Packaging technology enabling flexible optical interconnections

This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure

Devices Having Compliant Wafer-level Input/output Interconnections And Packages Using Pillars And Methods Of Fabrication Thereof

Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed of a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.Georgia Tech Research Corporatio

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

New broadband applications are causing the datacenters to proliferate, raising the bar for higher interconnection speeds. So far, optical board-to-board and rack-to-rack interconnects relied primarily on low-cost commodity optical components assembled in a single package. Although this concept proved successful in the first generations of optical-interconnect modules, scalability is a daunting issue as signaling rates extend beyond 25 Gb/s. In this paper we present our work towards the development of two technology platforms for migration beyond Infiniband enhanced data rate (EDR), introducing new concepts in board-to-board and rack-to-rack interconnects. The first platform is developed in the framework of MIRAGE European project and relies on proven VCSEL technology, exploiting the inherent cost, yield, reliability and power consumption advantages of VCSELs. Wavelength multiplexing, PAM-4 modulation and multi-core fiber (MCF) multiplexing are introduced by combining VCSELs with integrated Si and glass photonics as well as BiCMOS electronics. An in-plane MCF-to-SOI interface is demonstrated, allowing coupling from the MCF cores to 340x400 nm Si waveguides. Development of a low-power VCSEL driver with integrated feed-forward equalizer is reported, allowing PAM-4 modulation of a bandwidth-limited VCSEL beyond 25 Gbaud. The second platform, developed within the frames of the European project PHOXTROT, considers the use of modulation formats of increased complexity in the context of optical interconnects. Powered by the evolution of DSP technology and towards an integration path between inter and intra datacenter traffic, this platform investigates optical interconnection system concepts capable to support 16QAM 40GBd data traffic, exploiting the advancements of silicon and polymer technologies

FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems. The resulting performance bottleneck can be substantially reduced by conveying high-speed data optically instead of electronically. A novel active pluggable 82.5 Gb/s aggregate bit rate optical connector technology, the design and fabrication of a compact electro-optical printed circuit board to meet exacting specifications, and a method for low cost, high precision, passive optical assembly are presented. A demonstration platform was constructed to assess the viability of embedded electro-optical midplane technology in such systems including the first ever demonstration of a pluggable active optical waveguide printed circuit board connector. High-speed optical data transfer at 10.3125 Gb/s was demonstrated through a complex polymer waveguide interconnect layer embedded into a 262 mm × 240 mm × 4.3 mm electro-optical midplane. Bit error rates of less than 10-12 and optical losses as low as 6 dB were demonstrated through nine multimode polymer wave guides with an aggregate data bandwidth of 92.8125 Gb/s

Integration of optical interconnections and optoelectronic components in flexible substrates

Licht als informatiedrager voor datacommunicatie kende een ongezien succes in de laatste decennia. Wegens de lage verliezen en hoge datasnelheden hebben ze voor het overbruggen van lange afstanden hun elektrische tegenhangers reeds geruime tijd verdrongen. Deze trend zet zich ook voort voor korte afstand communicatie op printplaten. Naast zijn functie als informatiedrager, wordt licht ook gebruikt om een waaier aan fysische grootheden te meten. Ook hier heeft licht enkele significante voordelen t.o.v elektrische informatiedragers, waardoor optische sensoren wijdverspreid zijn. Een tweede duidelijke trend binnen de elektronica is het gebruik van flexibele printkaarten. Deze zijn veel dunner, lichter en betrouwbaarder dan de klassieke harde printkaarten, waardoor ze uiterst geschikt zijn voor draagbare toepassingen waar compactheid en een laag gewicht hoge vereisten zijn. De flexibiliteit van de printplaten laat ook toe hen te gebruiken op onvlakke oppervlakken en op bewegende onderdelen. Het doel van het gepresenteerde doctoraatswerk is de ontwikkeling van een nieuw technologieplatform dat bovengenoemde trends combineert. Alle bouwblokken van optische communicatie, gaande van actieve opto-elektronische componenten, aanstuurelektronica, golfgeleiderbaantjes en galvanische verbindingen tot optische koppelstructuren tussen de verschillende bouwblokken, worden zodanig gerealiseerd dat elke component flexibel is en geïntegreerd wordt in een dunne folie met een dikte van slechts 150µm. Op die manier bekomen we een flexibele folie met alle passieve en actieve onderdelen voor optische communicatie geïntegreerd met enkel een elektrische interface naar de buitenwereld, wat de aanvaarding en toepassing van deze technologie in de huidige elektronica aanzienlijk kan versnellen. Binnen het doctoraatswerk werden alle voorgestelde technologieën en processen gerealiseerd en geoptimaliseerd. Bovendien werden de optische verliezen, warmteaspecten, hoogfrequent gedrag, mechanisch gedrag en betrouwbaarheid van de technologie gekarakteriseerd en vergeleken met de huidige state-of-the-art

High-Speed Data Transmission Over Flexible Multimode Polymer Waveguides Under Flexure

Polymer multimode waveguides on flexible substrates enable the formation of bendable low-cost optical interconnects that can be deployed in a wide range of applications. However, the highly-multimoded nature of such guides in combination with the stress and mode mixing induced due to sample bending raise important concerns about the effect that sample flexure has on their bandwidth performance and potential to support high-speed data transmission. In this work therefore, we present data transmission studies on a 1 m long flexible spiral waveguide when flexure is applied. The flexible polymer sample is bent 180° around a cylindrical mandrel and the loss and frequency response of the waveguide are obtained for radii of curvature down to 4 mm and are compared with the performance obtained when no flexure is applied. The BER performance of the respective optical link is also recorded at data rates up to 40 Gb/s. A flat frequency response up to at least 30 GHz is demonstrated for all bending radii applied and error-free (BER<10-12) data transmission is achieved for all data rates studied up to 40 Gb/s. The results clearly demonstrate that sample flexing does not result in any significant transmission impairments in such links and highlight the strong potential of this technology for use in high-speed board-level interconnections.CAPE OIC Future project, CAPE LEASA Projec

Bend- and Twist-Insensitive Flexible Multimode Polymer Optical Interconnects

Polymer multimode optical waveguides can enable high-speed short-reach optical interconnection at low cost within high performance electronic systems. The formation of such waveguides on flexible substrates can offer important additional advantages such as light weight, ability to be tightly bent, and reconfigurability which are particularly important in environments where space, weight, and shape conformity are critical, for instance in vehicles and aircraft. The ability of such flexible optical interconnects to be tightly bent and twisted with low excess loss is crucial in enabling their use in systems with limited space and with movable parts. As a result, in this work, we present a new design of such flexible polymer multimode waveguides that achieves improved bending loss performance over the conventional waveguide design. It is experimentally shown that the proposed design achieves a very low excess loss of 0.5 dB for a 3 mm radius bend under a 50 µm MMF launch. In comparison, flexible waveguides with the conventional design exhibit a 2 dB excess loss under the same launch and bend conditions. Additionally, useful rules that associate the twisting loss performance of flexible polymer waveguide samples with their geometric characteristics are derived. It is shown that negligible twisting losses (<0.1 dB for a 50 µm MMF input) can be achieved when the dimensions of the waveguide samples are appropriately selected. The results demonstrate the strong potential of such bend- and twist-insensitive flexible polymer waveguides for use in next-generation vehicles and aircraft