Ultrafast all-optical signal processing how and why?

Demand for fast and secure high capacity networks is growing. Currently offered solutions are hampered by the reappearance of electronic bottleneck. It is believed that to fully utilize transmission bandwidth of optical networks ultrafast all-optical signal processing may need to by implemented. Such approaches will be discussed

Energy challenges for ICT

The energy consumption from the expanding use of information and communications technology (ICT) is unsustainable with present drivers, and it will impact heavily on the future climate change. However, ICT devices have the potential to contribute signi - cantly to the reduction of CO2 emission and enhance resource e ciency in other sectors, e.g., transportation (through intelligent transportation and advanced driver assistance systems and self-driving vehicles), heating (through smart building control), and manu- facturing (through digital automation based on smart autonomous sensors). To address the energy sustainability of ICT and capture the full potential of ICT in resource e - ciency, a multidisciplinary ICT-energy community needs to be brought together cover- ing devices, microarchitectures, ultra large-scale integration (ULSI), high-performance computing (HPC), energy harvesting, energy storage, system design, embedded sys- tems, e cient electronics, static analysis, and computation. In this chapter, we introduce challenges and opportunities in this emerging eld and a common framework to strive towards energy-sustainable ICT

Understanding the thermal implications of multicore architectures

Multicore architectures are becoming the main design paradigm for current and future processors. The main reason is that multicore designs provide an effective way of overcoming instruction-level parallelism (ILP) limitations by exploiting thread-level parallelism (TLP). In addition, it is a power and complexity-effective way of taking advantage of the huge number of transistors that can be integrated on a chip. On the other hand, today's higher than ever power densities have made temperature one of the main limitations of microprocessor evolution. Thermal management in multicore architectures is a fairly new area. Some works have addressed dynamic thermal management in bi/quad-core architectures. This work provides insight and explores different alternatives for thermal management in multicore architectures with 16 cores. Schemes employing both energy reduction and activity migration are explored and improvements for thread migration schemes are proposed.Peer ReviewedPostprint (published version

Technology infrastructure in information technology industries

Abstract not availableeconomics of technology business administration and economics

The "MIND" Scalable PIM Architecture

MIND (Memory, Intelligence, and Network Device) is an advanced parallel computer architecture for high performance computing and scalable embedded processing. It is a Processor-in-Memory (PIM) architecture integrating both DRAM bit cells and CMOS logic devices on the same silicon die. MIND is multicore with multiple memory/processor nodes on each chip and supports global shared memory across systems of MIND components. MIND is distinguished from other PIM architectures in that it incorporates mechanisms for efficient support of a global parallel execution model based on the semantics of message-driven multithreaded split-transaction processing. MIND is designed to operate either in conjunction with other conventional microprocessors or in standalone arrays of like devices. It also incorporates mechanisms for fault tolerance, real time execution, and active power management. This paper describes the major elements and operational methods of the MIND architecture

Two- and Three-dimensional High Performance, Patterned Overlay Multi-chip Module Technology

A two- and three-dimensional multi-chip module technology was developed in response to the continuum in demand for increased performance in electronic systems, as well as the desire to reduce the size, weight, and power of space systems. Though developed to satisfy the needs of military programs, such as the Strategic Defense Initiative Organization, the technology, referred to as High Density Interconnect, can also be advantageously exploited for a wide variety of commercial applications, ranging from computer workstations to instrumentation and microwave telecommunications. The robustness of the technology, as well as its high performance, make this generality in application possible. More encouraging is the possibility of this technology for achieving low cost through high volume usage