Vibration Fatigue of Leaded Solder Joint Interconnects for PCB Electronics

With the increasing prevalence of electronic equipment worldwide, there is also a decrease in the size of the components on their printed circuit boards (PCBs), leading to an increase in the density of these components. A significant amount of failure in electronic equipment is vibration fatigue of solder joints and their attachments. However, the complexity of these PCBs and their components has made finite element modeling (FEM) more complex, adding considerable time to create and analyze a model. This paper aims to provide a literature review for the vibration fatigue of leaded solder components, create a test setup, and validate an analytical solder joint stress model. The literature review provides a walkthrough on modeling PCBs and their components using FEMs and analytical models, fatigue modeling methodology, and fatigue testing data and highlights gaps in the literature. This review was important to compile due to the limited data and the rigor required to find it all when searching. With this literature review collected, testing was to be completed using an analytical model highlighted. Therefore, a setup and procedure have been developed to test the vibration fatigue of leaded solder attachments. The setup combines a test specimen, specimen mounting head, and preliminary model correlation between the test specimen and FEM. Using initial model correlations, an analytical solder joints stress model, and fatigue curves from literature, a vibration fatigue life prediction was made for the test specimen, and tests were run. However, the results were inconclusive and further testing is deemed necessary. Suggestions have been made, such as picking other analytical models to test, modifying the test setup, and increasing the fidelity of local areas in the FEM

COMPARISON OF INTERCONNECT FAILURES OF ELECTRONIC COMPONENTS MOUNTED ON FR-4 BOARDS WITH SN37PB AND SN3.0AG0.5CU SOLDERS UNDER RAPID LOADING CONDITIONS.

Electronic circuit boards can experience rapid loading through shock or vibration events during their lives; these events can happen in transportation, manufacture, or in field conditions. Due to the lead-free migration, it is necessary to evaluate how this rapid loading affects the durability of a leading lead free solder alternative (Sn3.0Ag0.5Cu) assemblies as compared with traditional eutectic lead based solder Sn37Pb assemblies. A literature review showed that there is little agreement on the fatigue behavior of Sn37Pb solder assemblies and Sn3.0Ag0.5Cu solder assemblies subjected to rapid loading. To evaluate the failure behavior of Sn37Pb and Sn3.0Ag0.5Cu solder assemblies under rapid loading conditions, leadless chip resistors (LCR), ball grid arrays (BGA), small outline integrated circuits (SOIC), and small outline transistors (SOT) were subjected to four point bend tests via a servo-hydraulic testing machine at printed wiring board (PWB) strain rates greater than 0.1/s. The PWB strain was the metric used to evaluate the failures. The PBGAs and LCRs were examined with both Sn37Pb and Sn3.0Ag0.5Cu solders. There was no significant difference found in the resulting test data for the behavior of the two solder assembly types in the high cycle fatigue regime. PBGA assemblies with both solders were also evaluated at a higher strain rate, approximately 1/s, using drop testing. There was no discernable difference found between the assemblies as well as no difference in the failure rate of the PBGAs at this higher strain rate. The PWB strain was converted to an equivalent solder stress index using finite element analysis. This equivalent stress index value was used to compare the results from the LCR and BGA testing for Sn37Pb and Sn3.0Ag0.5Cu. Independently generated BGA data that differed with respect to many testing variables was adjusted and incorporated to this comparison. The resulting plot did not show any significant differences between the behaviors of the two solder assemblies under rapid loading outside of the ultra low cycle fatigue regime, where the assemblies with Sn37Pb solder outperformed the assemblies with SnAgCu solder

Multifunctional vertical interconnections of multilayered flexible substrates for miniaturised POCT devices

Point-of-care testing (POCT) is an emerging technology which can lead to an eruptive change of lifestyle and medication of population against the traditional medical laboratory. Since living organisms are intrinsically flexible and malleable, the flexible substrate is a necessity for successful integration of electronics in biological systems that do not cause discomfort during prolonged use. Isotropic conductive adhesives (ICAs) are attractive to wearable POCT devices because ICAs are environmentally friendly and allow a lower processing temperature than soldering which protects heat-sensitive components. Vertical interconnections and optical interconnections are considered as the technologies to realise the miniaturised high-performance devices for the future applications. This thesis focused on the multifunctional integration to enable both electrical and optical vertical interconnections through one via hole that can be fabricated in flexible substrates. The functional properties of the via and their response to the external loadings which are likely encountered in the POCT devices are the primary concerns of this PhD project. In this thesis, the research of curing effect on via performance was first conducted by studying the relationship between curing conditions and material properties. Based on differential scanning calorimetry (DSC) analysis results, two-parameter autocatalytic model (Sestak-Berggren model) was established as the most suitable curing process description of our typical ICA composed of epoxy-based binders and Ag filler particles. A link between curing conditions and the mechanical properties of ICAs was established based on the DMA experiments. A series of test vehicles containing vias filled with ICAs were cured under varying conditions. The electrical resistance of the ICA filled vias were measured before testing and in real time during thermal cycling tests, damp heat tests and bending tests. A simplified model was derived to represent rivet-shaped vias in the flexible printed circuit boards (FPCBs) based on the assumption of homogenous ICAs. An equation was thus proposed to evaluate the resistance of the model. Vias with different cap sizes were also tested, and the equation was validated. Those samples were divided into three groups for thermal cycling test, damp heat ageing test and bending test. Finite element analysis (FEA) was used to aid better understanding of the electrical conduction mechanisms. Based on theoretical equation and simulation model, the fistula-shape ICA via was fabricated in flexible PCB. Its hollow nature provides the space for integrations of optical or fluidic circuits. Resistance measurements and reliability tests proved that carefully designed and manufactured small bores in vias did not comprise the performance. Test vehicles with optoelectrical vias were made through two different approaches to prove the feasibility of multifunctional vertical interconnections in flexible substrates. A case study was carried out on reflection Photoplethysmography (rPPG) sensors manufacturing, using a specially designed optoelectronic system. ICA-based low-temperature manufacture processes were developed to enable the integration of these flexible but delicate substrates and components. In the manufacturing routes, a modified stencil printing setup, which merges two printing-curing steps (vias forming and components bonding) into one step, was developed to save both time and energy. The assembled probes showed the outstanding performance in functional and physiological tests. The results from this thesis are anticipated to facilitate the understanding of ICA via conduction mechanism and provide an applicable tool to optimise the design and manufacturing of optoelectrical vias

Influence of the microstructure on the creep behaviour of Tin-Silver-Copper solder

A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. With today’s solder joint thickness decreasing and increasing working temperatures, among others, the stresses and strains due to temperature changes are growing, leading to limited fatigue life of the products. As fatigue life decreases with increasing plastic strain, creep occurrence should have significant impact, especially during thermal cycles and, thus, should be studied. Through the cooling phase, on the production of PCB assembly’s by the reflow technology, the hoven atmosphere temperature is adjusted in order to control the cooling rate. Narrow criteria is used so as to control the inter-metallic compounds (IMC) thickness, PCB assembly distortion and defects due to thermal shock. The cooling rate also affects solder microstructure, which has direct impact on creep behaviour and, thus, on the soldered joint reliability. In this paper, a dynamic mechanical analyser (DMA) is used to study the influence of the solder cooling rate on its creep behaviour. SAC405 samples with two distinct cooling rates were produced: inside a hoven cooling and by water quenching. Creep tests were made on three-point-bending clamp configuration, isothermally at 25 °C, 50 °C and 75 °C and under three separate levels of stress, 3, 5 and 9 MPa. The results show that creep behaviour has a noticeable cooling rate dependence. It was also noticed that creep propensity is exacerbated by the temperature at which stresses are applied, especially for the slower cooling rates. Creep mechanisms were related to the solder microstructural constituents, namely by the amount of phases ant their morphology.The authors would like to express his acknowledgments for the support given by the Portugal Incentive System for Research and Technological Development. Project in co-promotion This research is sponsored by the Portugal Incentive System for Research and Technological Development. This work is supported by: European Structural and Investment Funds in the FEDER component, through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) [Project nº 002814; Funding Reference: POCI-01-0247-FEDER-002814]. This work was financed by FCT, under the Strategic Project UID/SEM/04077/2013; PEst2015-2020 with the reference UID/CEC/00319/2013 and UID/FIS/04650/2013

AN ANALYTICAL APPROACH FOR FATIGUE LIFE ESTIMATION OF COPPER TRACES FOR DESIGN OPTIMIZATION IN ELECTRONIC ASSEMBLIES

This dissertation investigates the durability of the copper traces using experimental results from a fully reversed four point bend test and finite element analysis. The durability data collected from the experiment was used in conjunction with the finite element based critical trace strain, to develop a set of compatible fatigue model constants that best fit the failure behavior observed in the tests. Experimental studies were also conducted in order to determine the impact of assembly variations on the trace fatigue failures including the presence of a surface finish, solder mask as well as the presence of assembled components. In order to validate the established fatigue life model constants further testing was conducted at a different load level. The model was able to predict the test out come with an error of less than 5 % Parametric studies using finite element analysis were also conducted in order to determine the relationship between the various geometric and loading conditions and the critical trace strain in the copper traces. Based on these relationships as well as the experiments to determine the impact of assembly variations of failure of the traces, an analytical model was developed in order to approximate the copper trace strain which is used as the input to the trace fatigue model. To understand the crack initiation and crack propagation process in copper traces, experiments were conducted where the crack growth was periodically monitored. Based on these experiments, the constants for the fatigue crack propagation in copper traces based on Paris’s Law were also determined in this study. Finally the analytical model for trace strain developed was also validated by comparing the copper trace strain evaluated using finite element modeling for the test vehicle used in the experiments. The strains estimated based on the analytical model match well with the strains based on the finite element modeling

Thermo-mechanical reliability studies of lead-free solder interconnects

N/ASolder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power grid and oil and drilling sectors. Studies have shown that these joints' critical thermal and mechanical loading culminate in accelerated creep, fatigue, and a combination of these joints' induced failures. The ball grid array (BGA) components being an integral part of many electronic modules functioning in mission-critical systems. This study investigates the response of solder joints in BGA to crucial reliability influencing parameters derived from creep, visco-plastic and fatigue damage of the joints. These are the plastic strain, shear strain, plastic shear strain, creep energy density, strain energy density, deformation, equivalent (Von-Mises) stress etc. The parameters' obtained magnitudes are inputted into established life prediction models – Coffin-Manson, Engelmaier, Solomon (Low cycle fatigue) and Syed (Accumulated creep energy density) – to determine several BGA assemblies' fatigue lives. The joints are subjected to thermal, mechanical and random vibration loadings. The finite element analysis (FEA) is employed in a commercial software package to model and simulate the responses of the solder joints of the representative assemblies' finite element models. As the magnitude and rate of degradation of solder joints in the BGA significantly depend on the composition of the solder alloys used to assembly the BGA on the printed circuit board, this research studies the response of various mainstream lead-free Sn-Ag-Cu (SAC) solders (SAC305, SAC387, SAC396 and SAC405) and benchmarked those with lead-based eutectic solder (Sn63Pb37). In the creep response study, the effects of thermal ageing and temperature cycling on these solder alloys' behaviours are explored. The results show superior creep properties for SAC405 and SAC396 lead-free solder alloys. The lead-free SAC405 solder joint is the most effective solder under thermal cycling condition, and the SAC396 solder joint is the most effective solder under isothermal ageing operation. The finding shows that SAC405 and SAC396 solders accumulated the minimum magnitudes of stress, strain rate, deformation rate and strain energy density than any other solder considered in this study. The hysteresis loops show that lead-free SAC405 has the lowest dissipated energy per cycle. Thus the highest fatigue life, followed by eutectic lead-based Sn63Pb37 solder. The solder with the highest dissipated energy per cycle was lead-free SAC305, SAC387 and SAC396 solder alloys. In the thermal fatigue life prediction research, four different lead-free (SAC305, SAC387, SAC396 and SAC405) and one eutectic lead-based (Sn63Pb37) solder alloys are defined against their thermal fatigue lives (TFLs) to predict their mean-time-to-failure for preventive maintenance advice. Five finite elements (FE) models of the assemblies of the BGAs with the different solder alloy compositions and properties are created with SolidWorks. The models are subjected to standard IEC 60749-25 temperature cycling in ANSYS 19.0 mechanical package environment. SAC405 joints have the highest predicted TFL of circa 13.2 years, while SAC387 joints have the least life of circa 1.4 years. The predicted lives are inversely proportional to the magnitude of the areas of stress-strain hysteresis loops of the solder joints. The prediction models are significantly consistent in predicted magnitudes across the solder joints irrespective of the damage parameters used. Several failure modes drive solder joints and damage mechanics from the research and understand an essential variation in the models' predicted values. This investigation presents a method of managing preventive maintenance time of BGA electronic components in mission-critical systems. It recommends developing a novel life prediction model based on a combination of the damage parameters for enhanced prediction. The FEA random vibration simulation test results showed that different solder alloys have a comparable performance during random vibration testing. The fatigue life result shows that SAC405 and SAC396 have the highest fatigue lives before being prone to failure. As a result of the FEA simulation outcomes with the application of Coffin-Manson's empirical formula, the author can predict the fatigue life of solder joint alloys to a higher degree of accuracy of average ~93% in an actual service environment such as the one experienced under-the-hood of an automobile and aerospace. Therefore, it is concluded that the combination of FEA simulation and empirical formulas employed in this study could be used in the computation and prediction of the fatigue life of solder joint alloys when subjected to random vibration. Based on the thermal and mechanical responses of lead-free SAC405 and SAC396 solder alloys, they are recommended as a suitable replacement of lead-based eutectic Sn63Pb37 solder alloy for improved device thermo-mechanical operations when subjected to random vibration (non-deterministic vibration). The FEA simulation studies' outcomes are validated using experimental and analytical-based reviews in published and peer-reviewed literature.N/

A NON-LINEAR DAMAGE MODEL WITH LOAD DEPENDENT EXPONENTS FOR SOLDERS UNDER SEQUENTIAL CYCLIC SHEAR LOADS

The damage state of a material subject to cyclic loads is often characterized by the cycle ratio of applied cycles to the number of survivable cycles. The damage in a material under sequential cyclic loading is widely estimated using Miner’s rule. Miner’s rule assumes that damage in a material accumulates linearly under cyclic loading and the damage path is independent of the applied load level. Due to these inherent assumptions, Miner’s rule inaccurately estimates life under sequential loading conditions for solders. To improve the accuracy of damage estimation, a non-linear damage accumulation model based on damage curve approach that takes into account the effect of loading sequence under sequential loading conditions is proposed for solders in this dissertation. In the proposed non-linear damage model, damage is related to the cycle ratio using a power law relationship where the power law (damage) exponent is defined as a function of the applied load level (cycles to failure). An experimental approach is proposed to determine the load dependent exponents of the non-linear model under three load levels. The test matrix consisted of a series of single level cyclic and sequential cyclic shear tests in a thermo-mechanical micro analyzer. Load dependent exponents were developed for SAC305 (96.5%Sn+3.0%Ag+0.5Cu) solder material and the applicability of these exponents were validated by tests under a new loading condition and reverse loading sequence. Experimental results revealed that the value of damage exponent decreased with the severity of the applied load level. Additionally, taking damage analogous to crack growth, an analytical relationship between the damage exponent and the applied load level was developed from the Paris’ law for crack propagation. This enables determination of non-linear damage curves at different load levels without conducting extensive experimentation. The damage due to crack initiation was assumed to be 10% of the total damage and sensitivity analysis was carried out to determine the effect of this assumption. The load dependence of the Paris’ law exponent (m) was also derived for SAC305 solder material. Analysis of the failed specimens revealed fatigue crack in the solder joints along the tin grain boundaries

HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER JOINT

ABSTRACT Title of Dissertation: HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER INTERCONNECTS Yuxun Zhou, Doctor of Philosophy, 2008 Dissertation directed by: Professor Abhijit Dasgupta Department of Mechanical Engineering Vibration loading is commonly encountered during the service life of electronic products. However, compared to thermal cycling durability, vibration durability is more complex and has been less investigated. In surface mount technology, solder joints are the primary mechanical, thermal and electrical interconnects between the component and the PWB. So the reliability of solder joints is very crucial for most electronic assemblies. The vibration durability of Pb-free solder joints is the focus of this dissertation. The characteristics of the stress from vibration loading are low amplitude and high frequency, while those from cyclic thermal loading are high amplitude and low frequency. In this study, several exploratory vibration tests were conducted, using both narrow band and broad-band, step-stress excitation at several different isothermal and thermal cycling conditions. The effect of thermal pre-aging on solder joint vibration failures was also investigated. Some of the vibration durability results were analyzed in detail, to obtain quantitative insights into the vibration fatigue behavior of the SAC305 solder material. A time-domain approach was adopted to investigate the durability of solder interconnects under different kinds of vibration and quasi-static mechanical loading. First, the solder interconnects were subjected to narrow-band (harmonic) vibration loading. The test were conducted at the first natural frequency of the test board using constant-amplitude excitation and solder fatigue properties were extracted with the help of a time-domain analysis that is based on quasi-static finite element simulation. Compared to broad-band step-stress vibration durability tests, the advantage of the harmonic constant-amplitude test is less complexity in the model extraction process, hence, less uncertainty in the desired fatigue constants. Generalized strain-based S-N curves have been obtained for both SAC305 and Sn37Pb solder materials. The strain-life model constants show that SAC305 solder material has superior fatigue properties compared to Sn37Pb solder material under low-cycle fatigue loading, while the reverse is true for high-cycle fatigue loading. These results are consistent with test results from other researchers. In actual application, SAC305 assemblies almost always fail before Sn37Pb assemblies under comparable vibration excitation because of (i) higher solder strain at a given excitation level; and (ii) multiple failure modes such as copper trace cracking. Next, durability was investigated under step-stress, broad-band (random) excitation. These test results show that SAC305 interconnects are less durable than Sn37Pb interconnects under the random excitation used in this study, which agrees with the harmonic durability results. The random and harmonic durability results were quantitatively compared with each other in this study. Finite element simulation was used to investigate the stress-strain response in the interconnects. The output of this simulation is the strain transfer function due to the first flexural mode of the PWB. This transfer function is used to obtain the solder strain from the measured board strain. This fatigue assessment method demonstrated that the model constants obtained from the harmonic test overestimate the fatigue life under random excitation by an order of magnitude. The causes for this discrepancy were systematically explored in this study. The effects of cyclic loading and mean stress on the vibration durability were addressed and found to be minimal in this study. The stress-strain curves assumed for the solder material were found to have a very large effect on the durability constants, thus affecting the agreement between harmonic and random durability results. The transient response of the components on the test board under both harmonic and random excitation was also included in the strain transfer function with the help of dynamic implicit simulation, and found to have a much stronger effect on the vibration durability at the high frequencies used in broad-band excitation compared to the low frequency used in narrow-band test. Furthermore, the higher PWB vibration modes may play a strong role and may need to be included in the strain transfer-function. This study clearly reveals that the solder strain analysis for broad-band random excitation cannot be limited to the quasi-static strain transfer-function based on the first PWB flexural mode, that has been used in some earlier studies in the literature. The time-domain approach used in this study provided fundamental and comprehensive insights into the key factors that affect vibration durability under different types of excitation, thus leading to a generalized S-N modeling approach that works for both harmonic and random vibration loading

A THERMOMECHANICAL FATIGUE LIFE PREDICTION METHODOLOGY FOR BALL GRID ARRAY COMPONENTS WITH REWORKABLE UNDERFILL

Underfill materials were originally developed to improve the thermo-mechanical reliability of flip-chip devices due to the large coefficient of thermal expansion (CTE) mismatch between the silicon die and substrate. More recently, underfill materials, specifically reworkable underfills, have been used to improve reliability of second level interconnects in ball grid array (BGA) packages in harsh end-use environments such as automotive, military and aerospace. In these environments, electronic components are exposed to mechanical shock, vibration, and large fluctuations in temperatures. Although reworkable underfills improve the reliability of BGA components under mechanical shock and vibration, some reworkable underfills have been shown to reduce reliability during thermal cycling environments. Consequently, this research employs experimental and numerical approaches to investigate the impact of reworkable underfill materials on thermomechanical fatigue life of solder joints in BGA packages. In the first section of the analysis, material characterization of a reworkable underfill is performed to determine appropriate material models for reworkable underfills. In the second analysis section, a variety of underfill materials with different properties are exposed to harsh and benign thermal cycles to determine the stress state responsible for reducing fatigue life of solder joints in BGA packages. In the final analysis section, simulations are performed on the BGAs with reworkable underfill to develop a fatigue life predication methodology that implements a modified mode separation scheme. The model developed in this work provides a working fatigue life approach for BGA packages with reworkable underfills exposed to thermal loading. The results of this study can be utilized by the automotive, military, and aerospace industries to optimize underfill material selection process and provide reliability assessment of BGA components in real world environments

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact