and accurate congestion maps, and (ii) develop several techniques to relieve cell-based and layout-based congestion. To broaden the scope of routing, we integrate a global router in a chip-design flow that addresses the buffer explosion problem.PHDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/98025/1/jinhu_1.pd

Nanometer VLSI placement and optimization for multi-objective design closure

In a VLSI physical synthesis flow, placement directly defines the interconnection, which affects many other design objectives, such as timing, power consumption, congestion, and thermal issues. With the scaling of technology, the relative interconnect delay increases dramatically. As a result, placement has become a bottleneck in deep sub-micron physical synthesis. In this dissertation, I propose several optimization algorithms from global placement, placement migration, timing driven placements, to incremental power optimizations for multi-objective VLSI design closure. The first work is DPlace, a new global placement algorithm that scales well to the modern large-scale circuit placement problems. DPlace simulates the natural diffusion process to spread cells smoothly over the placement region, and uses both analytical and discrete techniques to improve the wire length. However, global placement is never sufficient for multi-objective design closure, a variety of design objectives have to be improved incrementally, such as timing, routing congestion, signal integrity, and heat distribution. Placement migration is a critical step to address the cell overlaps appearing during incremental optimizations. To achieve high placement stability, I propose a computational geometry based placement migration flow to cope with placement changes, and a new stability metric to measure the “similarity” between two placements accurately. Our placement migration algorithm has clear advantage over conventional legalization algorithms such that the neighborhood characteristics of the original placement are preserved. For timing closure in high performance designs, I present a linear programming based incremental timing driven placement to improve the timing on critical paths directly. I further present an efficient timing driven placement algorithm (Pyramids). Two formulations of Pyramids are proposed, which are suitable for different optimization stages in a physical synthesis flow. Both approaches find the optimal location for timing of a cell in constant time, through computational geometry based approaches. For fast convergence of design closure, placement should be integrated with other optimization techniques. I propose to combine placement, gate sizing and Vt swapping techniques to reduce the total power consumption, especially the leakage power, which is becoming increasingly critical for nanometer VLSI design closure.Electrical and Computer Engineerin

Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits

The main objective of this research is to predict the wirelength, area, delay, and power of multi-granularity three-dimensional integrated circuits (3D ICs), to develop physical design methodologies and algorithms for the design of multi-granularity 3D ICs, and to investigate the impact of through-silicon vias (TSVs) on the quality of 3D ICs. This dissertation supports these objectives by addressing six research topics. The first pertains to analytical models that predict the interconnects of multi-granularity 3D ICs, and the second focuses on the development of analytical models of the capacitive coupling of TSVs. The third and the fourth topics present design methodologies and algorithms for the design of gate- and block-level 3D ICs, and the fifth topic pertains to the impact of TSVs on the quality of 3D ICs. The final topic addresses topography variation in 3D ICs. The first section of this dissertation presents TSV-aware interconnect prediction models for multi-granularity 3D ICs. As previous interconnect prediction models for 3D ICs did not take TSV area into account, they were not capable of predicting many important characteristics of 3D ICs related to TSVs. This section will present several previous interconnect prediction models that have been improved so that the area occupied by TSVs is taken into account. The new models show numerous important predictions such as the existence of the number of TSVs minimizing wirelength. The second section presents fast estimation of capacitive coupling of TSVs and wires. Since TSV-to-TSV and TSV-to-wire coupling capacitance is dependent on their relative locations, fast estimation of the coupling capacitance of a TSV is essential for the timing optimization of 3D ICs. Simulation results show that the analytical models presented in this section are sufficiently accurate for use at various design steps that require the computation of TSV capacitance. The third and fourth sections present design methodologies and algorithms for gate- and block-level 3D ICs. One of the biggest differences in the design of 2D and 3D ICs is that the latter requires TSV insertion. Since no widely-accepted design methodology designates when, where, and how TSVs are inserted, this work develops and presents several design methodologies for gate- and block-level 3D ICs and physical design algorithms supporting them. Simulation results based on GDSII-level layouts validate the design methodologies and present evidence of their effectiveness. The fifth section explores the impact of TSVs on the quality of 3D ICs. As TSVs become smaller, devices are shrinking, too. Since the relative size of TSVs and devices is more critical to the quality of 3D ICs than the absolute size of TSVs and devices, TSVs and devices should be taken into account in the study of the impact of TSVs on the quality of 3D ICs. In this section, current and future TSVs and devices are combined to produce 3D IC layouts and the impact of TSVs on the quality of 3D ICs is investigated. The final section investigates topography variation in 3D ICs. Since landing pads fabricated in the bottommost metal layer are attached to TSVs, they are larger than TSVs, so they could result in serious topography variation. Therefore, topography variation, especially in the bottommost metal layer, is investigated and two layout optimization techniques are applied to a global placement algorithm that minimizes the topography variation of the bottommost metal layer of 3D ICs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Mukhopadhyay, Saiba

Handling the complexity of routing problem in modern VLSI design

In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pins and ports of circuit gates and blocks. Traditionally, VLSI routing is an important design step in the sense that the quality of routing solution has great impact on various design metrics such as circuit timing, power consumption, chip reliability and manufacturability etc. As the advancing VLSI design enters the nanometer era, the routing success (routability issue) has been arising as one of the most critical problems in back-end design. In one aspect, the degree of design complexity is increasing dramatically as more and more modules are integrated into the chip. Much higher chip density leads to higher routing demands and potentially more risks in routing failure. In another aspect, with decreasing design feature size, there are more complex design rules imposed to ensure manufacturability. These design rules are hard to satisfy and they usually create more barriers for achieving routing closure (i.e., generate DRC free routing solution) and thus affect chip time to market (TTM) plan. In general, the behavior and performance of routing are affected by three consecutive phases: placement phase, global routing phase and detailed routing phase in a typical VLSI physical design flow. Traditional CAD tools handle each of the three phases independently and the global picture of the routability issue is neglected. Different from conventional approaches which propose tools and algorithms for one particular design phase, this thesis investigates the routability issue from all three phases and proposes a series of systematic solutions to build a more generic flow and improve quality of results (QoR). For the placement phase, we will introduce a mixed-sized placement refinement tool for alleviating congestion after placement. The tool shifts and relocates modules based on a global routing estimation. For the global routing phase, a very fast and effective global router is developed. Its performance surpasses many peer works as verified by ISPD 2008 global routing contest results. In the detailed routing phase, a tool is proposed to perform detailed routing using regular routing patterns based on a correct-by-construction methodology to improve routability as well as satisfy most design rules. Finally, the tool which integrates global routing and detailed routing is developed to remedy the inconsistency between global routing and detailed routing. To verify the algorithms we proposed, three sets of testcases derived from ISPD98 and ISPD05/06 placement benchmark suites are proposed. The results indicate that our proposed methods construct an integrated and systematic flow for routability improvement which is better than conventional methods

Some Applications of the Weighted Combinatorial Laplacian

The weighted combinatorial Laplacian of a graph is a symmetric matrix which is the discrete analogue of the Laplacian operator. In this thesis, we will study a new application of this matrix to matching theory yielding a new characterization of factor-criticality in graphs and matroids. Other applications are from the area of the physical design of very large scale integrated circuits. The placement of the gates includes the minimization of a quadratic form given by a weighted Laplacian. A method based on the dual constrained subgradient method is proposed to solve the simultaneous placement and gate-sizing problem. A crucial step of this method is the projection to the flow space of an associated graph, which can be performed by minimizing a quadratic form given by the unweighted combinatorial Laplacian.Andwendungen der gewichteten kombinatorischen Laplace-Matrix Die gewichtete kombinatorische Laplace-Matrix ist das diskrete Analogon des Laplace-Operators. In dieser Arbeit stellen wir eine neuartige Charakterisierung von Faktor-Kritikalität von Graphen und Matroiden mit Hilfe dieser Matrix vor. Wir untersuchen andere Anwendungen im Bereich des Entwurfs von höchstintegrierten Schaltkreisen. Die Platzierung basiert auf der Minimierung einer quadratischen Form, die durch eine gewichtete kombinatorische Laplace-Matrix gegeben ist. Wir präsentieren einen Algorithmus für das allgemeine simultane Platzierungs- und Gattergrößen-Optimierungsproblem, der auf der dualen Subgradientenmethode basiert. Ein wichtiger Bestandteil dieses Verfahrens ist eine Projektion auf den Flussraum eines assoziierten Graphen, die als die Minimierung einer durch die Laplace-Matrix gegebenen quadratischen Form aufgefasst werden kann