Communication costs in a multi-tiered MPSoC

The amount of digital processing required for phased array beamformers is very large. It requires many parallel processors, which can be organized in a multi-tiered structure. Communication costs differ for each of the stages in such an architecture. For example, communication costs from the antenna front-end to the first processing stages is costly because of the amount of connections and data rate. Furthermore there is a trade-off between sequential processing exploiting locality of reference versus exploiting parallelism but adding communication costs. Thus, the optimal architecture depends on the importance that is given to the different measures.\ud \ud A model is presented to determine the partitioning of a (beamforming) system based on communication costs. It is shown that different solutions can be explored based on the cost model and the incorporated quantitative and qualitative measures. Determining the importance of each measure is subjective to the situation and application. In this work a simple beamforming application is used optimised for energy efficiency

Self-Evaluation Applied Mathematics 2003-2008 University of Twente

This report contains the self-study for the research assessment of the Department of Applied Mathematics (AM) of the Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) at the University of Twente (UT). The report provides the information for the Research Assessment Committee for Applied Mathematics, dealing with mathematical sciences at the three universities of technology in the Netherlands. It describes the state of affairs pertaining to the period 1 January 2003 to 31 December 2008

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Center for Space Microelectronics Technology 1988-1989 technical report

The 1988 to 1989 Technical Report of the JPL Center for Space Microelectronics Technology summarizes the technical accomplishments, publications, presentations, and patents of the center. Listed are 321 publications, 282 presentations, and 140 new technology reports and patents

Understanding Quantum Technologies 2022

Understanding Quantum Technologies 2022 is a creative-commons ebook that provides a unique 360 degrees overview of quantum technologies from science and technology to geopolitical and societal issues. It covers quantum physics history, quantum physics 101, gate-based quantum computing, quantum computing engineering (including quantum error corrections and quantum computing energetics), quantum computing hardware (all qubit types, including quantum annealing and quantum simulation paradigms, history, science, research, implementation and vendors), quantum enabling technologies (cryogenics, control electronics, photonics, components fabs, raw materials), quantum computing algorithms, software development tools and use cases, unconventional computing (potential alternatives to quantum and classical computing), quantum telecommunications and cryptography, quantum sensing, quantum technologies around the world, quantum technologies societal impact and even quantum fake sciences. The main audience are computer science engineers, developers and IT specialists as well as quantum scientists and students who want to acquire a global view of how quantum technologies work, and particularly quantum computing. This version is an extensive update to the 2021 edition published in October 2021.Comment: 1132 pages, 920 figures, Letter forma

An overview of decision table literature.

The present report contains an overview of the literature on decision tables since its origin. The goal is to analyze the dissemination of decision tables in different areas of knowledge, countries and languages, especially showing these that present the most interest on decision table use. In the first part a description of the scope of the overview is given. Next, the classification results by topic are explained. An abstract and some keywords are included for each reference, normally provided by the authors. In some cases own comments are added. The purpose of these comments is to show where, how and why decision tables are used. Other examined topics are the theoretical or practical feature of each document, as well as its origin country and language. Finally, the main body of the paper consists of the ordered list of publications with abstract, classification and comments.

Simulating schlieren and shadowgraph images from LES data

Geometrical optics ray-tracing is used to derive schlieren and shadowgraph images from large-eddy simulation (LES) data of a jet in supersonic crossflow and to compare with experimental data. Including the components of the optical system that forms the image in the simulation is found to be important. The technique produces images that replicate flow physics more faithfully than straight-line path integration and other techniques, and more efficiently than physical-optics techniques. Applications of these simulated images are demonstrated in supersonic flows. Time-correlated pairs of shadowgraph images taken from the LES using this technique are used in conjunction with an image-correlation velocimetry technique to compare the estimated convection velocity field in the LES to that of experiments of the same flow. Agreement between the two is good with a maximum variance of 5% by some metrics. This technique can aid in the validation of LES results, allowing quantitative comparison between experiment and simulation, and to extract information unattainable by experiment alone. Comparisons of simulated and experimental jet penetration into the supersonic freestream are also made