Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

FLEXIBLE LOW-COST HW/SW ARCHITECTURES FOR TEST, CALIBRATION AND CONDITIONING OF MEMS SENSOR SYSTEMS

During the last years smart sensors based on Micro-Electro-Mechanical systems (MEMS) are widely spreading over various fields as automotive, biomedical, optical and consumer, and nowadays they represent the outstanding state of the art. The reasons of their diffusion is related to the capability to measure physical and chemical information using miniaturized components. The developing of this kind of architectures, due to the heterogeneities of their components, requires a very complex design flow, due to the utilization of both mechanical parts typical of the MEMS sensor and electronic components for the interfacing and the conditioning. In these kind of systems testing activities gain a considerable importance, and they concern various phases of the life-cycle of a MEMS based system. Indeed, since the design phase of the sensor, the validation of the design by the extraction of characteristic parameters is important, because they are necessary to design the sensor interface circuit. Moreover, this kind of architecture requires techniques for the calibration and the evaluation of the whole system in addition to the traditional methods for the testing of the control circuitry. The first part of this research work addresses the testing optimization by the developing of different hardware/software architecture for the different testing stages of the developing flow of a MEMS based system. A flexible and low-cost platform for the characterization and the prototyping of MEMS sensors has been developed in order to provide an environment that allows also to support the design of the sensor interface. To reduce the reengineering time requested during the verification testing a universal client-server architecture has been designed to provide a unique framework to test different kind of devices, using different development environment and programming languages. Because the use of ATE during the engineering phase of the calibration algorithm is expensive in terms of ATE’s occupation time, since it requires the interruption of the production process, a flexible and easily adaptable low-cost hardware/software architecture for the calibration and the evaluation of the performance has been developed in order to allow the developing of the calibration algorithm in a user-friendly environment that permits also to realize a small and medium volume production. The second part of the research work deals with a topic that is becoming ever more important in the field of applications for MEMS sensors, and concerns the capability to combine information extracted from different typologies of sensors (typically accelerometers, gyroscopes and magnetometers) to obtain more complex information. In this context two different algorithm for the sensor fusion has been analyzed and developed: the first one is a fully software algorithm that has been used as a means to estimate how much the errors in MEMS sensor data affect the estimation of the parameter computed using a sensor fusion algorithm; the second one, instead, is a sensor fusion algorithm based on a simplified Kalman filter. Starting from this algorithm, a bit-true model in Mathworks Simulink(TM) has been created as a system study for the implementation of the algorithm on chip

System-Level Power Estimation Methodology for MPSoC based Platforms

Avec l'essor des nouvelles technologies d'intégration sur silicium submicroniques, la consommation de puissance dans les systèmes sur puce multiprocesseur (MPSoC) est devenue un facteur primordial au niveau du flot de conception. La prise en considération de ce facteur clé dès les premières phases de conception, joue un rôle primordial puisqu'elle permet d'augmenter la fiabilité des composants et de réduire le temps d'arrivée sur le marché du produit final.Shifting the design entry point up to the system-level is the most important countermeasure adopted to manage the increasing complexity of Multiprocessor System on Chip (MPSoC). The reason is that decisions taken at this level, early in the design cycle, have the greatest impact on the final design in terms of power and energy efficiency. However, taking decisions at this level is very difficult, since the design space is extremely wide and it has so far been mostly a manual activity. Efficient system-level power estimation tools are therefore necessary to enable proper Design Space Exploration (DSE) based on power/energy and timing.VALENCIENNES-Bib. électronique (596069901) / SudocSudocFranceF

Pin-limited frequency downscaler AHB bridge for ASIC to FPGA communication

Output connections to out-of-chip devices in modern mixed-signal ICs represent a significant design problem due to the limited number of available pins (in not Ball Grid Array package) and to the common need of a frequency reduction, especially into systems that require an external System on Programmable Chip (SoPC). In this paper, an ASIC solution based on bisynchronous FIFO structures for frequency conversion is presented. The proposed bridge involves a custom protocol for the conversion of the transmitted data in low frequency and low width bus. Moreover, it allows managing data transmission with two different priority levels. The module is AHB lite compliant with a number of pins equal to the width of the FIFOs (configurable during implementation phase) and two handshaking signals. Output clock frequency and internal FIFOs dimension are user-defined too