Real Time Automated Counterfeit Integrated Circuit Detection using X-ray Microscopy

Determining the authenticity of integrated circuits is paramount to preventing counterfeit and malicious hardware from being used in critical military, healthcare, aerospace, consumer, and industry applications. Existing techniques to distinguish between authentic and counterfeit integrated circuits (ICs) often include destructive testing requiring subject matter experts. We present a nondestructive technique to detect ICs using x-ray microscopy and advanced imaging analysis with different pattern recognition approaches. Our proposed method is completely automated, and runs in real time. In our approach, images of an integrated circuit are obtained from an x-ray microscope. Local binary pattern features are then extracted from the x-ray image, followed by dimensionality reduction through principal component analysis, and alternatively through a nonlinear principal component methodology using a stacked autoencoder embedded in a deep neural network. From the reduced dimension features, we train two types of learning machines, a support vector machine with a nonlinear kernel and a deep neural network. We present experiments using authentic and ICs to demonstrate that the proposed approach achieves an accuracy of 100% in distinguishing between the counterfeit and authentic samples.This work was supported by the NSF grant NSF/CISE Award #CNS–134427

Towards the Avoidance of Counterfeit Memory: Identifying the DRAM Origin

Due to the globalization in the semiconductor supply chain, counterfeit dynamic random-access memory (DRAM) chips/modules have been spreading worldwide at an alarming rate. Deploying counterfeit DRAM modules into an electronic system can have severe consequences on security and reliability domains because of their sub-standard quality, poor performance, and shorter life span. Besides, studies suggest that a counterfeit DRAM can be more vulnerable to sophisticated attacks. However, detecting counterfeit DRAMs is very challenging because of their nature and ability to pass the initial testing. In this paper, we propose a technique to identify the DRAM origin (i.e., the origin of the manufacturer and the specification of individual DRAM) to detect and prevent counterfeit DRAM modules. A silicon evaluation shows that the proposed method reliably identifies off-the-shelf DRAM modules from three major manufacturers

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects