Noise shaping Asynchronous SAR ADC based time to digital converter

Time-to-digital converters (TDCs) are key elements for the digitization of timing information in modern mixed-signal circuits such as digital PLLs, DLLs, ADCs, and on-chip jitter-monitoring circuits. Especially, high-resolution TDCs are increasingly employed in on-chip timing tests, such as jitter and clock skew measurements, as advanced fabrication technologies allow fine on-chip time resolutions. Its main purpose is to quantize the time interval of a pulse signal or the time interval between the rising edges of two clock signals. Similarly to ADCs, the performance of TDCs are also primarily characterized by Resolution, Sampling Rate, FOM, SNDR, Dynamic Range and DNL/INL. This work proposes and demonstrates 2nd order noise shaping Asynchronous SAR ADC based TDC architecture with highest resolution of 0.25 ps among current state of art designs with respect to post-layout simulation results. This circuit is a combination of low power/High Resolution 2nd Order Noise Shaped Asynchronous SAR ADC backend with simple Time to Amplitude converter (TAC) front-end and is implemented in 40nm CMOS technology. Additionally, special emphasis is given on the discussion on various current state of art TDC architectures.Electrical and Computer Engineerin

ToPoliNano: Nanoarchitectures Design Made Real

Many facts about emerging nanotechnologies are yet to be assessed. There are still major concerns, for instance, about maximum achievable device density, or about which architecture is best fit for a specific application. Growing complexity requires taking into account many aspects of technology, application and architecture at the same time. Researchers face problems that are not new per se, but are now subject to very different constraints, that need to be captured by design tools. Among the emerging nanotechnologies, two-dimensional nanowire based arrays represent promising nanostructures, especially for massively parallel computing architectures. Few attempts have been done, aimed at giving the possibility to explore architectural solutions, deriving information from extensive and reliable nanoarray characterization. Moreover, in the nanotechnology arena there is still not a clear winner, so it is important to be able to target different technologies, not to miss the next big thing. We present a tool, ToPoliNano, that enables such a multi-technological characterization in terms of logic behavior, power and timing performance, area and layout constraints, on the basis of specific technological and topological descriptions. This tool can aid the design process, beside providing a comprehensive simulation framework for DC and timing simulations, and detailed power analysis. Design and simulation results will be shown for nanoarray-based circuits. ToPoliNano is the first real design tool that tackles the top down design of a circuit based on emerging technologie

Design of a compact and low-power TDC for an array of SiPM's in 110nm CIS technology

Silicon photomultipliers (SiPMs) are meant to substitute photomultiplier tubes in high-energy physics detectors and nuclear medicine. This is because of their -to name a few interesting properties- compactness, lower bias voltage, tolerance to magnetic fields and finer spatial resolution. SiPMs can also be built in CMOS technology. This allows the incorporation of active quenching and recharge schemes at cell level and processing circuitry at pixel level. One of the elements that can lead to finer temporal resolutions is the time-to-digital converter (TDC). In this paper we describe the architecture of a compact TDC to be included at each pixel of an array of SiPMs. It is compact and consumes low power. It is based on a voltage controlled oscillator that generates multiple internal phases that are interpolated to provide time resolution below the time delay of a single gate. Simulation results of a 11b TDC based on a 4-stage VCRO in 110nm CIS technology yield a time resolution of 80.0ps, a DNL of ±0.28 LSB, a INL ±0.52 LSB, and a power consumption of 850μW.Ministerio de Economía y Competitividad TEC2015-66878-C3-1-RJunta de Andalucía TIC 2012-2338Office of Naval Research (USA) N00014141035

Modeling of thermally induced skew variations in clock distribution network

Clock distribution network is sensitive to large thermal gradients on the die as the performance of both clock buffers and interconnects are affected by temperature. A robust clock network design relies on the accurate analysis of clock skew subject to temperature variations. In this work, we address the problem of thermally induced clock skew modeling in nanometer CMOS technologies. The complex thermal behavior of both buffers and interconnects are taken into account. In addition, our characterization of the temperature effect on buffers and interconnects provides valuable insight to designers about the potential impact of thermal variations on clock networks. The use of industrial standard data format in the interface allows our tool to be easily integrated into existing design flow

A Novel Cyclic Time to Digital Converter Based on Triple-Slope Interpolation and Time Amplification

This paper investigates a novel cyclic time-to-digital converter (TDC) which employs triple-slope analog interpolation and time amplification techniques for digitizing the time interval between the rising edges of two input signals(Start and Stop). The proposed converter will be a 9-bit cyclic time-to-digital converter that does not use delay lines in its structure. Therefore, it has a low sensitivity to temperature, power supply and process (PVT) variations. The other advantages of the proposed converter are low circuit complexity, and high accuracy compared with the time-to-digital converters that have previously been proposed. Also, this converter improves the time resolution and the dynamic range. In the same resolution, linear range and dynamic range, the proposed cyclic TDC reduces the number of circuit elements compared with the converters that have a similar circuit structure. Thus, the converter reduces the chip area, the power consumption and the figure of merit (FoM). In this converter, the integral nonlinearity (INL) and differential nonlinearity (DNL) errors are reduced. In order to evaluate the idea, the proposed time-to-digital converter is designed in TSMC 45 nm CMOS technology and simulated. Comparison of the theoretical and simulation results confirms the benefits of the proposed TDC

An Offset Cancelation Technique for Latch Type Sense Amplifiers

An offset compensation technique for a latch type sense amplifier is proposed in this paper. The proposed scheme is based on the recalibration of the charging/discharging current of the critical nodes which are affected by the device mismatches. The circuit has been designed in a 65 nm CMOS technology with 1.2 V core transistors. The auto-calibration procedure is fully digital. Simulation results are given verifying the operation for sampling a 5 Gb/s signal dissipating only 360 uW

Asynchronous Circuit Stacking for Simplified Power Management

As digital integrated circuits (ICs) continue to increase in complexity, new challenges arise for designers. Complex ICs are often designed by incorporating multiple power domains therefore requiring multiple voltage converters to produce the corresponding supply voltages. These converters not only take substantial on-chip layout area and/or off-chip space, but also aggregate the power loss during the voltage conversions that must occur fast enough to maintain the necessary power supplies. This dissertation work presents an asynchronous Multi-Threshold NULL Convention Logic (MTNCL) “stacked” circuit architecture that alleviates this problem by reducing the number of voltage converters needed to supply the voltage the ICs operate at. By stacking multiple MTNCL circuits between power and ground, supplying a multiple of VDD to the entire stack and incorporating simple control mechanisms, the dynamic range fluctuation problem can be mitigated. A 130nm Bulk CMOS process and a 32nm Silicon-on-Insulator (SOI) CMOS process are used to evaluate the theoretical effect of stacking different circuitry while running different workloads. Post parasitic physical implementations are then carried out in the 32nm SOI process for demonstrating the feasibility and analyzing the advantages of the proposed MTNCL stacking architecture